DE69206231D1 - Vorrichtung zum Aufbauen von elektronischen Komponenten. - Google Patents

Vorrichtung zum Aufbauen von elektronischen Komponenten.

Info

Publication number
DE69206231D1
DE69206231D1 DE69206231T DE69206231T DE69206231D1 DE 69206231 D1 DE69206231 D1 DE 69206231D1 DE 69206231 T DE69206231 T DE 69206231T DE 69206231 T DE69206231 T DE 69206231T DE 69206231 D1 DE69206231 D1 DE 69206231D1
Authority
DE
Germany
Prior art keywords
electronic components
building electronic
building
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206231T
Other languages
English (en)
Other versions
DE69206231T2 (de
Inventor
Takatomo Izume
Koji Taira
Hiroshi Hohrai
Etuo Minamihama
Yasuharu Ujiie
Hisao Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Tobacco Inc
Original Assignee
Toshiba Corp
Japan Tobacco Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Japan Tobacco Inc filed Critical Toshiba Corp
Publication of DE69206231D1 publication Critical patent/DE69206231D1/de
Application granted granted Critical
Publication of DE69206231T2 publication Critical patent/DE69206231T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
DE69206231T 1991-09-25 1992-09-21 Vorrichtung zum Aufbauen von elektronischen Komponenten. Expired - Fee Related DE69206231T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3245909A JPH05129796A (ja) 1991-09-25 1991-09-25 部品実装装置

Publications (2)

Publication Number Publication Date
DE69206231D1 true DE69206231D1 (de) 1996-01-04
DE69206231T2 DE69206231T2 (de) 1996-05-02

Family

ID=17140638

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206231T Expired - Fee Related DE69206231T2 (de) 1991-09-25 1992-09-21 Vorrichtung zum Aufbauen von elektronischen Komponenten.

Country Status (6)

Country Link
US (1) US5307558A (de)
EP (1) EP0534701B1 (de)
JP (1) JPH05129796A (de)
KR (1) KR970003921B1 (de)
DE (1) DE69206231T2 (de)
TW (1) TW234808B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06338700A (ja) * 1993-05-31 1994-12-06 Sony Corp 実装装置
WO1996001036A1 (de) * 1994-06-30 1996-01-11 Siemens Aktiengesellschaft Vorrichtung zur handhabung von teilen mit mindestens einer saugpipette
CN1091341C (zh) * 1995-02-17 2002-09-18 松下电器产业株式会社 电子元件装配方法及装置
US6044169A (en) * 1995-07-12 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US6094808A (en) * 1996-02-16 2000-08-01 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting electronic components
US6895662B2 (en) * 1997-09-25 2005-05-24 Matsushita Electric Industrial Co., Ltd. Apparatus for holding and mounting a component
US6298547B1 (en) * 1997-09-25 2001-10-09 Matsushita Electric Industrial Co., Ltd. Apparatus for holding component, apparatus for mounting component, and method for mounting component
JP4097333B2 (ja) * 1998-09-30 2008-06-11 松下電器産業株式会社 Ｉｃチップ実装機
US6430844B1 (en) 2000-07-20 2002-08-13 E.S. Originals, Inc. Shoe with slip-resistant, shape-retaining fabric outsole
JP2013135049A (ja) * 2011-12-26 2013-07-08 Samsung Techwin Co Ltd 電子部品実装装置
JP7316581B2 (ja) * 2019-02-25 2023-07-28 パナソニックＩｐマネジメント株式会社 部品供給装置および部品供給装置の制御方法
CN114102138A (zh) * 2021-12-31 2022-03-01 浙江朝泰机车部件有限公司 一种大灯拨动开关自动装配机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
JP2537770B2 (ja) * 1984-08-31 1996-09-25 松下電器産業株式会社 電子部品の装着方法
JPH0797019B2 (ja) * 1986-06-12 1995-10-18 松下電器産業株式会社 部品認識用照明方法及びその装置
JPH01205500A (ja) * 1988-02-10 1989-08-17 Sony Corp 部品マウント装置
JP2568623B2 (ja) * 1988-04-12 1997-01-08 松下電器産業株式会社 電子部品の実装方法
US4951383A (en) * 1988-11-14 1990-08-28 Sanyo Electric Co., Ltd. Electronic parts automatic mounting apparatus
DE68911490T2 (de) * 1988-11-30 1994-06-23 Ibm Beförderungsvorrichtung.
JP2503082B2 (ja) * 1989-09-05 1996-06-05 富士機械製造株式会社 電子部品装着装置
EP0449134B1 (de) * 1990-03-26 1995-12-06 Japan Tobacco Inc. Verfahren und Vorrichtung für Bauelementenmontage
JPH0362598A (ja) * 1990-07-16 1991-03-18 Sanyo Electric Co Ltd 電子部品装着装置

Also Published As

Publication number Publication date
US5307558A (en) 1994-05-03
KR970003921B1 (ko) 1997-03-22
DE69206231T2 (de) 1996-05-02
JPH05129796A (ja) 1993-05-25
KR930007332A (ko) 1993-04-22
EP0534701B1 (de) 1995-11-22
TW234808B (de) 1994-11-21
EP0534701A1 (de) 1993-03-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee