DE69312636T2 - Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde Substrat - Google Patents
Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde SubstratInfo
- Publication number
- DE69312636T2 DE69312636T2 DE69312636T DE69312636T DE69312636T2 DE 69312636 T2 DE69312636 T2 DE 69312636T2 DE 69312636 T DE69312636 T DE 69312636T DE 69312636 T DE69312636 T DE 69312636T DE 69312636 T2 DE69312636 T2 DE 69312636T2
- Authority
- DE
- Germany
- Prior art keywords
- treated
- substrate
- carrier device
- anodizing apparatus
- anodizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/32—Anodisation of semiconducting materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/005—Apparatus specially adapted for electrolytic conversion coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32229592A JP3110178B2 (ja) | 1992-11-09 | 1992-11-09 | 半導体基板の作製方法及び陽極化成装置 |
JP73293A JP3181128B2 (ja) | 1993-01-06 | 1993-01-06 | 半導体プロセス装置 |
JP2163793A JPH06216110A (ja) | 1993-01-18 | 1993-01-18 | 陽極化成方法及び陽極化成装置 |
JP08687693A JP3416190B2 (ja) | 1993-03-23 | 1993-03-23 | 陽極化成装置及び陽極化成方法 |
JP05095011A JP3129569B2 (ja) | 1993-03-31 | 1993-03-31 | 陽極化成装置及び陽極化成法 |
JP12207793A JP3201875B2 (ja) | 1993-04-27 | 1993-04-27 | 陽極化成装置及び陽極化成法 |
JP13511793A JPH06326084A (ja) | 1993-05-14 | 1993-05-14 | 陽極化成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69312636D1 DE69312636D1 (de) | 1997-09-04 |
DE69312636T2 true DE69312636T2 (de) | 1998-02-05 |
Family
ID=27563084
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69312636T Expired - Lifetime DE69312636T2 (de) | 1992-11-09 | 1993-11-08 | Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde Substrat |
Country Status (3)
Country | Link |
---|---|
US (1) | US5458755A (de) |
EP (1) | EP0597428B1 (de) |
DE (1) | DE69312636T2 (de) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE9300881L (sv) * | 1993-03-17 | 1994-06-06 | Herman Georg Grimmeiss | Anordning för elektrolytisk oxidation av kiselskivor |
US5824199A (en) * | 1993-11-22 | 1998-10-20 | E. I. Du Pont De Nemours And Company | Electrochemical cell having an inflatable member |
DE69533245D1 (de) * | 1994-03-25 | 2004-08-19 | Nec Electronics Corp | Vorrichtung zur elektrolytischen Behandlung |
JP3376258B2 (ja) * | 1996-11-28 | 2003-02-10 | キヤノン株式会社 | 陽極化成装置及びそれに関連する装置及び方法 |
JP3985065B2 (ja) * | 1997-05-14 | 2007-10-03 | 忠弘 大見 | 多孔質シリコン基板の形成方法及び多孔質シリコン基板の形成装置 |
JP3413090B2 (ja) | 1997-12-26 | 2003-06-03 | キヤノン株式会社 | 陽極化成装置及び陽極化成処理方法 |
SG71903A1 (en) | 1998-01-30 | 2000-04-18 | Canon Kk | Process of reclamation of soi substrate and reproduced substrate |
DE19803852C2 (de) * | 1998-01-31 | 2003-12-18 | Bosch Gmbh Robert | Verfahren zur Herstellung beidseitig oxidierter Siliziumwafer |
JPH11243076A (ja) * | 1998-02-26 | 1999-09-07 | Canon Inc | 陽極化成方法及び陽極化成装置並びに半導体基板の製造方法 |
JP3762144B2 (ja) | 1998-06-18 | 2006-04-05 | キヤノン株式会社 | Soi基板の作製方法 |
JP2000082679A (ja) | 1998-07-08 | 2000-03-21 | Canon Inc | 半導体基板とその作製方法 |
US6197654B1 (en) * | 1998-08-21 | 2001-03-06 | Texas Instruments Incorporated | Lightly positively doped silicon wafer anodization process |
US6417069B1 (en) | 1999-03-25 | 2002-07-09 | Canon Kabushiki Kaisha | Substrate processing method and manufacturing method, and anodizing apparatus |
US6468923B1 (en) | 1999-03-26 | 2002-10-22 | Canon Kabushiki Kaisha | Method of producing semiconductor member |
US6410436B2 (en) | 1999-03-26 | 2002-06-25 | Canon Kabushiki Kaisha | Method of cleaning porous body, and process for producing porous body, non-porous film or bonded substrate |
DE19914905A1 (de) * | 1999-04-01 | 2000-10-05 | Bosch Gmbh Robert | Elektrochemische Ätzanlage und Verfahren zur Ätzung eines Ätzkörpers |
DE19936569B4 (de) * | 1999-08-03 | 2006-04-27 | Robert Bosch Gmbh | Herstellung von porösem Silicium |
US20010038153A1 (en) | 2000-01-07 | 2001-11-08 | Kiyofumi Sakaguchi | Semiconductor substrate and process for its production |
JP2002075917A (ja) | 2000-08-25 | 2002-03-15 | Canon Inc | 試料の分離装置及び分離方法 |
US6454917B1 (en) * | 2000-10-30 | 2002-09-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | High throughput and high performance copper electroplating tool |
JP3892703B2 (ja) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
US20040124088A1 (en) * | 2002-12-26 | 2004-07-01 | Canon Kabushiki Kaisha | Processing apparatus |
JP4438049B2 (ja) * | 2003-08-11 | 2010-03-24 | キヤノン株式会社 | 電界効果トランジスタ及びそれを用いたセンサ並びにその製造方法 |
US7323731B2 (en) * | 2003-12-12 | 2008-01-29 | Canon Kabushiki Kaisha | Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system |
JP2005210062A (ja) * | 2003-12-26 | 2005-08-04 | Canon Inc | 半導体部材とその製造方法、及び半導体装置 |
US8399331B2 (en) | 2007-10-06 | 2013-03-19 | Solexel | Laser processing for high-efficiency thin crystalline silicon solar cell fabrication |
US9508886B2 (en) | 2007-10-06 | 2016-11-29 | Solexel, Inc. | Method for making a crystalline silicon solar cell substrate utilizing flat top laser beam |
JP2007297657A (ja) * | 2006-04-28 | 2007-11-15 | Canon Inc | 吸着パット及び基板処理装置 |
JP2008019495A (ja) * | 2006-07-14 | 2008-01-31 | Ebara Corp | 多孔質体の洗浄方法および洗浄装置 |
US20080264477A1 (en) * | 2006-10-09 | 2008-10-30 | Soltaix, Inc. | Methods for manufacturing three-dimensional thin-film solar cells |
US8035027B2 (en) * | 2006-10-09 | 2011-10-11 | Solexel, Inc. | Solar module structures and assembly methods for pyramidal three-dimensional thin-film solar cells |
US8035028B2 (en) * | 2006-10-09 | 2011-10-11 | Solexel, Inc. | Pyramidal three-dimensional thin-film solar cells |
US8193076B2 (en) | 2006-10-09 | 2012-06-05 | Solexel, Inc. | Method for releasing a thin semiconductor substrate from a reusable template |
US8168465B2 (en) | 2008-11-13 | 2012-05-01 | Solexel, Inc. | Three-dimensional semiconductor template for making high efficiency thin-film solar cells |
US7999174B2 (en) * | 2006-10-09 | 2011-08-16 | Solexel, Inc. | Solar module structures and assembly methods for three-dimensional thin-film solar cells |
WO2009114108A2 (en) * | 2008-03-08 | 2009-09-17 | Crystal Solar, Inc. | Integrated method and system for manufacturing monolithic panels of crystalline solar cells |
US9890465B2 (en) * | 2009-01-15 | 2018-02-13 | Trutag Technologies, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
US8906218B2 (en) * | 2010-05-05 | 2014-12-09 | Solexel, Inc. | Apparatus and methods for uniformly forming porous semiconductor on a substrate |
MY170119A (en) | 2009-01-15 | 2019-07-05 | Trutag Tech Inc | Porous silicon electro-etching system and method |
US8999058B2 (en) * | 2009-05-05 | 2015-04-07 | Solexel, Inc. | High-productivity porous semiconductor manufacturing equipment |
US9076642B2 (en) * | 2009-01-15 | 2015-07-07 | Solexel, Inc. | High-Throughput batch porous silicon manufacturing equipment design and processing methods |
US9318644B2 (en) | 2009-05-05 | 2016-04-19 | Solexel, Inc. | Ion implantation and annealing for thin film crystalline solar cells |
CN102763226B (zh) | 2009-12-09 | 2016-01-27 | 速力斯公司 | 使用薄平面半导体的高效光伏背触点太阳能电池结构和制造方法 |
CN102844883B (zh) | 2010-02-12 | 2016-01-20 | 速力斯公司 | 用于制造光电池和微电子器件的半导体衬底的双面可重复使用的模板 |
ITMI20100407A1 (it) * | 2010-03-12 | 2011-09-13 | Rise Technology S R L | Cella foto-voltaica con regioni di semiconduttore poroso per ancorare terminali di contatto |
JP5489855B2 (ja) | 2010-05-14 | 2014-05-14 | キヤノン株式会社 | 固体撮像装置の製造方法 |
WO2011156657A2 (en) | 2010-06-09 | 2011-12-15 | Solexel, Inc. | High productivity thin film deposition method and system |
JP5715351B2 (ja) * | 2010-06-30 | 2015-05-07 | キヤノン株式会社 | 半導体装置およびその製造方法、ならびに固体撮像装置 |
EP2601687A4 (de) | 2010-08-05 | 2018-03-07 | Solexel, Inc. | Rückseitenverstärkung und vernetzungsmittel für solarzellen |
KR101347681B1 (ko) * | 2010-09-24 | 2014-01-06 | 솔렉셀, 인크. | 고생산성 배치 다공성 실리콘 제조 장치 디자인 및 가공 방법 |
EP2652774B1 (de) * | 2010-11-03 | 2017-10-11 | Solexel, Inc. | Vorrichtung und verfahren zur gleichmässigen herstellung poröser halbleiter auf einem substrat |
US8992746B2 (en) * | 2010-12-02 | 2015-03-31 | Dainippon Screen Mfg. Co., Ltd. | Anodizing apparatus |
EP2710639A4 (de) | 2011-05-20 | 2015-11-25 | Solexel Inc | Selbstaktivierte vorderseiten-vorspannung für eine solarzelle |
JP5908266B2 (ja) * | 2011-11-30 | 2016-04-26 | 株式会社Screenホールディングス | 陽極化成装置及びそれを備えた陽極化成システム並びに半導体ウエハ |
JP6189656B2 (ja) | 2013-06-14 | 2017-08-30 | Kyb株式会社 | 給電部材及びそれを備えた高速めっき装置 |
JP6193005B2 (ja) | 2013-06-14 | 2017-09-06 | Kyb株式会社 | 保持装置及びそれを備えた高速めっき装置 |
FR3020642B1 (fr) * | 2014-04-30 | 2021-07-02 | Turbomeca | Dispositif destine a la mise en oeuvre d'un traitement d'anodisation |
FR3039564B1 (fr) * | 2015-07-31 | 2017-08-25 | Silimixt | Dispositif de support pour substrat a traiter notamment par voie chimique ou electrochimique |
FR3039563B1 (fr) * | 2015-07-31 | 2017-08-25 | Silimixt | Dispositif de support adaptable pour substrats a traiter notamment par voie chimique ou electrochimique |
CN106906506B (zh) * | 2016-12-29 | 2018-12-25 | 平湖瑞星金属工艺有限公司 | 一种通讯设备表面氧化处理的夹具 |
JP6847691B2 (ja) * | 2017-02-08 | 2021-03-24 | 株式会社荏原製作所 | めっき装置およびめっき装置とともに使用される基板ホルダ |
ES2816180T3 (es) * | 2018-02-26 | 2021-03-31 | Cockerill Maintenance & Ingenierie Sa | Instalación y método de tratamiento superficial localizado para piezas industriales |
CN109056049B (zh) * | 2018-08-16 | 2020-08-04 | 湖南文理学院 | 一种纳米多孔硅双凹透镜的制备方法 |
JP2020105590A (ja) | 2018-12-27 | 2020-07-09 | キオクシア株式会社 | 基板処理装置および基板処理方法 |
KR20200104691A (ko) * | 2019-02-27 | 2020-09-04 | 주식회사 만도 | 아노다이징 장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2737488A (en) * | 1952-11-20 | 1956-03-06 | Western Electric Co | Electroplating apparatus |
US2801965A (en) * | 1954-05-06 | 1957-08-06 | Western Electric Co | Plating rack |
CH335913A (de) * | 1956-11-08 | 1959-01-31 | Robert Dr Weynschenk | Einrichtung zur teilweisen Galvanisierung von profilierten Gehäusekörpern |
CH460975A (fr) * | 1967-05-05 | 1968-08-15 | Charmilles Sa Ateliers | Dispositif d'amenée de courant à une pièce à usiner par usinage électro-chimique |
DE1931174B2 (de) * | 1969-06-19 | 1975-09-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Einrichtung zum elektrolytischen Durchlaufpolieren von stabförmigen Werkstücken aus Zirkortlegierungen |
US3835017A (en) * | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
CH578054A5 (en) * | 1973-09-07 | 1976-07-30 | Oxy Metal Finishing Corp | Jigs for selective electroplating - using inflatable balloons to mask the interior of the workpieces being plated |
FR2315028A1 (fr) * | 1975-06-17 | 1977-01-14 | Quadrimetal Offset | Organes de prehension gonflables |
US4430179A (en) * | 1981-08-03 | 1984-02-07 | Olin Corporation | Portable method for filter press cell assembly |
US4605483A (en) * | 1984-11-06 | 1986-08-12 | Michaelson Henry W | Electrode for electro-plating non-continuously conductive surfaces |
FR2615207B1 (fr) * | 1987-05-14 | 1991-11-22 | Framatome Sa | Canne tubulaire pour le traitement de la surface interieure d'un tube |
US4898653A (en) * | 1988-09-26 | 1990-02-06 | The Dow Chemical Company | Combination electrolysis cell seal member and membrane tentering means |
-
1993
- 1993-11-08 US US08/148,341 patent/US5458755A/en not_active Expired - Lifetime
- 1993-11-08 EP EP93118093A patent/EP0597428B1/de not_active Expired - Lifetime
- 1993-11-08 DE DE69312636T patent/DE69312636T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5458755A (en) | 1995-10-17 |
EP0597428B1 (de) | 1997-07-30 |
DE69312636D1 (de) | 1997-09-04 |
EP0597428A1 (de) | 1994-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |