DE69304086D1 - Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden - Google Patents

Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden

Info

Publication number
DE69304086D1
DE69304086D1 DE69304086T DE69304086T DE69304086D1 DE 69304086 D1 DE69304086 D1 DE 69304086D1 DE 69304086 T DE69304086 T DE 69304086T DE 69304086 T DE69304086 T DE 69304086T DE 69304086 D1 DE69304086 D1 DE 69304086D1
Authority
DE
Germany
Prior art keywords
polyimides
resin compositions
moldings
processes
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69304086T
Other languages
English (en)
Other versions
DE69304086T2 (de
Inventor
Hidekazu Matsuura
Yoshihide Iwasaki
Kaori Ikeda
Takayuki Suzuki
Masashi Tanaka
Yasuo Miyadera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4000810A external-priority patent/JP3010871B2/ja
Priority claimed from JP04003124A external-priority patent/JP3144013B2/ja
Priority claimed from JP4153943A external-priority patent/JPH05339344A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE69304086D1 publication Critical patent/DE69304086D1/de
Publication of DE69304086T2 publication Critical patent/DE69304086T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/928—Polyimide or polyamide-acid formed by condensation of a polyamine with a polycarboxylic acid having at least three carboxyl groups or derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
DE1993604086 1992-01-07 1993-01-06 Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden Expired - Fee Related DE69304086T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP4000810A JP3010871B2 (ja) 1992-01-07 1992-01-07 熱硬化性樹脂組成物
JP04003124A JP3144013B2 (ja) 1992-01-10 1992-01-10 新規なポリイミド及びその製造法
JP4153943A JPH05339344A (ja) 1992-06-15 1992-06-15 熱硬化性樹脂組成物、接着剤シート、接着剤付きポリイミドフィルム及び金属はく張りポリイミドフィルム

Publications (2)

Publication Number Publication Date
DE69304086D1 true DE69304086D1 (de) 1996-09-26
DE69304086T2 DE69304086T2 (de) 1997-04-03

Family

ID=27274614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1993604086 Expired - Fee Related DE69304086T2 (de) 1992-01-07 1993-01-06 Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden

Country Status (3)

Country Link
US (2) US5510425A (de)
EP (1) EP0553612B1 (de)
DE (1) DE69304086T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923848B2 (ja) * 1995-03-03 1999-07-26 株式会社巴川製紙所 新規なポリイミド及びその製造方法
JP2961642B2 (ja) * 1995-05-31 1999-10-12 株式会社巴川製紙所 電子部品用接着テープおよび液状接着剤
JP3689518B2 (ja) * 1997-02-18 2005-08-31 新日鐵化学株式会社 電子材料用樹脂溶液組成物
JP3347026B2 (ja) * 1997-07-23 2002-11-20 株式会社巴川製紙所 電子部品用接着テープ
EP1114845B1 (de) * 1998-08-21 2004-07-28 Hitachi Chemical Company, Ltd. Pastenzusammensetzung, schutzfilm und daraus hergestellte halbleitervorrichtung
US6790930B1 (en) * 1999-10-06 2004-09-14 Kaneka Corporation Process for producing polyimide resin
US6740728B2 (en) * 2002-05-24 2004-05-25 Praxair Technology, Inc. Methods for the preparation of polyesters, poly(ester amide)s and poly(ester imide)s and uses of the materials obtained therefrom
EP1420048A3 (de) * 2002-11-14 2005-09-21 Mitsui Chemicals, Inc. Metalllaminat
TWI327336B (en) * 2003-01-13 2010-07-11 Oc Oerlikon Balzers Ag Arrangement for processing a substrate
JPWO2004075293A1 (ja) * 2003-02-19 2006-06-01 日立化成工業株式会社 半導体用接着フィルム、これを用いた接着フィルム付金属板、接着フィルム付配線回路及び半導体装置並びに半導体装置の製造方法
US7204574B2 (en) * 2004-06-30 2007-04-17 Lexmark International, Inc. Polyimide thickfilm flow feature photoresist and method of applying same
JP5041271B2 (ja) * 2005-05-31 2012-10-03 宇部興産株式会社 加熱硬化性溶液組成物および未硬化樹脂複合体
JP5641942B2 (ja) * 2008-12-26 2014-12-17 三菱瓦斯化学株式会社 樹脂複合銅箔
CN102421849B (zh) * 2009-05-08 2013-08-28 三菱瓦斯化学株式会社 热固性聚酰亚胺树脂组合物、固化物及粘合剂
KR101444694B1 (ko) * 2009-05-25 2014-10-01 에스케이이노베이션 주식회사 연성금속박적층체 및 이의 제조방법
US8735733B2 (en) * 2011-01-18 2014-05-27 Hitachi Chemical Company, Ltd. Resin composition, prepreg laminate obtained with the same and printed-wiring board
US9296928B2 (en) * 2011-07-28 2016-03-29 Protavic Korea Co., Ltd. Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive
TWI492967B (zh) * 2011-12-30 2015-07-21 Ind Tech Res Inst 聚亞醯胺

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482958B1 (de) * 1969-08-20 1973-01-27
US4294877A (en) * 1979-04-05 1981-10-13 E. I. Du Pont De Nemours And Company Epoxy imide compositions
US4629777A (en) * 1983-05-18 1986-12-16 Ciba-Geigy Corporation Polyimides, a process for their preparation and their use
US4519941A (en) * 1983-08-09 1985-05-28 National Starch And Chemical Corporation Metal-filled polyimide/polyepoxide blends of improved electrical conductivity
DE3525337A1 (de) * 1984-12-13 1986-06-19 Bayer Ag, 5090 Leverkusen Verwendung von speziellen polyphenylenoxiden zur herstellung von aromatischen block-polyether-poly(ester)-carbonaten nach dem phasengrenzflaechenverfahren
DE3507879A1 (de) * 1985-03-06 1986-09-11 Hüls AG, 4370 Marl Polyimide und verfahren zu ihrer herstellung
DE3542833A1 (de) * 1985-12-04 1987-06-11 Basf Ag Vollaromatische mesomorphe polyetheresterimide, deren herstellung und verwendung
FR2592050B1 (fr) * 1985-12-24 1988-01-08 Centre Etd Mat Org Tech Avance Copolyimides arylaliphatiques a enchainements ether, leur preparation, leurs melanges ou produits de reaction avec des resines epoxydes et leur utilisation pour la fabrication de materiaux composites flexibles
US5171829A (en) * 1986-04-25 1992-12-15 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film
US4820779A (en) * 1986-07-01 1989-04-11 National Starch And Chemical Corporation Adduct of a carbinol-containing polyimide oligomer terminated with epoxide-reactive groups and a polyepoxide
JP2573595B2 (ja) * 1987-03-09 1997-01-22 鐘淵化学工業株式会社 ポリイミド膜
AU599517B2 (en) * 1987-10-23 1990-07-19 Mitsui Toatsu Chemicals Inc. Method for preparing polyimide and composite material thereof
US5021519A (en) * 1988-03-24 1991-06-04 Aluminum Company Of America Epoxy-polyimide blend for low temperature cure, high-performance resin system and composites
US4987197A (en) * 1988-05-06 1991-01-22 Mitsui Toatsu Chemicals, Inc. Polyimide/polyamideimide resin composition
US4956393A (en) * 1988-08-29 1990-09-11 Basf Aktiengesellschaft Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction
US5237044A (en) * 1988-10-20 1993-08-17 Mitsui Toatsu Chemicals, Inc. Polyimide sheet and preparation process of the sheet
US5037689A (en) * 1989-02-17 1991-08-06 Basf Aktiengesellschaft Toughened thermosetting structural materials
DE59010515D1 (de) * 1989-03-17 1996-10-31 Sumitomo Chemical Co Neue Polyarylenether
US5171828A (en) * 1989-10-26 1992-12-15 Occidental Chemical Corporation Copolyimide ODPA/BPDA/4,4'-ODA or P-PDA
US5145937A (en) * 1989-11-09 1992-09-08 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides with carbonyl and ether connecting groups between the aromatic rings
US5153303A (en) * 1990-01-19 1992-10-06 Ciba-Geigy Corporation Polyimides prepared from disubstituted aromatic tetracarboxylic acid dianhydrides
US5231160A (en) * 1990-09-07 1993-07-27 Mitsui Toatsu Chemicals, Incorporated Aromatic diamine compound, preparation process of same and polyimide prepared from same
US5112942A (en) * 1990-09-26 1992-05-12 Ethyl Corporation Polymide compositions
EP0479722B1 (de) * 1990-10-02 1996-11-13 Ciba-Geigy Ag Lösliche Polyimide
US5175240A (en) * 1990-12-17 1992-12-29 E.I. Du Pont De Nemours And Company Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5171822A (en) * 1991-02-11 1992-12-15 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Low toxicity high temperature pmr polyimide

Also Published As

Publication number Publication date
EP0553612B1 (de) 1996-08-21
DE69304086T2 (de) 1997-04-03
EP0553612A2 (de) 1993-08-04
US5508357A (en) 1996-04-16
US5510425A (en) 1996-04-23
EP0553612A3 (en) 1993-12-22

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8364 No opposition during term of opposition
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