DE3850664D1 - Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche. - Google Patents
Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche.Info
- Publication number
- DE3850664D1 DE3850664D1 DE3850664T DE3850664T DE3850664D1 DE 3850664 D1 DE3850664 D1 DE 3850664D1 DE 3850664 T DE3850664 T DE 3850664T DE 3850664 T DE3850664 T DE 3850664T DE 3850664 D1 DE3850664 D1 DE 3850664D1
- Authority
- DE
- Germany
- Prior art keywords
- scratching
- automatically
- oxidized surface
- oxidized
- automatically scratching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2474387A | 1987-03-11 | 1987-03-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3850664D1 true DE3850664D1 (de) | 1994-08-18 |
DE3850664T2 DE3850664T2 (de) | 1994-10-20 |
Family
ID=21822168
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883882158 Expired - Fee Related DE3882158T2 (de) | 1987-03-11 | 1988-03-11 | Gerät zum automatischen Reinigen einer Oberfläche. |
DE19883850664 Expired - Fee Related DE3850664T2 (de) | 1987-03-11 | 1988-03-11 | Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883882158 Expired - Fee Related DE3882158T2 (de) | 1987-03-11 | 1988-03-11 | Gerät zum automatischen Reinigen einer Oberfläche. |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP0283219B1 (de) |
JP (1) | JPS63252438A (de) |
DE (2) | DE3882158T2 (de) |
HK (1) | HK43394A (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4980637A (en) * | 1988-03-01 | 1990-12-25 | Hewlett-Packard Company | Force delivery system for improved precision membrane probe |
EP0425744A1 (de) * | 1989-11-02 | 1991-05-08 | Hewlett-Packard Company | Membransonde mit automatischer Reinigung der Kontakte |
US5461326A (en) * | 1993-02-25 | 1995-10-24 | Hughes Aircraft Company | Self leveling and self tensioning membrane test probe |
US5621333A (en) * | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
US6046599A (en) * | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
US6259260B1 (en) | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
US6343369B1 (en) | 1998-09-15 | 2002-01-29 | Microconnect, Inc. | Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
US6562636B1 (en) | 1999-07-14 | 2003-05-13 | Aehr Test Systems | Wafer level burn-in and electrical test system and method |
KR100735111B1 (ko) * | 1999-07-14 | 2007-07-06 | 에어 테스트 시스템즈 | 번인 또는 테스트 시스템 카트리지 |
US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
US6340895B1 (en) | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
US6496026B1 (en) | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
US20080106292A1 (en) * | 2006-11-02 | 2008-05-08 | Corad Technology, Inc. | Probe card having cantilever probes |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3702439A (en) * | 1970-08-12 | 1972-11-07 | Bell Telephone Labor Inc | Low impedance fixed point test probe |
CA1044379A (en) * | 1974-12-28 | 1978-12-12 | Sony Corporation | Wafer transfer device |
DE2613858B1 (de) * | 1976-03-31 | 1977-07-14 | Siemens Ag | Verfahren und vorrichtung zum pruefen elektronischer baugruppen |
US4649339A (en) * | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
-
1988
- 1988-03-11 DE DE19883882158 patent/DE3882158T2/de not_active Expired - Fee Related
- 1988-03-11 EP EP19880302142 patent/EP0283219B1/de not_active Expired - Lifetime
- 1988-03-11 JP JP63057753A patent/JPS63252438A/ja active Pending
- 1988-03-11 DE DE19883850664 patent/DE3850664T2/de not_active Expired - Fee Related
- 1988-03-11 EP EP89203096A patent/EP0369554B1/de not_active Expired - Lifetime
-
1994
- 1994-05-05 HK HK43394A patent/HK43394A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP0369554A2 (de) | 1990-05-23 |
DE3882158T2 (de) | 1994-01-27 |
EP0369554B1 (de) | 1994-07-13 |
DE3882158D1 (de) | 1993-08-12 |
EP0283219B1 (de) | 1993-07-07 |
EP0283219A3 (en) | 1988-09-28 |
HK43394A (en) | 1994-05-13 |
EP0283219A2 (de) | 1988-09-21 |
JPS63252438A (ja) | 1988-10-19 |
DE3850664T2 (de) | 1994-10-20 |
EP0369554A3 (de) | 1991-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |