FR2730894B3 - Procede de fabrication d'une carte electronique a refroidissement par conduction thermique - Google Patents

Procede de fabrication d'une carte electronique a refroidissement par conduction thermique

Info

Publication number
FR2730894B3
FR2730894B3 FR9501972A FR9501972A FR2730894B3 FR 2730894 B3 FR2730894 B3 FR 2730894B3 FR 9501972 A FR9501972 A FR 9501972A FR 9501972 A FR9501972 A FR 9501972A FR 2730894 B3 FR2730894 B3 FR 2730894B3
Authority
FR
France
Prior art keywords
manufacturing
electronic card
thermal conduction
conduction
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9501972A
Other languages
English (en)
Other versions
FR2730894A1 (fr
Inventor
Vito Suppa
Joel Begnis
Jean Claude Aldon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR9501972A priority Critical patent/FR2730894B3/fr
Priority to US08/894,233 priority patent/US6035524A/en
Priority to PCT/FR1996/000150 priority patent/WO1996026631A1/fr
Priority to EP96902303A priority patent/EP0811309A1/fr
Priority to CA002212943A priority patent/CA2212943A1/fr
Publication of FR2730894A1 publication Critical patent/FR2730894A1/fr
Application granted granted Critical
Publication of FR2730894B3 publication Critical patent/FR2730894B3/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/42—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine
    • G05B19/4202—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine preparation of the programme medium using a drawing, a model
    • G05B19/4207—Recording and playback systems, i.e. in which the programme is recorded from a cycle of operations, e.g. the cycle of operations being manually controlled, after which this record is played back on the same machine preparation of the programme medium using a drawing, a model in which a model is traced or scanned and corresponding data recorded
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49347—Machine cover, first scan surface on which cover is to be placed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9501972A 1995-02-21 1995-02-21 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique Expired - Lifetime FR2730894B3 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR9501972A FR2730894B3 (fr) 1995-02-21 1995-02-21 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique
US08/894,233 US6035524A (en) 1995-02-21 1996-01-30 Method for fabricating an electronics board with thermal-conduction cooling
PCT/FR1996/000150 WO1996026631A1 (fr) 1995-02-21 1996-01-30 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique
EP96902303A EP0811309A1 (fr) 1995-02-21 1996-01-30 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique
CA002212943A CA2212943A1 (fr) 1995-02-21 1996-01-30 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9501972A FR2730894B3 (fr) 1995-02-21 1995-02-21 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique

Publications (2)

Publication Number Publication Date
FR2730894A1 FR2730894A1 (fr) 1996-08-23
FR2730894B3 true FR2730894B3 (fr) 1997-03-14

Family

ID=9476346

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9501972A Expired - Lifetime FR2730894B3 (fr) 1995-02-21 1995-02-21 Procede de fabrication d'une carte electronique a refroidissement par conduction thermique

Country Status (5)

Country Link
US (1) US6035524A (fr)
EP (1) EP0811309A1 (fr)
CA (1) CA2212943A1 (fr)
FR (1) FR2730894B3 (fr)
WO (1) WO1996026631A1 (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6139975A (en) * 1997-06-12 2000-10-31 Hitachi Powered Metals Co., Ltd. Sheet metal member, method of manufacturing same, and heat radiation plate
FR2776161B1 (fr) 1998-03-10 2000-05-26 Thomson Marconi Sonar Sas Antenne d'emission acoustique annulaire demontable
FR2809580B1 (fr) 2000-05-26 2002-08-30 Thomson Marconi Sonar Sas Transducteur electrodynamique pour acoustique sous-marine
US6868217B1 (en) * 2000-07-31 2005-03-15 Cisco Technology, Inc. Long reach unamplified optical SONET/SDH card
FR2832023B1 (fr) * 2001-11-02 2004-02-20 Valeo Climatisation Module de commande de groupe moto-ventilateur
US6751096B2 (en) 2002-08-16 2004-06-15 901D Llc Modular electronic housing
JP2004335865A (ja) * 2003-05-09 2004-11-25 Murata Mfg Co Ltd 電子部品の製造方法および電子部品
SE529673C2 (sv) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Kretsarrangemang för kylning av ytmonterade halvledare
US7310233B2 (en) * 2005-01-28 2007-12-18 Tyco Electronics Power Systems Apparatus and method for transferring heat from an electrical module
DE102005034546A1 (de) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Baugruppe mit Kühlvorrichtung
US20070177356A1 (en) * 2006-02-01 2007-08-02 Jeffrey Panek Three-dimensional cold plate and method of manufacturing same
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
US20090103267A1 (en) * 2007-10-17 2009-04-23 Andrew Dean Wieland Electronic assembly and method for making the electronic assembly
JP5071558B2 (ja) * 2008-12-12 2012-11-14 株式会社村田製作所 回路モジュール
DE112008004257T5 (de) * 2008-12-29 2013-05-29 Hewlett-Packard Development Company, L.P. Systeme und verfahren einer trägervorrichtung zur platzierung vonthermisohen schnittstellen-materialien
US8879263B2 (en) * 2009-08-17 2014-11-04 Seagate Technology Llc Conducting heat away from a printed circuit board assembly in an enclosure
JP2011044570A (ja) * 2009-08-20 2011-03-03 Renesas Electronics Corp 放熱板、半導体装置、および放熱板の製造方法
DE102010036910A1 (de) 2010-08-08 2012-02-09 Ssb Wind Systems Gmbh & Co. Kg Elektrische Vorrichtung
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
DE102013206999A1 (de) * 2013-04-18 2014-10-23 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug mit wärmeleitender Gehäusewand
US9801277B1 (en) 2013-08-27 2017-10-24 Flextronics Ap, Llc Bellows interconnect
US9576930B2 (en) * 2013-11-08 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Thermally conductive structure for heat dissipation in semiconductor packages
JP6269094B2 (ja) * 2014-01-20 2018-01-31 Tdk株式会社 電源装置
US11191186B2 (en) * 2014-06-24 2021-11-30 David Lane Smith System and method for fluid cooling of electronic devices installed in an enclosure
US10712398B1 (en) 2016-06-21 2020-07-14 Multek Technologies Limited Measuring complex PCB-based interconnects in a production environment
US10757800B1 (en) 2017-06-22 2020-08-25 Flex Ltd. Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
US11039531B1 (en) 2018-02-05 2021-06-15 Flex Ltd. System and method for in-molded electronic unit using stretchable substrates to create deep drawn cavities and features
US20190357386A1 (en) * 2018-05-16 2019-11-21 GM Global Technology Operations LLC Vascular polymeric assembly
US11224117B1 (en) 2018-07-05 2022-01-11 Flex Ltd. Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
US10568215B1 (en) * 2019-05-20 2020-02-18 Flex Ltd. PCBA encapsulation by thermoforming
US11357130B2 (en) * 2020-06-29 2022-06-07 Microsoft Technology Licensing, Llc Scalable thermal ride-through for immersion-cooled server systems
GB2611028A (en) * 2021-09-17 2023-03-29 Aptiv Tech Ltd A method of fitting a cooling device to a circuit board and a circuit board cooling device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US4768286A (en) * 1986-10-01 1988-09-06 Eastman Christensen Co. Printed circuit packaging for high vibration and temperature environments
IT212380Z2 (it) * 1987-10-26 1989-07-04 Advanced Data Processing Macchina per il rilevamento e la matematizzazione della superficie di modelli tridimensionali partico larmente per la costruzione di stampi con macchine utensili a controllo numerico
FR2650146A1 (fr) * 1989-07-18 1991-01-25 Thomson Csf Carte electronique a refroidissement par conduction thermique, compatible au format double europe, et bac a cartes destine a recevoir de telles cartes
FR2654890B1 (fr) * 1989-11-17 1996-08-02 Matra Sep Imagerie Inf Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.
US5198651A (en) * 1991-05-03 1993-03-30 Symbol Technologies, Inc. Laser diode device incorporating structure with integral scanning motor
AU657774B2 (en) * 1991-08-08 1995-03-23 Sumitomo Electric Industries, Ltd. Semiconductor chip module and method for manufacturing the same
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5218516A (en) * 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
FR2691604B1 (fr) * 1992-05-19 2002-03-01 Thomson Csf Carte électronique à refroidissement par conduction thermique et son procédé de réalisation.
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5844249A (en) * 1993-12-24 1998-12-01 Hoechst Aktiengesellschaft Apparatus for detecting defects of wires on a wiring board wherein optical sensor includes a film of polymer non-linear optical material
US5552992A (en) * 1994-11-01 1996-09-03 Larry J. Winget Method and system for reproduction of an article from a physical model

Also Published As

Publication number Publication date
EP0811309A1 (fr) 1997-12-10
CA2212943A1 (fr) 1996-08-29
US6035524A (en) 2000-03-14
WO1996026631A1 (fr) 1996-08-29
FR2730894A1 (fr) 1996-08-23

Similar Documents

Publication Publication Date Title
FR2730894B3 (fr) Procede de fabrication d'une carte electronique a refroidissement par conduction thermique
FR2669178B1 (fr) Coffre et carte electronique a drain thermique et procede de fabrication d'une telle carte.
FR2660092B1 (fr) Procede de fabrication d'une carte a circuit integre.
DE69131273T2 (de) Elektronisches-Computer-Kühlsystem
IT1276990B1 (it) Scambiatore di calore a piastre
FR2731869B1 (fr) Carte de circuit et procede de fabrication de cette carte de circuit
DE69616959T2 (de) Wärmeaustauschelement
FR2753117B1 (fr) Procede de fabrication d'une structure stratifiee
FR2776788B1 (fr) Procede de commutation d'applications sur une carte a puce multi-applicative
FR2766618B1 (fr) Procede de fabrication d'un film conducteur anisotrope a inserts conducteurs
FR2667928B1 (fr) Procede de chauffe d'une enceinte thermique.
FR2749687B1 (fr) Carte a memoire et procede de fabrication d'une telle carte
FR2781298B1 (fr) Procede de fabrication d'une carte a puce electronique et carte a puce electronique
FR2766654B1 (fr) Procede de fabrication d'une carte de circuit imprime
FR2793331B1 (fr) Procede de fabrication d'une carte a microcircuit
FR2775099B1 (fr) Procede de fabrication d'une carte a circuit integre
FR2773262B1 (fr) Procede de formation d'elements conducteurs dans un circuit integre
FR2724040B1 (fr) Procede de fabrication d'une carte a puce et carte ainsi obtenue
FR2734981B1 (fr) Procede de fabrication d'une carte a circuit imprime et carte a circuit imprime
FR2785700B1 (fr) Procede de gestion d'un circuit electronique
FR2740906B1 (fr) Module a circuit integre et procede de fabrication
FR2788192B1 (fr) Procede de fabrication d'une liaison entre un module et un composant electronique, et ses applications
FR2680441B1 (fr) Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.
ITMI950882A0 (it) Scambiatore di calore a piastre
FR2741233B1 (fr) Connecteur thermique pour carte ou boitier d'electronique