DE69206373D1 - Vorrichtung zum Montieren von elektronischen Komponenten. - Google Patents
Vorrichtung zum Montieren von elektronischen Komponenten.Info
- Publication number
- DE69206373D1 DE69206373D1 DE69206373T DE69206373T DE69206373D1 DE 69206373 D1 DE69206373 D1 DE 69206373D1 DE 69206373 T DE69206373 T DE 69206373T DE 69206373 T DE69206373 T DE 69206373T DE 69206373 D1 DE69206373 D1 DE 69206373D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- mounting electronic
- mounting
- components
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3245907A JPH05126528A (ja) | 1991-09-25 | 1991-09-25 | 部品搬送装置の位置検出装置 |
JP3245906A JPH05152795A (ja) | 1991-09-25 | 1991-09-25 | 部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69206373D1 true DE69206373D1 (de) | 1996-01-11 |
DE69206373T2 DE69206373T2 (de) | 1996-06-05 |
Family
ID=26537465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69206373T Expired - Fee Related DE69206373T2 (de) | 1991-09-25 | 1992-09-24 | Vorrichtung zum Montieren von elektronischen Komponenten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5285888A (de) |
EP (1) | EP0534765B1 (de) |
KR (1) | KR970003922B1 (de) |
DE (1) | DE69206373T2 (de) |
TW (1) | TW209281B (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5431274A (en) * | 1993-06-02 | 1995-07-11 | Hms Label Specialties, Inc. | Rotary electronic profile placer |
JPH07115296A (ja) * | 1993-10-15 | 1995-05-02 | Sanyo Electric Co Ltd | 部品実装機の制御装置 |
JP3907786B2 (ja) * | 1997-06-16 | 2007-04-18 | 松下電器産業株式会社 | 電子部品実装方法及び装置 |
US5950309A (en) * | 1998-01-08 | 1999-09-14 | Xerox Corporation | Method for bonding a nozzle plate to an ink jet printhead |
DE19801978A1 (de) * | 1998-01-20 | 1999-07-29 | Sensor Instr Gmbh | Vorrichtung zum Überprüfen der Beschickung eines Transportarms mit einem Bauteil |
JP3398109B2 (ja) * | 2000-01-27 | 2003-04-21 | 三洋電機株式会社 | 電子部品装着装置 |
CN112539721B (zh) * | 2020-11-25 | 2022-05-06 | 华北水利水电大学 | 机器人用减速机的三曲柄摆线轮关键加工误差测量方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952508B2 (ja) * | 1976-08-30 | 1984-12-20 | 株式会社東芝 | 管球製造装置 |
JPS62292328A (ja) * | 1986-06-12 | 1987-12-19 | Matsushita Electric Ind Co Ltd | 部品装着方法 |
JPH0797019B2 (ja) * | 1986-06-12 | 1995-10-18 | 松下電器産業株式会社 | 部品認識用照明方法及びその装置 |
JPH07109957B2 (ja) * | 1988-06-21 | 1995-11-22 | 松下電器産業株式会社 | 電子部品装着方法 |
DE68911490T2 (de) * | 1988-11-30 | 1994-06-23 | Ibm | Beförderungsvorrichtung. |
JP2620646B2 (ja) * | 1989-06-07 | 1997-06-18 | 三洋電機株式会社 | 電子部品自動装着装置 |
JP2503082B2 (ja) * | 1989-09-05 | 1996-06-05 | 富士機械製造株式会社 | 電子部品装着装置 |
US5177864A (en) * | 1989-09-06 | 1993-01-12 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and method of mounting electronic component |
JPH0448698A (ja) * | 1990-06-14 | 1992-02-18 | Sony Corp | 電子部品取付装置 |
-
1992
- 1992-09-23 US US07/949,899 patent/US5285888A/en not_active Expired - Lifetime
- 1992-09-24 DE DE69206373T patent/DE69206373T2/de not_active Expired - Fee Related
- 1992-09-24 EP EP92308731A patent/EP0534765B1/de not_active Expired - Lifetime
- 1992-09-25 TW TW081107611A patent/TW209281B/zh active
- 1992-09-25 KR KR1019920017464A patent/KR970003922B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0534765A1 (de) | 1993-03-31 |
TW209281B (de) | 1993-07-11 |
KR970003922B1 (ko) | 1997-03-22 |
US5285888A (en) | 1994-02-15 |
KR930007333A (ko) | 1993-04-22 |
DE69206373T2 (de) | 1996-06-05 |
EP0534765B1 (de) | 1995-11-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |