DE69311290D1 - Hitzehaertbare harzzusammensetzung und deren herstellung aus kupferkaschierten schichtstoffplatten - Google Patents

Hitzehaertbare harzzusammensetzung und deren herstellung aus kupferkaschierten schichtstoffplatten

Info

Publication number
DE69311290D1
DE69311290D1 DE69311290T DE69311290T DE69311290D1 DE 69311290 D1 DE69311290 D1 DE 69311290D1 DE 69311290 T DE69311290 T DE 69311290T DE 69311290 T DE69311290 T DE 69311290T DE 69311290 D1 DE69311290 D1 DE 69311290D1
Authority
DE
Germany
Prior art keywords
copper
production
heat
resin composition
curable resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69311290T
Other languages
English (en)
Other versions
DE69311290T2 (de
Inventor
Tadayuki Hosogane
Hiroshi Nakajima
Eiichiro Takiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Highpolymer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5114895A external-priority patent/JPH06322071A/ja
Priority claimed from JP5114896A external-priority patent/JPH06322072A/ja
Priority claimed from JP11489493A external-priority patent/JPH06322070A/ja
Application filed by Showa Highpolymer Co Ltd filed Critical Showa Highpolymer Co Ltd
Application granted granted Critical
Publication of DE69311290D1 publication Critical patent/DE69311290D1/de
Publication of DE69311290T2 publication Critical patent/DE69311290T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/065—Polyamides; Polyesteramides; Polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/48—Polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/935—Matrix admixed with synthetic fiber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE69311290T 1992-08-03 1993-07-30 Hitzehaertbare harzzusammensetzung und deren herstellung aus kupferkaschierten schichtstoffplatten Expired - Fee Related DE69311290T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP20680092 1992-08-03
JP28193392 1992-10-20
JP5114895A JPH06322071A (ja) 1993-05-17 1993-05-17 熱硬化性樹脂組成物
JP5114896A JPH06322072A (ja) 1993-05-17 1993-05-17 熱硬化性樹脂組成物
JP11489493A JPH06322070A (ja) 1993-05-17 1993-05-17 熱硬化性樹脂組成物
PCT/JP1993/001074 WO1994003517A1 (en) 1992-08-03 1993-07-30 Thermosetting resin composition and production of copper-clad laminated board therefrom

Publications (2)

Publication Number Publication Date
DE69311290D1 true DE69311290D1 (de) 1997-07-10
DE69311290T2 DE69311290T2 (de) 1997-10-30

Family

ID=27526669

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69311290T Expired - Fee Related DE69311290T2 (de) 1992-08-03 1993-07-30 Hitzehaertbare harzzusammensetzung und deren herstellung aus kupferkaschierten schichtstoffplatten

Country Status (4)

Country Link
US (1) US5439986A (de)
EP (1) EP0606500B1 (de)
DE (1) DE69311290T2 (de)
WO (1) WO1994003517A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5707730A (en) * 1993-12-20 1998-01-13 Tomoegawa Paper Co. Ltd. Adhesive for semiconductor device and reinforcing material using the same
JP3717271B2 (ja) * 1997-04-11 2005-11-16 光洋精工株式会社 可変速プーリの偏心リング
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
US6632343B1 (en) * 2000-08-30 2003-10-14 Micron Technology, Inc. Method and apparatus for electrolytic plating of surface metals
US6692818B2 (en) * 2001-06-07 2004-02-17 Matsushita Electric Industrial Co., Ltd. Method for manufacturing circuit board and circuit board and power conversion module using the same
US6866919B2 (en) * 2002-02-21 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
JP3949676B2 (ja) * 2003-07-22 2007-07-25 三井金属鉱業株式会社 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
WO2007124867A2 (de) * 2006-04-28 2007-11-08 Toho Tenax Europe Gmbh Kohlenstofffaser
KR101670087B1 (ko) 2010-03-24 2016-10-28 삼성전기주식회사 열경화성 수지, 이를 포함한 수지 조성물, 및 이를 이용하여 제조된 인쇄회로기판
CN108699238B (zh) * 2016-01-26 2021-03-12 日产化学工业株式会社 二氧化硅溶胶的芳香族聚酰胺表面改性剂
CN108047982A (zh) * 2017-11-14 2018-05-18 浙江元集新材料科技股份有限公司 一种铝基覆铜板专用高耐热粘结片的制备方法
CN109942810B (zh) * 2019-04-18 2021-07-23 四川大学 一种具有高击穿强度的芳杂环聚酰胺复合薄膜及制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374214A (en) * 1971-11-19 1983-02-15 General Electric Company Imide containing blends and polymeric compositions prepared therefrom
JPS4948680B2 (de) * 1972-03-15 1974-12-23
JPS5659834A (en) * 1979-10-10 1981-05-23 Toshiba Chem Corp Thermosetting resin composition
JPS572317A (en) * 1980-06-07 1982-01-07 Toshiba Chem Corp Thermosetting resin composition
JPS57143320A (en) * 1981-02-28 1982-09-04 Mitsubishi Gas Chem Co Inc Novel curable resin composition
US4506042A (en) * 1981-10-20 1985-03-19 Mitsui Toatsu Chemicals, Inc. Curable resin composition comprising N-(alkenylphenyl)maleimide, epoxy composition and polyamine
US4654407A (en) * 1985-08-02 1987-03-31 Amoco Corporation Aromatic bismaleimide and prepreg resin therefrom
US4861823A (en) * 1986-11-20 1989-08-29 Amoco Corporation Thermoset composition comprising aromatic cyanate ester of allyl ether of bisphenol
US4946908A (en) * 1987-07-15 1990-08-07 Hercules Incorporated Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom
US5112924A (en) * 1987-07-15 1992-05-12 Hercules Incorporated Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom
US5037689A (en) * 1989-02-17 1991-08-06 Basf Aktiengesellschaft Toughened thermosetting structural materials
FR2645540B1 (fr) * 1989-04-10 1991-06-14 Rhone Poulenc Chimie Polymeres a groupements imide a base de maleimides dont un bismaleimide siloxane et de diamines aromatiques et leur procede de preparation

Also Published As

Publication number Publication date
EP0606500A1 (de) 1994-07-20
EP0606500B1 (de) 1997-06-04
US5439986A (en) 1995-08-08
WO1994003517A1 (en) 1994-02-17
DE69311290T2 (de) 1997-10-30
EP0606500A4 (de) 1995-01-11

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee