TW428875U - Multi-chip IC packaging structure - Google Patents

Multi-chip IC packaging structure

Info

Publication number
TW428875U
TW428875U TW88210114U TW88210114U TW428875U TW 428875 U TW428875 U TW 428875U TW 88210114 U TW88210114 U TW 88210114U TW 88210114 U TW88210114 U TW 88210114U TW 428875 U TW428875 U TW 428875U
Authority
TW
Taiwan
Prior art keywords
chip
packaging structure
packaging
Prior art date
Application number
TW88210114U
Other languages
Chinese (zh)
Inventor
Geng-Shin Shen
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88210114U priority Critical patent/TW428875U/en
Publication of TW428875U publication Critical patent/TW428875U/en

Links

TW88210114U 1999-06-16 1999-06-16 Multi-chip IC packaging structure TW428875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88210114U TW428875U (en) 1999-06-16 1999-06-16 Multi-chip IC packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88210114U TW428875U (en) 1999-06-16 1999-06-16 Multi-chip IC packaging structure

Publications (1)

Publication Number Publication Date
TW428875U true TW428875U (en) 2001-04-01

Family

ID=21649738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88210114U TW428875U (en) 1999-06-16 1999-06-16 Multi-chip IC packaging structure

Country Status (1)

Country Link
TW (1) TW428875U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111668104A (en) * 2019-03-07 2020-09-15 无锡华润安盛科技有限公司 Chip packaging structure and chip packaging method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111668104A (en) * 2019-03-07 2020-09-15 无锡华润安盛科技有限公司 Chip packaging structure and chip packaging method

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees