FR2709915B1 - Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés. - Google Patents

Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés.

Info

Publication number
FR2709915B1
FR2709915B1 FR9310898A FR9310898A FR2709915B1 FR 2709915 B1 FR2709915 B1 FR 2709915B1 FR 9310898 A FR9310898 A FR 9310898A FR 9310898 A FR9310898 A FR 9310898A FR 2709915 B1 FR2709915 B1 FR 2709915B1
Authority
FR
France
Prior art keywords
locking
heat exchange
printed circuit
circuit boards
exchange device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9310898A
Other languages
English (en)
Other versions
FR2709915A1 (fr
Inventor
Jean-Pierre Schiavini
Alain Cognard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Avionics SAS
Original Assignee
Thales Avionics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Avionics SAS filed Critical Thales Avionics SAS
Priority to FR9310898A priority Critical patent/FR2709915B1/fr
Priority to US08/285,143 priority patent/US5483420A/en
Publication of FR2709915A1 publication Critical patent/FR2709915A1/fr
Application granted granted Critical
Publication of FR2709915B1 publication Critical patent/FR2709915B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9310898A 1993-09-10 1993-09-10 Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés. Expired - Lifetime FR2709915B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9310898A FR2709915B1 (fr) 1993-09-10 1993-09-10 Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés.
US08/285,143 US5483420A (en) 1993-09-10 1994-08-03 Locking and heat-exchange device for modular printed circuit board holder structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9310898A FR2709915B1 (fr) 1993-09-10 1993-09-10 Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés.

Publications (2)

Publication Number Publication Date
FR2709915A1 FR2709915A1 (fr) 1995-03-17
FR2709915B1 true FR2709915B1 (fr) 1995-11-17

Family

ID=9450822

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9310898A Expired - Lifetime FR2709915B1 (fr) 1993-09-10 1993-09-10 Dispositif de verrouillage et d'échange thermique pour structure modulaire porte cartes de circuits imprimés.

Country Status (2)

Country Link
US (1) US5483420A (fr)
FR (1) FR2709915B1 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575546A (en) * 1995-07-21 1996-11-19 Dell U.S.A., L.P. Apparatus for retention of computer expansion cards and filler panels
DE19613559C1 (de) * 1996-04-04 1997-11-20 Stn Atlas Elektronik Gmbh Elektronikgerät
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US5892658A (en) * 1998-05-12 1999-04-06 Lockhead Martin Corporation VME eurocard triple printed wiring board single slot module assembly
US6104613A (en) * 1998-05-12 2000-08-15 Lockheed Martin Federal Systems, Inc. VME eurocard double printed wiring card host circuit card circuit (module) assembly
US5967466A (en) * 1998-09-04 1999-10-19 Unitrend, Inc. Back plane lock down
US6215668B1 (en) 1999-03-23 2001-04-10 Dell Usa, L.P. Expansion card retaining device
US6963490B2 (en) * 2003-11-10 2005-11-08 Honeywell International Inc. Methods and apparatus for conductive cooling of electronic units
US7190574B2 (en) * 2005-02-24 2007-03-13 Dell Products L.P. Method and apparatus for securing a modular component in a chassis
FR2886508A1 (fr) * 2005-05-31 2006-12-01 Sagem Cale expansible et systeme comprenant un module, un receptacle et une telle cale intercalee entre eux
US7505251B2 (en) * 2005-10-28 2009-03-17 International Business Machines Corporation Actuation mechanism for mating electronic card interconnect systems
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
JP4882108B2 (ja) * 2007-05-31 2012-02-22 Ｎｅｃネットワーク・センサ株式会社 基板の放熱構造
US7508670B1 (en) 2007-08-14 2009-03-24 Lockheed Martin Corporation Thermally conductive shelf
JP2012023329A (ja) * 2010-06-14 2012-02-02 Toshiba Corp 基板ユニット及び電子装置
US9629232B2 (en) * 2012-05-17 2017-04-18 The Regents Of The University Of California Thermally actuated printed circuit board retainers
US8967903B1 (en) * 2012-06-20 2015-03-03 General Micro Systems, Inc. Locking displaceable frame
US9229497B2 (en) * 2012-11-08 2016-01-05 Silicon Graphics International Corp. On-blade cold sink for high-density clustered computer system
FR3012718B1 (fr) * 2013-10-28 2015-12-04 Kontron Modular Computers Sas <p>verrouillage d'une carte electronique</p>
TWI564535B (zh) * 2015-02-16 2017-01-01 國立清華大學 快速拆卸式之散熱連接裝置
TWM505164U (zh) * 2015-03-02 2015-07-11 Adlink Technology Inc 應用熱傳導散熱的單板電腦鎖固結構
US9655269B2 (en) * 2015-05-12 2017-05-16 Honeywell International Inc. Support system for printed board assemblies
CN106304744B (zh) * 2016-10-07 2022-03-22 南京艾科美热能科技有限公司 一种锁紧条
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
US10034403B1 (en) * 2017-03-09 2018-07-24 Advanced Cooling Technologies, Inc. Card retainer device
US10426054B1 (en) * 2018-12-12 2019-09-24 Hamilton Sundstrand Corporation Integrated card-guide adapter heat sink
USD914008S1 (en) * 2019-11-15 2021-03-23 Innovation First, Inc. Server rack shelf
USD914665S1 (en) * 2019-11-15 2021-03-30 Innovation First, Inc. Server rack shelf

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586102A (en) * 1969-02-17 1971-06-22 Teledyne Inc Heat sink pillow
US4096547A (en) * 1976-12-17 1978-06-20 Calabro Anthony Denis Heat transfer mounting device for metallic printed circuit boards
US4298903A (en) * 1978-06-29 1981-11-03 The General Electric Company Limited Electronic component cooling arrangements
US4354770A (en) * 1980-05-19 1982-10-19 The United States Of America As Represented By The Secretary Of The Navy Wedge assembly
US4318157A (en) * 1980-06-06 1982-03-02 Control Data Corporation Apparatus for mounting circuit cards
US4414605A (en) * 1981-06-29 1983-11-08 The United States Of America As Represented By The Secretary Of The Navy Positive locking mechanism
US4480287A (en) * 1982-12-27 1984-10-30 Raytheon Company Module retainer apparatus
US4953059A (en) * 1986-03-06 1990-08-28 United Technologies Corporation Spring loaded multi-wedge card retainer
US4819713A (en) * 1987-04-23 1989-04-11 Calmark Corporation Retainer for electronic modules
US5036428A (en) * 1990-06-29 1991-07-30 Eg&G Birtcher, Inc. Printed circuit board retainer assembly

Also Published As

Publication number Publication date
FR2709915A1 (fr) 1995-03-17
US5483420A (en) 1996-01-09

Similar Documents

Publication Publication Date Title
FR2709915B1 (fr) Dispositif de verrouillage et d&#39;échange thermique pour structure modulaire porte cartes de circuits imprimés.
DE69402590D1 (de) Verriegelungs- und Versteifungsvorrichtung für Leiterplatte
FR2670323B1 (fr) Procede et dispositif d&#39;interconnexion de circuits integres en trois dimensions.
EP0591761A3 (en) A two-sided printed circuit board, a multi-layered printed circuit board, and a method for producing the same
FR2701554B1 (fr) Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
EP0621747A3 (fr) Conception de masse thermique de panneaux ou cartes à circuit imprimé.
EP0562340A3 (en) Dimple interconnect for flat cables and printed wiring boards
EP0629107A3 (fr) Technique de panneaux à cristaux imprimés à câblage et coupe transversale multiple.
GB2251129B (en) Printed wiring board, printed circuit board and electronic apparatus
DE69532050D1 (de) Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte
IL97812A0 (en) Printed circuit board edge-locking device
DE59511037D1 (de) Mehrlagenleiterplatten und Multichipmodul-Substrate
FR2663494B1 (fr) Dispositif electronique a substrat et boitier pour plaquette a circuit imprime.
ZA913626B (en) The bonding of polymide films,and printed circuit boards
FR2642256B1 (fr) Dispositif de connexion et/ou d&#39;affichage pour le montage de cartes de circuits imprimes
FR2709634B1 (fr) Structure pour relier des cartes de circuits imprimés.
FR2654890B1 (fr) Dispositif de dissipation thermique pour carte de circuits imprimes et procede pour sa fabrication.
GB2249196B (en) Photo-mask for use in manufacturing printed wiring boards
KR950022326U (ko) 인쇄회로기판의 이송장치
FR2721409B1 (fr) Procédé et dispositif pour l&#39;auto-dépannage de cartes de circuits imprimés.
GB2276281B (en) Testing apparatus for printed circuit boards and the like
FR2685409B1 (fr) Procede et dispositif pour rendre imperdable une vis de fixation d&#39;un circuit imprime sur un support.
FR2780602B1 (fr) Dispositif de maintien d&#39;une carte de circuit imprime
FR2636490B1 (fr) Dispositif de liaison mecanique et thermique pour carte de circuits electroniques
FR2689720B1 (fr) Dispositif de transfert de cartes de circuits imprimes pour installation de traitement thermique par convection et installation en faisant application.