DE69332840D1 - Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung - Google Patents

Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung

Info

Publication number
DE69332840D1
DE69332840D1 DE69332840T DE69332840T DE69332840D1 DE 69332840 D1 DE69332840 D1 DE 69332840D1 DE 69332840 T DE69332840 T DE 69332840T DE 69332840 T DE69332840 T DE 69332840T DE 69332840 D1 DE69332840 D1 DE 69332840D1
Authority
DE
Germany
Prior art keywords
heat
cooling
application
producing component
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69332840T
Other languages
English (en)
Other versions
DE69332840T9 (de
DE69332840T2 (de
Inventor
Tadashi Katsui
Katsuhiko Nakata
Takeshi Koga
Tadanobu Matsumura
Yoshimi Tanaka
Yasuaki Sugimoto
Takayuki Horinishi
Takashi Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
PFU Ltd
Original Assignee
Fujitsu Ltd
PFU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, PFU Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69332840D1 publication Critical patent/DE69332840D1/de
Publication of DE69332840T2 publication Critical patent/DE69332840T2/de
Publication of DE69332840T9 publication Critical patent/DE69332840T9/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69332840T 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung Active DE69332840T9 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP13725492 1992-05-28
JP13725492 1992-05-28
JP23023392 1992-08-28
JP23023392 1992-08-28
JP525693 1993-01-14
JP525693 1993-01-14
JP5038934A JP3069819B2 (ja) 1992-05-28 1993-02-26 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
JP3893493 1993-02-26

Publications (3)

Publication Number Publication Date
DE69332840D1 true DE69332840D1 (de) 2003-05-08
DE69332840T2 DE69332840T2 (de) 2003-11-06
DE69332840T9 DE69332840T9 (de) 2004-09-09

Family

ID=27454263

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69330481T Expired - Lifetime DE69330481T2 (de) 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung
DE69332840T Active DE69332840T9 (de) 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung
DE69332842T Expired - Lifetime DE69332842T2 (de) 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69330481T Expired - Lifetime DE69330481T2 (de) 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69332842T Expired - Lifetime DE69332842T2 (de) 1992-05-28 1993-05-28 Wärmesenke zur Kühlung eines Wärme produzierenden Bauteils und Anwendung

Country Status (5)

Country Link
US (4) US5504650A (de)
EP (3) EP0572326B1 (de)
JP (1) JP3069819B2 (de)
KR (1) KR0168462B1 (de)
DE (3) DE69330481T2 (de)

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KR0168462B1 (ko) 1999-04-15
DE69330481T2 (de) 2002-03-28
EP0572326A3 (en) 1995-09-06
EP0572326A2 (de) 1993-12-01
DE69332842T2 (de) 2004-01-22
JPH06268125A (ja) 1994-09-22
DE69332842D1 (de) 2003-05-08
US6067227A (en) 2000-05-23
KR940006439A (ko) 1994-03-23
EP0939442A3 (de) 1999-10-20
DE69332840T9 (de) 2004-09-09
EP0939442B1 (de) 2003-04-02
DE69332840T2 (de) 2003-11-06
EP0572326B1 (de) 2001-07-25
EP0939443A2 (de) 1999-09-01
DE69330481D1 (de) 2001-08-30
US5650912A (en) 1997-07-22
JP3069819B2 (ja) 2000-07-24
US5504650A (en) 1996-04-02
EP0939443B1 (de) 2003-04-02
US5940267A (en) 1999-08-17
EP0939443A3 (de) 1999-10-20
EP0939442A2 (de) 1999-09-01

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