DE69323655D1 - Halbleiterbauelement zur Betreibung eines Wärmeerzeugers - Google Patents

Halbleiterbauelement zur Betreibung eines Wärmeerzeugers

Info

Publication number
DE69323655D1
DE69323655D1 DE69323655T DE69323655T DE69323655D1 DE 69323655 D1 DE69323655 D1 DE 69323655D1 DE 69323655 T DE69323655 T DE 69323655T DE 69323655 T DE69323655 T DE 69323655T DE 69323655 D1 DE69323655 D1 DE 69323655D1
Authority
DE
Germany
Prior art keywords
operating
semiconductor component
heat generator
generator
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69323655T
Other languages
English (en)
Other versions
DE69323655T2 (de
Inventor
Shunichi Kaizu
Hiroyuki Nakamura
Toshihiko Ichise
Kei Fujita
Seiji C O Canon Kabushik Kamei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69323655D1 publication Critical patent/DE69323655D1/de
Publication of DE69323655T2 publication Critical patent/DE69323655T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7809—Vertical DMOS transistors, i.e. VDMOS transistors having both source and drain contacts on the same surface, i.e. Up-Drain VDMOS transistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electronic Switches (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
DE69323655T 1992-06-18 1993-06-17 Halbleiterbauelement zur Betreibung eines Wärmeerzeugers Expired - Lifetime DE69323655T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15974892 1992-06-18
JP13028993A JP3305415B2 (ja) 1992-06-18 1993-06-01 半導体装置、インクジェットヘッド、および画像形成装置

Publications (2)

Publication Number Publication Date
DE69323655D1 true DE69323655D1 (de) 1999-04-08
DE69323655T2 DE69323655T2 (de) 1999-09-02

Family

ID=26465462

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323655T Expired - Lifetime DE69323655T2 (de) 1992-06-18 1993-06-17 Halbleiterbauelement zur Betreibung eines Wärmeerzeugers

Country Status (4)

Country Link
US (1) US5517224A (de)
EP (1) EP0574911B1 (de)
JP (1) JP3305415B2 (de)
DE (1) DE69323655T2 (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5598189A (en) * 1993-09-07 1997-01-28 Hewlett-Packard Company Bipolar integrated ink jet printhead driver
EP0750990A3 (de) * 1995-06-28 1998-04-01 Canon Kabushiki Kaisha Flüssigkeit ausstossender Druckkopf, sein Herstellungsverfahren und Herstellungsverfahren eines Grundkörpers für einen solchen Druckkopf
US5774148A (en) * 1995-10-19 1998-06-30 Lexmark International, Inc. Printhead with field oxide as thermal barrier in chip
JPH09248912A (ja) * 1996-01-11 1997-09-22 Canon Inc インクジェットヘッド及びヘッド用基体、インクジェットカートリッジ、並びにインクジェット装置
DE69734797T2 (de) * 1996-06-07 2006-07-27 Canon K.K. Aufzeichnungskopf und Aufzeichnungsvorrichtung
JPH10774A (ja) * 1996-06-14 1998-01-06 Canon Inc インクジェット記録ヘッド用基板及びこれを備えたインクジェット記録ヘッド
US5738799A (en) * 1996-09-12 1998-04-14 Xerox Corporation Method and materials for fabricating an ink-jet printhead
JP3325808B2 (ja) * 1997-01-23 2002-09-17 シャープ株式会社 画像形成装置が備える制御電極の駆動回路
JP3147048B2 (ja) * 1997-09-12 2001-03-19 日本電気株式会社 半導体装置
US6102528A (en) * 1997-10-17 2000-08-15 Xerox Corporation Drive transistor for an ink jet printhead
JP3883706B2 (ja) * 1998-07-31 2007-02-21 シャープ株式会社 エッチング方法、及び薄膜トランジスタマトリックス基板の製造方法
US6688729B1 (en) 1999-06-04 2004-02-10 Canon Kabushiki Kaisha Liquid discharge head substrate, liquid discharge head, liquid discharge apparatus having these elements, manufacturing method of liquid discharge head, and driving method of the same
US6476838B1 (en) * 1999-09-03 2002-11-05 Oki Data America, Inc. Method of driving a thermal print head
TW479022B (en) * 2000-08-29 2002-03-11 Acer Peripherals Inc Drive circuit of ink-jet head with temperature detection function
US6825543B2 (en) 2000-12-28 2004-11-30 Canon Kabushiki Kaisha Semiconductor device, method for manufacturing the same, and liquid jet apparatus
JP4827817B2 (ja) * 2000-12-28 2011-11-30 キヤノン株式会社 半導体装置およびそれを用いた液体吐出装置
US6800902B2 (en) 2001-02-16 2004-10-05 Canon Kabushiki Kaisha Semiconductor device, method of manufacturing the same and liquid jet apparatus
US6883894B2 (en) 2001-03-19 2005-04-26 Hewlett-Packard Development Company, L.P. Printhead with looped gate transistor structures
US6460974B1 (en) 2001-07-27 2002-10-08 Hewlett-Packard Company Micro-pump and method for generating fluid flow
JP3734246B2 (ja) * 2001-10-30 2006-01-11 キヤノン株式会社 液体吐出ヘッド及び構造体の製造方法、液体吐出ヘッド並びに液体吐出装置
US6657255B2 (en) * 2001-10-30 2003-12-02 General Semiconductor, Inc. Trench DMOS device with improved drain contact
JP4272854B2 (ja) * 2002-07-10 2009-06-03 キヤノン株式会社 半導体装置及びそれを用いた液体吐出装置
JP4298414B2 (ja) * 2002-07-10 2009-07-22 キヤノン株式会社 液体吐出ヘッドの製造方法
KR100468787B1 (ko) * 2003-05-02 2005-01-29 삼성전자주식회사 래치-업(Ｌａｔｃｈ-ｕｐ)에 의한 전류 흐름을 방지할 수있는 반도체 장치
JP2005125638A (ja) * 2003-10-24 2005-05-19 Sony Corp 液体吐出ヘッド、液体吐出装置及び液体吐出ヘッドの製造方法
US7098509B2 (en) * 2004-01-02 2006-08-29 Semiconductor Components Industries, L.L.C. High energy ESD structure and method
KR100553914B1 (ko) * 2004-01-29 2006-02-24 삼성전자주식회사 잉크젯 프린트헤드 및 그 제조방법
JP5063865B2 (ja) * 2005-03-30 2012-10-31 オンセミコンダクター・トレーディング・リミテッド 半導体装置
JP4838026B2 (ja) * 2006-03-27 2011-12-14 富士通セミコンダクター株式会社 半導体装置の製造方法
US9555630B2 (en) 2007-12-02 2017-01-31 Hewlett-Packard Development Company, L.P. Electrically connecting electrically isolated printhead die ground networks at flexible circuit
CN102024847B (zh) * 2010-09-21 2014-04-09 电子科技大学 一种高压功率器件结构
US8395646B2 (en) * 2011-06-14 2013-03-12 Rohm Semiconductors USA, LLC Thermal printer with energy save features
US8411121B2 (en) 2011-06-14 2013-04-02 Rohm Semiconductor USA, LLC Thermal printhead with optimally shaped resistor layer
JP5847482B2 (ja) * 2011-08-05 2016-01-20 キヤノン株式会社 インクジェット記録ヘッド
JP5777762B2 (ja) * 2014-03-20 2015-09-09 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． 電気的に絶縁されるプリントヘッドダイ接地ネットワークをフレキシブル回路で電気的に接続する方法
JP6362376B2 (ja) * 2014-03-27 2018-07-25 キヤノン株式会社 液体吐出用基板、液体吐出用ヘッド、および、記録装置
JP6450169B2 (ja) * 2014-04-02 2019-01-09 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出カードリッジ及び液体吐出装置
JP6456040B2 (ja) * 2014-04-28 2019-01-23 キヤノン株式会社 液体吐出用基板、液体吐出用ヘッド、および、記録装置
JP6368393B2 (ja) * 2017-02-22 2018-08-01 キヤノン株式会社 記録素子基板、記録ヘッド及び記録装置
JP7027116B2 (ja) * 2017-10-24 2022-03-01 キヤノン株式会社 液体吐出装置

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US4429321A (en) * 1980-10-23 1984-01-31 Canon Kabushiki Kaisha Liquid jet recording device
US4614407A (en) * 1982-06-14 1986-09-30 Canon Kabushiki Kaisha Electrooptical device having fixed translucent indicia
US5192990A (en) * 1986-09-18 1993-03-09 Eastman Kodak Company Output circuit for image sensor
US5081474A (en) * 1988-07-04 1992-01-14 Canon Kabushiki Kaisha Recording head having multi-layer matrix wiring
US5212503A (en) * 1988-07-26 1993-05-18 Canon Kabushiki Kaisha Liquid jet recording head having a substrate with minimized electrode overlap
US5055859A (en) * 1988-11-16 1991-10-08 Casio Computer Co., Ltd. Integrated thermal printhead and driving circuit
DE69015651T2 (de) * 1989-01-13 1995-06-08 Canon Kk Aufzeichnungskopf.
JP2662446B2 (ja) * 1989-12-11 1997-10-15 キヤノン株式会社 記録ヘッド及び記録ヘッド用素子基板
JP2708596B2 (ja) * 1990-01-31 1998-02-04 キヤノン株式会社 記録ヘッドおよびインクジェット記録装置
ATE205963T1 (de) * 1990-05-31 2001-10-15 Canon Kk Halbleiteranordnung mit verbesserter leitungsführung
EP0469370A3 (en) * 1990-07-31 1992-09-09 Gold Star Co. Ltd Etching process for sloped side walls

Also Published As

Publication number Publication date
JPH0669497A (ja) 1994-03-11
EP0574911A3 (de) 1994-03-30
US5517224A (en) 1996-05-14
JP3305415B2 (ja) 2002-07-22
DE69323655T2 (de) 1999-09-02
EP0574911B1 (de) 1999-03-03
EP0574911A2 (de) 1993-12-22

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