FR2654890B1 - Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. - Google Patents
Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.Info
- Publication number
- FR2654890B1 FR2654890B1 FR8915119A FR8915119A FR2654890B1 FR 2654890 B1 FR2654890 B1 FR 2654890B1 FR 8915119 A FR8915119 A FR 8915119A FR 8915119 A FR8915119 A FR 8915119A FR 2654890 B1 FR2654890 B1 FR 2654890B1
- Authority
- FR
- France
- Prior art keywords
- production
- circuit board
- printed circuit
- dissipation device
- thermal dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8915119A FR2654890B1 (fr) | 1989-11-17 | 1989-11-17 | Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8915119A FR2654890B1 (fr) | 1989-11-17 | 1989-11-17 | Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2654890A1 FR2654890A1 (fr) | 1991-05-24 |
FR2654890B1 true FR2654890B1 (fr) | 1996-08-02 |
Family
ID=9387506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8915119A Expired - Fee Related FR2654890B1 (fr) | 1989-11-17 | 1989-11-17 | Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2654890B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2730894B3 (fr) * | 1995-02-21 | 1997-03-14 | Thomson Csf | Procede de fabrication d'une carte electronique a refroidissement par conduction thermique |
FR2752661B1 (fr) * | 1996-08-23 | 1998-10-30 | Giat Ind Sa | Procede de fabrication d'un dispositif de dissipation de l'energie thermique produite par des composants electroniques implantes sur une carte a circuits imprimes, et dispositif ainsi obtenu |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT303218B (de) * | 1968-04-08 | 1972-11-10 | Siemens Ag | Baueinheit für Geräte der Fernmeldetechnik |
DE1913679B2 (de) * | 1969-03-18 | 1971-03-25 | Waermeleitvorrichtung fuer elektrische baugruppen | |
US4029999A (en) * | 1975-04-10 | 1977-06-14 | Ibm Corporation | Thermally conducting elastomeric device |
FR2514601A1 (fr) * | 1981-10-13 | 1983-04-15 | Socapex | Systeme d'interconnexion thermique pour carte de circuit imprime revetue de composants electroniques |
-
1989
- 1989-11-17 FR FR8915119A patent/FR2654890B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2654890A1 (fr) | 1991-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |