DE69206373D1 - Vorrichtung zum Montieren von elektronischen Komponenten. - Google Patents

Vorrichtung zum Montieren von elektronischen Komponenten.

Info

Publication number
DE69206373D1
DE69206373D1 DE69206373T DE69206373T DE69206373D1 DE 69206373 D1 DE69206373 D1 DE 69206373D1 DE 69206373 T DE69206373 T DE 69206373T DE 69206373 T DE69206373 T DE 69206373T DE 69206373 D1 DE69206373 D1 DE 69206373D1
Authority
DE
Germany
Prior art keywords
electronic components
mounting electronic
mounting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206373T
Other languages
English (en)
Other versions
DE69206373T2 (de
Inventor
Takatomo Izume
Katsuya Sano
Shuji Sato
Shingo Sekiguchi
Hisao Suzuki
Kazuhiro C O Machine Te Tokitu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Engineering Corp
Toshiba Corp
Japan Tobacco Inc
Original Assignee
Toshiba Engineering Corp
Toshiba Corp
Japan Tobacco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3245906A external-priority patent/JPH05152795A/ja
Priority claimed from JP3245907A external-priority patent/JPH05126528A/ja
Application filed by Toshiba Engineering Corp, Toshiba Corp, Japan Tobacco Inc filed Critical Toshiba Engineering Corp
Application granted granted Critical
Publication of DE69206373D1 publication Critical patent/DE69206373D1/de
Publication of DE69206373T2 publication Critical patent/DE69206373T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69206373T 1991-09-25 1992-09-24 Vorrichtung zum Montieren von elektronischen Komponenten. Expired - Fee Related DE69206373T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3245906A JPH05152795A (ja) 1991-09-25 1991-09-25 部品実装装置
JP3245907A JPH05126528A (ja) 1991-09-25 1991-09-25 部品搬送装置の位置検出装置

Publications (2)

Publication Number Publication Date
DE69206373D1 true DE69206373D1 (de) 1996-01-11
DE69206373T2 DE69206373T2 (de) 1996-06-05

Family

ID=26537465

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206373T Expired - Fee Related DE69206373T2 (de) 1991-09-25 1992-09-24 Vorrichtung zum Montieren von elektronischen Komponenten.

Country Status (5)

Country Link
US (1) US5285888A (de)
EP (1) EP0534765B1 (de)
KR (1) KR970003922B1 (de)
DE (1) DE69206373T2 (de)
TW (1) TW209281B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431274A (en) * 1993-06-02 1995-07-11 Hms Label Specialties, Inc. Rotary electronic profile placer
JPH07115296A (ja) * 1993-10-15 1995-05-02 Sanyo Electric Co Ltd 部品実装機の制御装置
JP3907786B2 (ja) * 1997-06-16 2007-04-18 松下電器産業株式会社 電子部品実装方法及び装置
US5950309A (en) * 1998-01-08 1999-09-14 Xerox Corporation Method for bonding a nozzle plate to an ink jet printhead
DE19801978A1 (de) * 1998-01-20 1999-07-29 Sensor Instr Gmbh Vorrichtung zum Überprüfen der Beschickung eines Transportarms mit einem Bauteil
JP3398109B2 (ja) * 2000-01-27 2003-04-21 三洋電機株式会社 電子部品装着装置
CN112539721B (zh) * 2020-11-25 2022-05-06 华北水利水电大学 机器人用减速机的三曲柄摆线轮关键加工误差测量方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952508B2 (ja) * 1976-08-30 1984-12-20 株式会社東芝 管球製造装置
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
JPS62292328A (ja) * 1986-06-12 1987-12-19 Matsushita Electric Ind Co Ltd 部品装着方法
JPH07109957B2 (ja) * 1988-06-21 1995-11-22 松下電器産業株式会社 電子部品装着方法
EP0371205B1 (de) * 1988-11-30 1993-12-15 International Business Machines Corporation Beförderungsvorrichtung
JP2620646B2 (ja) * 1989-06-07 1997-06-18 三洋電機株式会社 電子部品自動装着装置
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
US5177864A (en) * 1989-09-06 1993-01-12 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and method of mounting electronic component
JPH0448698A (ja) * 1990-06-14 1992-02-18 Sony Corp 電子部品取付装置

Also Published As

Publication number Publication date
KR930007333A (ko) 1993-04-22
KR970003922B1 (ko) 1997-03-22
DE69206373T2 (de) 1996-06-05
EP0534765A1 (de) 1993-03-31
EP0534765B1 (de) 1995-11-29
TW209281B (de) 1993-07-11
US5285888A (en) 1994-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee