FR2680441B1 - Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant. - Google Patents

Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.

Info

Publication number
FR2680441B1
FR2680441B1 FR9110358A FR9110358A FR2680441B1 FR 2680441 B1 FR2680441 B1 FR 2680441B1 FR 9110358 A FR9110358 A FR 9110358A FR 9110358 A FR9110358 A FR 9110358A FR 2680441 B1 FR2680441 B1 FR 2680441B1
Authority
FR
France
Prior art keywords
module
manufacturing
electronic circuits
thermal conduction
conduction cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9110358A
Other languages
English (en)
Other versions
FR2680441A1 (fr
Inventor
Michel Constanty
Christine Garandel
Francois Pacreau
Pascal Zallo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Dassault Electronique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dassault Electronique SA filed Critical Dassault Electronique SA
Priority to FR9110358A priority Critical patent/FR2680441B1/fr
Publication of FR2680441A1 publication Critical patent/FR2680441A1/fr
Application granted granted Critical
Publication of FR2680441B1 publication Critical patent/FR2680441B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9110358A 1991-08-14 1991-08-14 Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant. Expired - Fee Related FR2680441B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9110358A FR2680441B1 (fr) 1991-08-14 1991-08-14 Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9110358A FR2680441B1 (fr) 1991-08-14 1991-08-14 Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.

Publications (2)

Publication Number Publication Date
FR2680441A1 FR2680441A1 (fr) 1993-02-19
FR2680441B1 true FR2680441B1 (fr) 1993-10-15

Family

ID=9416222

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9110358A Expired - Fee Related FR2680441B1 (fr) 1991-08-14 1991-08-14 Procede de fabrication d'un module de circuits electroniques a refroidissement par conduction thermique et module correspondant.

Country Status (1)

Country Link
FR (1) FR2680441B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2882268A1 (fr) * 2013-12-05 2015-06-10 Taurob GmbH Protection de l'électronique
DE102016217554A1 (de) * 2016-09-14 2018-03-15 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul, und Verfahren zum Herstellen einer elektronischen Baugruppe

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383565A (en) * 1966-05-13 1968-05-14 Gen Electric Packaging of electrical components
US3869563A (en) * 1973-09-27 1975-03-04 Motorola Inc Encapsulation housing for electronic circuit boards or the like and method of encapsulating
DE8208862U1 (de) * 1982-03-29 1982-07-08 Schaffer, Werner, 8340 Pfarrkirchen Gehäuse für elektrische und elektronische Bauteile

Also Published As

Publication number Publication date
FR2680441A1 (fr) 1993-02-19

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110502