DE69532050D1 - Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte - Google Patents

Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte

Info

Publication number
DE69532050D1
DE69532050D1 DE69532050T DE69532050T DE69532050D1 DE 69532050 D1 DE69532050 D1 DE 69532050D1 DE 69532050 T DE69532050 T DE 69532050T DE 69532050 T DE69532050 T DE 69532050T DE 69532050 D1 DE69532050 D1 DE 69532050D1
Authority
DE
Germany
Prior art keywords
sides
circuit board
printed circuit
integrated circuits
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69532050T
Other languages
English (en)
Other versions
DE69532050T2 (de
Inventor
Ernest Russell
James S Wallace
Daniel Baudouin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69532050D1 publication Critical patent/DE69532050D1/de
Publication of DE69532050T2 publication Critical patent/DE69532050T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1076—Shape of the containers
    • H01L2225/1082—Shape of the containers for improving alignment between containers, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69532050T 1994-05-12 1995-05-12 Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte Expired - Fee Related DE69532050T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US24182494A 1994-05-12 1994-05-12
US241824 1994-05-12

Publications (2)

Publication Number Publication Date
DE69532050D1 true DE69532050D1 (de) 2003-12-04
DE69532050T2 DE69532050T2 (de) 2004-08-26

Family

ID=22912330

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69532050T Expired - Fee Related DE69532050T2 (de) 1994-05-12 1995-05-12 Eine mit integrierten Schaltungen beidseitig bestückte Leiterplatte

Country Status (6)

Country Link
US (1) US5671125A (de)
EP (2) EP0682366A3 (de)
JP (1) JPH0864921A (de)
KR (1) KR950034708A (de)
DE (1) DE69532050T2 (de)
TW (1) TW340256B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904581A (en) * 1996-07-17 1999-05-18 Minnesota Mining And Manufacturing Company Electrical interconnection system and device
KR100268460B1 (ko) * 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
US6163459A (en) * 1997-07-25 2000-12-19 Matsushita Electric Industrial Co., Ltd. Semiconductor mounting system and semiconductor chip
JP2001513593A (ja) 1997-08-08 2001-09-04 ノキア ネットワークス オサケ ユキチュア 表面取付型ｓｉｌハイブリッド回路の製造方法
DE19740701C2 (de) * 1997-09-16 1999-08-19 Siemens Ag Halbleiterbauelementanordnung mit einem ein Hilfselement aufweisenden Bauelement in VSMP-Bauform
DE19846456A1 (de) * 1998-10-08 2000-01-27 Siemens Ag Elektronisches Bauteil
US6483041B1 (en) * 1999-11-12 2002-11-19 Emc Corporation Micro soldered connection
US6409538B1 (en) * 2000-11-03 2002-06-25 Cray Inc. Electrical connector assembly for use with variable thickness circuit boards
US6552275B2 (en) * 2001-04-16 2003-04-22 Intel Corporation Surface mount component
JP2005181222A (ja) * 2003-12-22 2005-07-07 Renesas Technology Corp 半導体装置の製造方法
US20060084318A1 (en) * 2004-10-18 2006-04-20 Jason Si Double-side mounting electrical connector
ATE539438T1 (de) * 2005-10-28 2012-01-15 Shenzhen Chipsbank Technologies Co Ltd Speicherbaustein mit steuerchip mit kompatibler konfigurierfunktion und herstellungsverfahren dafür
DE112006004164B4 (de) * 2006-12-05 2017-04-06 Infineon Technologies Ag Integriertes Halbleiter-Outline-Gehäuse

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546406A (en) * 1980-09-25 1985-10-08 Texas Instruments Incorporated Electronic circuit interconnection system
US4750089A (en) * 1985-11-22 1988-06-07 Texas Instruments Incorporated Circuit board with a chip carrier and mounting structure connected to the chip carrier
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
US4979015A (en) * 1987-01-28 1990-12-18 Texas Instruments Incorporated Insulated substrate for flip-chip integrated circuit device
EP0282617A1 (de) * 1987-03-18 1988-09-21 Texas Instruments Deutschland Gmbh Integrierte Schaltung mit einer elektrisch leitenden Trägerplatte
JPS63296292A (ja) * 1987-05-27 1988-12-02 Mitsubishi Electric Corp 半導体装置
JPS6480032A (en) * 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor device and manufacture thereof
US4855809A (en) * 1987-11-24 1989-08-08 Texas Instruments Incorporated Orthogonal chip mount system module and method
US4963697A (en) * 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4967042A (en) * 1988-12-22 1990-10-30 Texas Instruments Incorporated System for enhancing current carrying capacity of printed wiring board
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members
US4967262A (en) * 1989-11-06 1990-10-30 Micron Technology, Inc. Gull-wing zig-zag inline lead package having end-of-package anchoring pins
US5080611A (en) * 1990-12-21 1992-01-14 Amp Incorporated Boardlock for common-hole double-sided mounting
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips
KR950014123B1 (ko) * 1992-09-08 1995-11-21 삼성전자주식회사 반도체 패키지
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device

Also Published As

Publication number Publication date
EP0682366A2 (de) 1995-11-15
EP0682366A3 (de) 1996-03-06
EP0997944A3 (de) 2000-05-10
EP0997944A2 (de) 2000-05-03
DE69532050T2 (de) 2004-08-26
KR950034708A (ko) 1995-12-28
EP0997944B1 (de) 2003-10-29
US5671125A (en) 1997-09-23
TW340256B (en) 1998-09-11
JPH0864921A (ja) 1996-03-08

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Legal Events

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8339 Ceased/non-payment of the annual fee