DE69308804T2 - Testverfahren für Elemente von integrierten Schaltungen und dazugehöriges integriertes Element - Google Patents
Testverfahren für Elemente von integrierten Schaltungen und dazugehöriges integriertes ElementInfo
- Publication number
- DE69308804T2 DE69308804T2 DE69308804T DE69308804T DE69308804T2 DE 69308804 T2 DE69308804 T2 DE 69308804T2 DE 69308804 T DE69308804 T DE 69308804T DE 69308804 T DE69308804 T DE 69308804T DE 69308804 T2 DE69308804 T2 DE 69308804T2
- Authority
- DE
- Germany
- Prior art keywords
- test
- demultiplexer
- wafer
- chips
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
- G01R31/318511—Wafer Test
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9215997A FR2700063B1 (fr) | 1992-12-31 | 1992-12-31 | Procédé de test de puces de circuit intégré et dispositif intégré correspondant. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69308804D1 DE69308804D1 (de) | 1997-04-17 |
DE69308804T2 true DE69308804T2 (de) | 1997-06-19 |
Family
ID=9437350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69308804T Expired - Fee Related DE69308804T2 (de) | 1992-12-31 | 1993-12-27 | Testverfahren für Elemente von integrierten Schaltungen und dazugehöriges integriertes Element |
Country Status (5)
Country | Link |
---|---|
US (1) | US5608335A (de) |
EP (1) | EP0606805B1 (de) |
JP (1) | JPH0737947A (de) |
DE (1) | DE69308804T2 (de) |
FR (1) | FR2700063B1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19936321C2 (de) * | 1999-08-02 | 2003-12-24 | Infineon Technologies Ag | Anordnung und Verfahren zum Testen einer Vielzahl von Halbleiterchips auf Waferebene |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5969538A (en) | 1996-10-31 | 1999-10-19 | Texas Instruments Incorporated | Semiconductor wafer with interconnect between dies for testing and a process of testing |
US6046600A (en) * | 1995-10-31 | 2000-04-04 | Texas Instruments Incorporated | Process of testing integrated circuit dies on a wafer |
JPH1070243A (ja) * | 1996-05-30 | 1998-03-10 | Toshiba Corp | 半導体集積回路装置およびその検査方法およびその検査装置 |
US6750527B1 (en) * | 1996-05-30 | 2004-06-15 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method |
JP3696352B2 (ja) * | 1996-12-17 | 2005-09-14 | 三菱電機株式会社 | ライフタイム評価用teg |
US6121065A (en) * | 1997-09-26 | 2000-09-19 | Institute Of Microelectronics | Wafer scale burn-in testing |
US6405335B1 (en) | 1998-02-25 | 2002-06-11 | Texas Instruments Incorporated | Position independent testing of circuits |
DE19808664C2 (de) * | 1998-03-02 | 2002-03-14 | Infineon Technologies Ag | Integrierte Schaltung und Verfahren zu ihrer Prüfung |
DE19819570C2 (de) * | 1998-04-30 | 2000-06-15 | Siemens Ag | Anordnung zum Testen mehrerer Speicherchips auf einem Wafer |
US6233184B1 (en) * | 1998-11-13 | 2001-05-15 | International Business Machines Corporation | Structures for wafer level test and burn-in |
US6140833A (en) * | 1998-11-16 | 2000-10-31 | Siemens Aktiengesellschaft | In-situ measurement method and apparatus for semiconductor processing |
JP3484365B2 (ja) * | 1999-01-19 | 2004-01-06 | シャープ株式会社 | 半導体装置用パッケージ、この半導体装置用パッケージのテスト時に使用するプローブカード、および、このプローブカードを用いたパッケージのテスト方法 |
US7058862B2 (en) * | 2000-05-26 | 2006-06-06 | Texas Instruments Incorporated | Selecting different 1149.1 TAP domains from update-IR state |
JP3483130B2 (ja) * | 1999-11-29 | 2004-01-06 | 松下電器産業株式会社 | 集積回路の検査方法 |
US6728915B2 (en) | 2000-01-10 | 2004-04-27 | Texas Instruments Incorporated | IC with shared scan cells selectively connected in scan path |
US6769080B2 (en) | 2000-03-09 | 2004-07-27 | Texas Instruments Incorporated | Scan circuit low power adapter with counter |
US6603323B1 (en) * | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
JP4170220B2 (ja) * | 2001-09-28 | 2008-10-22 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 集積回路を製造する方法と、この方法によって得られる集積回路と、この方法によって得られる集積回路が設けられているウェハと、この方法によって得られる集積回路を有するシステム |
US20040051550A1 (en) * | 2002-09-12 | 2004-03-18 | Ma David Suitwai | Semiconductor die isolation system |
DE102004001956B4 (de) * | 2004-01-13 | 2007-02-01 | Infineon Technologies Ag | Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen |
US7307433B2 (en) * | 2004-04-21 | 2007-12-11 | Formfactor, Inc. | Intelligent probe card architecture |
DE102005034494A1 (de) * | 2005-07-20 | 2007-01-25 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Verfahren zur Herstellung von Speichermodulen |
KR100636502B1 (ko) * | 2005-08-31 | 2006-10-18 | 삼성에스디아이 주식회사 | 원장단위 검사가 가능한 유기 전계발광표시장치 및 그검사방법 |
KR100754140B1 (ko) * | 2005-12-21 | 2007-08-31 | 삼성에스디아이 주식회사 | 원장단위 검사가 가능한 유기 발광 표시장치 및 모기판과그 검사방법 |
US7405585B2 (en) * | 2006-02-14 | 2008-07-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Versatile semiconductor test structure array |
KR100759688B1 (ko) * | 2006-04-07 | 2007-09-17 | 삼성에스디아이 주식회사 | 원장단위 검사가 가능한 유기전계발광 표시장치 및모기판과 그 검사방법 |
KR100793558B1 (ko) * | 2006-09-18 | 2008-01-14 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그의 모기판과 유기전계발광표시장치의 제조방법 |
US7719299B2 (en) * | 2008-04-02 | 2010-05-18 | Texas Instruments Incorporated | Process and temperature insensitive flicker noise monitor circuit |
JP5412667B2 (ja) * | 2008-12-26 | 2014-02-12 | 独立行政法人産業技術総合研究所 | 積層lsiチップのシステム検査のための方法および検査システム |
USD751555S1 (en) * | 2013-03-05 | 2016-03-15 | Japan Electronic Materials Corp. | Probe card case |
KR102047005B1 (ko) * | 2013-05-31 | 2019-11-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 패널 |
CN105788510A (zh) * | 2014-12-17 | 2016-07-20 | 昆山国显光电有限公司 | Oled显示装置及其老化方法 |
CN105632383B (zh) | 2016-01-11 | 2018-09-11 | 京东方科技集团股份有限公司 | 一种测试电路、测试方法、显示面板及显示装置 |
CN112710942B (zh) * | 2021-03-24 | 2021-06-08 | 上海伟测半导体科技股份有限公司 | 晶圆区域性问题的分析系统及方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849872A (en) * | 1972-10-24 | 1974-11-26 | Ibm | Contacting integrated circuit chip terminal through the wafer kerf |
US4038648A (en) * | 1974-06-03 | 1977-07-26 | Chesley Gilman D | Self-configurable circuit structure for achieving wafer scale integration |
US4281449A (en) * | 1979-12-21 | 1981-08-04 | Harris Corporation | Method for qualifying biased burn-in integrated circuits on a wafer level |
US4467400A (en) * | 1981-01-16 | 1984-08-21 | Burroughs Corporation | Wafer scale integrated circuit |
US4426773A (en) * | 1981-05-15 | 1984-01-24 | General Electric Ceramics, Inc. | Array of electronic packaging substrates |
US4635261A (en) * | 1985-06-26 | 1987-01-06 | Motorola, Inc. | On chip test system for configurable gate arrays |
DE3526485A1 (de) * | 1985-07-24 | 1987-02-05 | Heinz Krug | Schaltungsanordnung zum pruefen integrierter schaltungseinheiten |
DE3682344D1 (de) * | 1985-08-29 | 1991-12-12 | Mitsubishi Electric Corp | Geraet zur erkennung der stelle fehlerhafter lichtemissionselemente in einem grossen bildschirmanzeigesystem. |
WO1988002549A1 (en) * | 1986-09-26 | 1988-04-07 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
US5121053A (en) * | 1988-10-11 | 1992-06-09 | Hewlett-Packard Company | Tab frame and process of testing same |
US5008614A (en) * | 1988-10-11 | 1991-04-16 | Hewlett-Packard Company | TAB frame and process of testing same |
US4956602A (en) * | 1989-02-14 | 1990-09-11 | Amber Engineering, Inc. | Wafer scale testing of redundant integrated circuit dies |
US5012187A (en) * | 1989-11-03 | 1991-04-30 | Motorola, Inc. | Method for parallel testing of semiconductor devices |
US5038101A (en) * | 1990-03-15 | 1991-08-06 | R.H. Murphy Co., Inc. | Carriers for electrical components in transistor outline packages |
US5126657A (en) * | 1990-11-02 | 1992-06-30 | Sun Microsystems, Inc. | Apparatus for testing computer chips in the chips normal operating environment |
US5315241A (en) * | 1991-09-18 | 1994-05-24 | Sgs-Thomson Microelectronics, Inc. | Method for testing integrated circuits |
US5457400A (en) * | 1992-04-10 | 1995-10-10 | Micron Technology, Inc. | Semiconductor array having built-in test circuit for wafer level testing |
-
1992
- 1992-12-31 FR FR9215997A patent/FR2700063B1/fr not_active Expired - Fee Related
-
1993
- 1993-12-27 US US08/173,176 patent/US5608335A/en not_active Expired - Lifetime
- 1993-12-27 DE DE69308804T patent/DE69308804T2/de not_active Expired - Fee Related
- 1993-12-27 EP EP93403186A patent/EP0606805B1/de not_active Expired - Lifetime
- 1993-12-28 JP JP5349907A patent/JPH0737947A/ja not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19936321C2 (de) * | 1999-08-02 | 2003-12-24 | Infineon Technologies Ag | Anordnung und Verfahren zum Testen einer Vielzahl von Halbleiterchips auf Waferebene |
Also Published As
Publication number | Publication date |
---|---|
FR2700063A1 (fr) | 1994-07-01 |
EP0606805A1 (de) | 1994-07-20 |
FR2700063B1 (fr) | 1995-02-10 |
DE69308804D1 (de) | 1997-04-17 |
JPH0737947A (ja) | 1995-02-07 |
US5608335A (en) | 1997-03-04 |
EP0606805B1 (de) | 1997-03-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |