TW428875U - Multi-chip IC packaging structure - Google Patents
Multi-chip IC packaging structureInfo
- Publication number
- TW428875U TW428875U TW88210114U TW88210114U TW428875U TW 428875 U TW428875 U TW 428875U TW 88210114 U TW88210114 U TW 88210114U TW 88210114 U TW88210114 U TW 88210114U TW 428875 U TW428875 U TW 428875U
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- packaging structure
- packaging
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88210114U TW428875U (en) | 1999-06-16 | 1999-06-16 | Multi-chip IC packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88210114U TW428875U (en) | 1999-06-16 | 1999-06-16 | Multi-chip IC packaging structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW428875U true TW428875U (en) | 2001-04-01 |
Family
ID=21649738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88210114U TW428875U (en) | 1999-06-16 | 1999-06-16 | Multi-chip IC packaging structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW428875U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668104A (en) * | 2019-03-07 | 2020-09-15 | 无锡华润安盛科技有限公司 | Chip packaging structure and chip packaging method |
-
1999
- 1999-06-16 TW TW88210114U patent/TW428875U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111668104A (en) * | 2019-03-07 | 2020-09-15 | 无锡华润安盛科技有限公司 | Chip packaging structure and chip packaging method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MM4K | Annulment or lapse of a utility model due to non-payment of fees |