HK43394A - Apparatus for automatically scrubbing a surface - Google Patents
Apparatus for automatically scrubbing a surfaceInfo
- Publication number
- HK43394A HK43394A HK43394A HK43394A HK43394A HK 43394 A HK43394 A HK 43394A HK 43394 A HK43394 A HK 43394A HK 43394 A HK43394 A HK 43394A HK 43394 A HK43394 A HK 43394A
- Authority
- HK
- Hong Kong
- Prior art keywords
- automatically scrubbing
- scrubbing
- automatically
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Connecting Device With Holders (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2474387A | 1987-03-11 | 1987-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK43394A true HK43394A (en) | 1994-05-13 |
Family
ID=21822168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK43394A HK43394A (en) | 1987-03-11 | 1994-05-05 | Apparatus for automatically scrubbing a surface |
Country Status (4)
Country | Link |
---|---|
EP (2) | EP0283219B1 (de) |
JP (1) | JPS63252438A (de) |
DE (2) | DE3850664T2 (de) |
HK (1) | HK43394A (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4980637A (en) * | 1988-03-01 | 1990-12-25 | Hewlett-Packard Company | Force delivery system for improved precision membrane probe |
EP0425744A1 (de) * | 1989-11-02 | 1991-05-08 | Hewlett-Packard Company | Membransonde mit automatischer Reinigung der Kontakte |
US5461326A (en) * | 1993-02-25 | 1995-10-24 | Hughes Aircraft Company | Self leveling and self tensioning membrane test probe |
US5621333A (en) * | 1995-05-19 | 1997-04-15 | Microconnect, Inc. | Contact device for making connection to an electronic circuit device |
US6046599A (en) * | 1996-05-20 | 2000-04-04 | Microconnect, Inc. | Method and device for making connection |
US6259260B1 (en) | 1998-07-30 | 2001-07-10 | Intest Ip Corporation | Apparatus for coupling a test head and probe card in a wafer testing system |
US6343369B1 (en) | 1998-09-15 | 2002-01-29 | Microconnect, Inc. | Methods for making contact device for making connection to an electronic circuit device and methods of using the same |
US6562636B1 (en) | 1999-07-14 | 2003-05-13 | Aehr Test Systems | Wafer level burn-in and electrical test system and method |
US6340895B1 (en) | 1999-07-14 | 2002-01-22 | Aehr Test Systems, Inc. | Wafer-level burn-in and test cartridge |
US6580283B1 (en) | 1999-07-14 | 2003-06-17 | Aehr Test Systems | Wafer level burn-in and test methods |
EP1445620A1 (de) * | 1999-07-14 | 2004-08-11 | Aehr Test Systems, Inc. | Verfahren zum Einbrennen (Burn-In) oder Testen eines Wafers, das eine Kassette zum Einbrennen oder Testen benutzt |
US6496026B1 (en) | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
US20080106292A1 (en) * | 2006-11-02 | 2008-05-08 | Corad Technology, Inc. | Probe card having cantilever probes |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3702439A (en) * | 1970-08-12 | 1972-11-07 | Bell Telephone Labor Inc | Low impedance fixed point test probe |
CA1044379A (en) * | 1974-12-28 | 1978-12-12 | Sony Corporation | Wafer transfer device |
DE2613858B1 (de) * | 1976-03-31 | 1977-07-14 | Siemens Ag | Verfahren und vorrichtung zum pruefen elektronischer baugruppen |
US4649339A (en) * | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
-
1988
- 1988-03-11 EP EP19880302142 patent/EP0283219B1/de not_active Expired - Lifetime
- 1988-03-11 EP EP89203096A patent/EP0369554B1/de not_active Expired - Lifetime
- 1988-03-11 DE DE19883850664 patent/DE3850664T2/de not_active Expired - Fee Related
- 1988-03-11 JP JP63057753A patent/JPS63252438A/ja active Pending
- 1988-03-11 DE DE19883882158 patent/DE3882158T2/de not_active Expired - Fee Related
-
1994
- 1994-05-05 HK HK43394A patent/HK43394A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP0369554A3 (de) | 1991-03-27 |
EP0369554B1 (de) | 1994-07-13 |
DE3882158D1 (de) | 1993-08-12 |
JPS63252438A (ja) | 1988-10-19 |
DE3882158T2 (de) | 1994-01-27 |
EP0369554A2 (de) | 1990-05-23 |
EP0283219A3 (en) | 1988-09-28 |
DE3850664D1 (de) | 1994-08-18 |
EP0283219A2 (de) | 1988-09-21 |
EP0283219B1 (de) | 1993-07-07 |
DE3850664T2 (de) | 1994-10-20 |
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