CN108047982A - 一种铝基覆铜板专用高耐热粘结片的制备方法 - Google Patents
一种铝基覆铜板专用高耐热粘结片的制备方法 Download PDFInfo
- Publication number
- CN108047982A CN108047982A CN201711124792.3A CN201711124792A CN108047982A CN 108047982 A CN108047982 A CN 108047982A CN 201711124792 A CN201711124792 A CN 201711124792A CN 108047982 A CN108047982 A CN 108047982A
- Authority
- CN
- China
- Prior art keywords
- glue
- parts
- heat
- clad plate
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/123—Hot-melt adhesive net-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
本发明涉及一种铝基覆铜板专用高耐热粘结片的制备方法,所述制备方法包括胶水制备,制备好的胶水加入无机纳米胶液,然后将玻璃布纤维布浸入,烘烤4~8分钟制得粘结片。本发明的粘结片用于制备铝基覆铜板,它既保证了良好的耐热性能、电气性能和耐药品性能,又具备良好的冲压性能、机械强度和尺寸稳定性;生产成本较FR‑4覆铜板和CEM‑3覆铜板均低;对PCB加工工艺的适应性更强,对PCB加工设备的损耗更小,加工成本更低;原材料的生产能耗较低,污染更少,环保成本更低,符合当前世界低碳、高环保的要求。
Description
技术领域
本发明涉及复合板技术领域,特别是涉及一种具有耐高温作用,解决了铝基覆铜板在PCB加工过程中分层起泡的问题的铝基覆铜板专用高耐热粘结片的制备方法。
背景技术
随着电子产品的发展趋向多功能化,电子产品的零部件也不断向轻、薄、短、小等方面发展,尤其是高密度集成电路技术的广泛应用,对民用电子产品提出高性能化、高可靠性和高安全性的要求;对工业用电子产品提出技术性能良好、低成本、低能耗的要求。因此电子产品的核心材料------印制电路板(Printed Circuit Board,简称PCB)的基材覆铜板面临着更高的技术要求、更严峻的使用环境及更高的环保要求。
覆铜板(Copper Clad Laminate,简称CCL)主要用于生产印制电路板,是以纤维纸、玻璃纤维布或玻璃纤维无纺布(俗称玻璃毡)等作为增强材料,浸以树脂,单面或双面覆以铜箔,经热压而成的一种产品。现有的覆铜板由于制造原材料及制造结构的差异性,CCL基材的技术性能各有差异。
根据覆铜板组成结构及其增强材料的不同,现有的覆铜板可以分为以下几大类,并各具优缺点:
1、纸基覆铜板:纸基覆铜板虽然生产工艺简单、生产成本较低,但是其很多性能已不能满足很多针对电子产品高性能化的技术要求。
2、特殊增强材料基覆铜板:特殊增强基覆铜板是近几年发展起来的一类新型覆铜板,但是由于其加工工艺性较高,生产成本较高,目前仅应用于特殊要求的电子产品中。
3、玻璃纤维布基覆铜板:玻璃纤维布基覆铜板(即FR-4覆铜板),是当前CCL产品中应用最多的一个品种,其组成结构以玻璃纤维布为面料,以玻璃纤维布为芯料。FR-4覆铜板具有良好的耐热性、电气特性和良好的机械强度、耐药品性等技术性能;但是在PCB生产中不适合冲压工艺,基材的尺寸稳定性较差,薄板翘曲相对大,其生产成本相对较高。
4、复合基覆铜板:复合基(Composite Epoxy Mterial)覆铜板,在现有CCL产品中常见为玻璃纤维布/纤维纸复合基覆铜板(以下简称“CEM-1覆铜板”)、玻璃纤维布/玻璃纤维无纺布复合基覆铜板(以下简称“CEM-3覆铜板”)。其中,CEM-3覆铜板的应用仅次于FR-4覆铜板,其组成结构以玻璃纤维布为面料,以玻璃纤维无纺布为芯料。CEM-3覆铜板具有良好的冲压性能、机械加工性能,和良好的尺寸稳定性,其生产成本远低于FR-4覆铜板;但是相比FR-4,其机械强度、耐热性能相对较差,对于高集成电路和高频、高速、大容量的电气元件均无法承载。
在增强材料生产方面,玻璃纤维布的生产经过熔化、拉丝、织布、热处理、表面处理、干燥等工序,相对其它增强材料其工业成本较大,能耗大、污染重,环保成本较高;玻璃纤维无纺布的生产经过制浆、抄纸、上胶、干燥等工序,相对而言其工业成本较低,能耗较小、污染较轻,环保成本较低。两种材料各具优劣。
因此,本领域的技术人员致力于开发一种综合技术性能优良、又具备良好的机械强度和尺寸稳定性,同时生产成本、能耗和环保成本较低的覆铜板。
目前铝基覆铜板用粘结片制作方式是用二甲基甲酰胺溶解双氰胺,加入主体环氧树脂,再加入2-甲基咪唑作为催化剂混合搅拌均匀,制备好的胶水浸以玻璃布纤维布烘烤一定时间制成粘结片。该配方制成的粘结片压合成铝基覆铜板在PCB加工过程中的高温喷锡与SMT过程容易出现分层气泡现象,也就是说粘结片耐高温差,无法满足PCB制造工艺条件要求。
发明内容
本发明的目的在于为了解决现有粘结片压合成铝基覆铜板在PCB加工过程中的高温喷锡与SMT过程容易出现分层气泡现象,也就是说粘结片耐高温差,无法满足PCB制造工艺条件要求的缺陷而提供一种具有耐高温作用,解决了铝基覆铜板在PCB加工过程中分层起泡的问题的铝基覆铜板专用高耐热粘结片的制备方法。
为了实现上述目的,本发明采用以下技术方案:
一种铝基覆铜板专用高耐热粘结片的制备方法,所述制备方法包括以下步骤:
1)胶水制备:称取环氧树脂,双氰胺,2-甲基咪唑,双酚A型酚醛环氧树脂、二甲基甲酰胺,KH-560偶联剂,异佛尔酮二胺与耐热剂;在反应釜用二甲基甲酰胺溶解双氰胺与2-咪唑,加入环氧树脂与双酚A型酚醛环氧树脂搅拌4小时,再加入KH-560偶联剂搅拌2小时后一边搅拌一边加入异佛尔酮二胺与耐热剂,投放完继续搅拌5小时,最后用乳化设备乳化胶水最终制成胶水;
2)向步骤1)制备好的胶水加入无机纳米胶液,然后用1080或2116玻璃纤维布浸入胶水中,在70~200℃烘箱烘烤4~8分钟半固化,制得树脂含量50-70%的高耐热粘结片。
在本技术方案中,胶水配方里加入一定量的双酚A型酚醛环氧树脂所制得的粘结片耐热好,该粘结片压制的铝基覆铜板290度高温漂锡10分钟不分层不起泡,满足PCB高温制作工艺条件需求。
作为优选,胶水各原料以重量份数计分别为:100-125份环氧树脂,2-3份双氰胺,0.05-0.1份2-甲基咪唑,30-50份二甲基甲酰胺,300-350份氧化铝,3-5份KH-560偶联剂,3-4份异佛尔酮二胺与2-6份耐热剂。
在本技术方案中,甲醛捕捉剂中的伯胺基团与改性酚醛树脂中游离醛的羰基在45~60℃条件下可以发生亲核加成反应生成RNHCH2OH,该结构稳定性很差,可以迅速脱水生成RNH=CH2,并互相之间发生缩合反应,形成聚合物交联剂。该反应一方面可以减少体系中游离醛的含量,另一方面可以生成网络状的聚合物交联剂,可以对体系改性增韧,提高其耐热性能和粘结性。
作为优选,所述耐热剂为α-甲基苯乙烯、间规聚苯乙烯、N-苯基马来酰亚胺和AS的共聚物、N,N’-4,4’-二苯甲烷双马来酰亚胺中的一种或几种的混合物。在本技术方案中,优选日本电化学公司的N-苯基马来酰亚胺(PMI)和AS的共聚物或无锡市衡辉化学有限公司生产的α-甲基苯乙烯(α-MS)或泰安精细化工有限公司生产的N,N’-4,4’-二苯甲烷双马来酰亚胺。其主要作用是增加空间位阻,提高材料的耐热性能。
作为优选,所述无机纳米胶液为无机纳米氧化锌胶液、无机纳米氮化钛胶液或无机纳米氮化锌胶液。
本发明的有益效果:本发明的粘结片用于制备铝基覆铜板,它既保证了良好的耐热性能、电气性能和耐药品性能,又具备良好的冲压性能、机械强度和尺寸稳定性;生产成本较FR-4覆铜板和CEM-3覆铜板均低;对PCB加工工艺的适应性更强,对PCB加工设备的损耗更小,加工成本更低;原材料的生产能耗较低,污染更少,环保成本更低,符合当前世界低碳、高环保的要求。
具体实施方式
下面通过具体实施例,对本发明的技术方案作进一步具体的说明。
在本发明中,若非特指,所有设备和原料均可从市场购得或是本行业常用的,下述实施例中的方法,如无特别说明,均为本领域常规方法。
耐热剂优选日本电化学公司的N-苯基马来酰亚胺(PMI)和AS的共聚物或无锡市衡辉化学有限公司生产的α-甲基苯乙烯(α-MS)或泰安精细化工有限公司生产的N,N’-4,4’-二苯甲烷双马来酰亚胺。其主要作用是增加空间位阻,提高材料的耐热性能。
无机纳米胶液为无机纳米氧化锌胶液、无机纳米氮化钛胶液或无机纳米氮化锌胶液。
实施例1
一种铝基覆铜板专用高耐热粘结片的制备方法,所述制备方法包括以下步骤:
1)胶水制备:称取环氧树脂,双氰胺,2-甲基咪唑,双酚A型酚醛环氧树脂、二甲基甲酰胺,KH-560偶联剂,异佛尔酮二胺与耐热剂;在反应釜用二甲基甲酰胺溶解双氰胺与2-咪唑,加入环氧树脂与双酚A型酚醛环氧树脂搅拌4小时,再加入KH-560偶联剂搅拌2小时后一边搅拌一边加入异佛尔酮二胺与耐热剂,投放完继续搅拌5小时,最后用乳化设备乳化胶水最终制成胶水;
2)向步骤1)制备好的胶水加入无机纳米胶液,然后用1080玻璃纤维布浸入胶水中,在70℃烘箱烘烤4分钟半固化,制得树脂含量50-70%的高耐热粘结片。
胶水各原料以重量份数计分别为:100份环氧树脂,2份双氰胺,0.05份2-甲基咪唑,20份双酚A型酚醛环氧树脂、30份二甲基甲酰胺,3份KH-560偶联剂,3份异佛尔酮二胺与2份耐热剂。
将该粘结片用于铝基覆铜板,测试覆铜板的性能结果为剥离强度为1.67N/mm,层间粘合力为0.71-0.81N/mm,玻璃化转变温度Tg(DMA)为195℃,热失重温度Td5%loss的温度为407℃。
实施例2
一种铝基覆铜板专用高耐热粘结片的制备方法,所述制备方法包括以下步骤:
1)胶水制备:称取环氧树脂,双氰胺,2-甲基咪唑,双酚A型酚醛环氧树脂、二甲基甲酰胺,KH-560偶联剂,异佛尔酮二胺与耐热剂;在反应釜用二甲基甲酰胺溶解双氰胺与2-咪唑,加入环氧树脂与双酚A型酚醛环氧树脂搅拌4小时,再加入KH-560偶联剂搅拌2小时后一边搅拌一边加入异佛尔酮二胺与耐热剂,投放完继续搅拌5小时,最后用乳化设备乳化胶水最终制成胶水;
2)向步骤1)制备好的胶水加入无机纳米胶液,然后用1080玻璃纤维布浸入胶水中,在150℃烘箱烘烤5分钟半固化,制得树脂含量50-70%的高耐热粘结片。
胶水各原料以重量份数计分别为:118份环氧树脂,2.7份双氰胺,0.08份2-甲基咪唑,36份双酚A型酚醛环氧树脂、43份二甲基甲酰胺,3.7份KH-560偶联剂,3.4份异佛尔酮二胺与3份耐热剂。
将该粘结片用于铝基覆铜板,测试覆铜板的性能结果为剥离强度为2.2-2.5N/mm,层间粘合力为0.67-0.72N/mm,玻璃化转变温度Tg(DMA)为257℃,热失重温度Td5%loss的温度为412℃。
实施例3
一种铝基覆铜板专用高耐热粘结片的制备方法,所述制备方法包括以下步骤:
1)胶水制备:称取环氧树脂,双氰胺,2-甲基咪唑,双酚A型酚醛环氧树脂、二甲基甲酰胺,KH-560偶联剂,异佛尔酮二胺与耐热剂;在反应釜用二甲基甲酰胺溶解双氰胺与2-咪唑,加入环氧树脂与双酚A型酚醛环氧树脂搅拌4小时,再加入KH-560偶联剂搅拌2小时后一边搅拌一边加入异佛尔酮二胺与耐热剂,投放完继续搅拌5小时,最后用乳化设备乳化胶水最终制成胶水;
2)向步骤1)制备好的胶水加入无机纳米胶液,然后用2116玻璃纤维布浸入胶水中,在200℃烘箱烘烤8分钟半固化,制得树脂含量50-70%的高耐热粘结片。
胶水各原料以重量份数计分别为:125份环氧树脂,3份双氰胺,0.1份2-甲基咪唑,40份双酚A型酚醛环氧树脂、50份二甲基甲酰胺,5份KH-560偶联剂,4份异佛尔酮二胺与6份耐热剂。
将该粘结片用于铝基覆铜板,测试覆铜板的性能结果为剥离强度为2.1-2.5N/mm,层间粘合力为0.61-0.82N/mm,玻璃化转变温度Tg(DMA)为237℃,热失重温度Td5%loss的温度为410℃。
未加双酚A型酚醛环氧树脂配方胶水制作的粘结片压制铝基覆铜板290度漂锡3分钟出现爆板分层,加双酚A型酚醛环氧树脂胶水配方制作的粘结片压制的铝基覆铜板209度漂锡10分钟不爆板不分层。
Claims (4)
1.一种铝基覆铜板专用高耐热粘结片的制备方法,其特征在于,所述制备方法包括以下步骤:1)胶水制备:称取环氧树脂,双氰胺,2-甲基咪唑,双酚A型酚醛环氧树脂、二甲基甲酰胺,KH-560偶联剂,异佛尔酮二胺与耐热剂;在反应釜用二甲基甲酰胺溶解双氰胺与2-咪唑,加入环氧树脂与双酚A型酚醛环氧树脂搅拌4小时,再加入KH-560偶联剂搅拌2小时后一边搅拌一边加入异佛尔酮二胺与耐热剂,投放完继续搅拌5小时,最后用乳化设备乳化胶水最终制成胶水;
2)向步骤1)制备好的胶水加入无机纳米胶液,然后用1080或2116玻璃纤维布浸入胶水中,在70~200℃烘箱烘烤4~8分钟半固化,制得树脂含量50-70%的高耐热粘结片。
2.根据权利要求1所述的一种铝基覆铜板专用高耐热粘结片的制备方法,其特征在于,胶水各原料以重量份数计分别为:100-125份环氧树脂,2-3份双氰胺,0.05-0.1份2-甲基咪唑,20-40份双酚A型酚醛环氧树脂、30-50份二甲基甲酰胺,3-5份KH-560偶联剂,3-4份异佛尔酮二胺与2-6份耐热剂。
3.根据权利要求1或2所述的一种铝基覆铜板专用高耐热粘结片的制备方法,其特征在于,所述耐热剂为α-甲基苯乙烯、间规聚苯乙烯、N-苯基马来酰亚胺和AS的共聚物、N,N’-4,4’-二苯甲烷双马来酰亚胺中的一种或几种的混合物。
4.根据权利要求1所述的一种铝基覆铜板专用高耐热粘结片的制备方法,其特征在于,所述无机纳米胶液为无机纳米氧化锌胶液、无机纳米氮化钛胶液或无机纳米氮化锌胶液。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711124792.3A CN108047982A (zh) | 2017-11-14 | 2017-11-14 | 一种铝基覆铜板专用高耐热粘结片的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711124792.3A CN108047982A (zh) | 2017-11-14 | 2017-11-14 | 一种铝基覆铜板专用高耐热粘结片的制备方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108047982A true CN108047982A (zh) | 2018-05-18 |
Family
ID=62119740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711124792.3A Pending CN108047982A (zh) | 2017-11-14 | 2017-11-14 | 一种铝基覆铜板专用高耐热粘结片的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108047982A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113292900A (zh) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | 铝基覆铜板丝印绝缘胶及丝印方法 |
CN116751533A (zh) * | 2023-08-16 | 2023-09-15 | 苏州凡赛特材料科技有限公司 | 一种非后固化型环氧胶带及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0606500A1 (en) * | 1992-08-03 | 1994-07-20 | Showa Highpolymer Co., Ltd. | Thermosetting resin composition and production of copper-clad laminated board therefrom |
CN101117426A (zh) * | 2007-07-20 | 2008-02-06 | 上海金发科技发展有限公司 | 一种本体法丙烯腈-丁二烯-苯乙烯和聚对苯二甲酸丁二醇脂复合物及其制备方法 |
JP2008222906A (ja) * | 2007-03-14 | 2008-09-25 | Kyocera Chemical Corp | フレキシブル配線板用接着剤組成物、ならびに、それを用いたカバーレイ、接着剤フィルム、フレキシブル銅張積層板、フレキシブル配線板および補強板付配線板 |
CN103059517A (zh) * | 2012-12-31 | 2013-04-24 | 金安国纪科技股份有限公司 | 一种环保型覆铜板用胶液、覆铜板及其制备方法 |
CN103642446A (zh) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | 无铅高耐热覆铜板及其制备方法 |
CN106881925A (zh) * | 2016-12-31 | 2017-06-23 | 南京新月材料科技有限公司 | 一种覆铜板 |
-
2017
- 2017-11-14 CN CN201711124792.3A patent/CN108047982A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0606500A1 (en) * | 1992-08-03 | 1994-07-20 | Showa Highpolymer Co., Ltd. | Thermosetting resin composition and production of copper-clad laminated board therefrom |
JP2008222906A (ja) * | 2007-03-14 | 2008-09-25 | Kyocera Chemical Corp | フレキシブル配線板用接着剤組成物、ならびに、それを用いたカバーレイ、接着剤フィルム、フレキシブル銅張積層板、フレキシブル配線板および補強板付配線板 |
CN101117426A (zh) * | 2007-07-20 | 2008-02-06 | 上海金发科技发展有限公司 | 一种本体法丙烯腈-丁二烯-苯乙烯和聚对苯二甲酸丁二醇脂复合物及其制备方法 |
CN103059517A (zh) * | 2012-12-31 | 2013-04-24 | 金安国纪科技股份有限公司 | 一种环保型覆铜板用胶液、覆铜板及其制备方法 |
CN103642446A (zh) * | 2013-12-10 | 2014-03-19 | 上海南亚覆铜箔板有限公司 | 无铅高耐热覆铜板及其制备方法 |
CN106881925A (zh) * | 2016-12-31 | 2017-06-23 | 南京新月材料科技有限公司 | 一种覆铜板 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113292900A (zh) * | 2020-02-21 | 2021-08-24 | 东莞市立基电子材料有限公司 | 铝基覆铜板丝印绝缘胶及丝印方法 |
CN116751533A (zh) * | 2023-08-16 | 2023-09-15 | 苏州凡赛特材料科技有限公司 | 一种非后固化型环氧胶带及其制备方法 |
CN116751533B (zh) * | 2023-08-16 | 2023-11-07 | 苏州凡赛特材料科技有限公司 | 一种非后固化型环氧胶带及其制备方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101684191B (zh) | 无卤高频树脂组合物及用其制成的预浸料与层压板 | |
JP6301473B2 (ja) | 半導体パッケージ用の熱硬化性樹脂組成物とこれを用いたプリプレグおよび金属箔積層板 | |
US4541894A (en) | Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits | |
CN105936745A (zh) | 一种树脂组合物 | |
CN108913057A (zh) | 一种多层异向型导电布胶及其制作方法 | |
WO2012100648A1 (zh) | 包含芳族合成纤维纸的半固化片和由其制得的印刷电路板 | |
CN109082944A (zh) | 新型芳纶纸基覆铜板及其制备方法 | |
CN108047982A (zh) | 一种铝基覆铜板专用高耐热粘结片的制备方法 | |
CN103702511B (zh) | 一种高导热金属基板及其制作方法 | |
CN107163274A (zh) | 一种低流胶半固化片 | |
CN110126430A (zh) | 阻燃耐热覆铜箔环氧玻纤布基层压板及其制备方法 | |
CN107955331A (zh) | 一种led显示屏专用覆铜板的制备方法 | |
CN108059926A (zh) | 一种铝基覆铜板专用高导热粘结片的制备方法 | |
CN102250447B (zh) | 无卤素的阻燃性环氧树脂组合物及由其制成的预浸材和印刷电路板 | |
CN101118383A (zh) | 一种uv阻挡覆铜版的制备方法 | |
CN109929092A (zh) | 环氧树脂组合物及由其制成的制品 | |
CN102296488B (zh) | 一种低翘曲纸基层压线路板原纸生产方法及纸基层压线路板原纸 | |
CN107201036A (zh) | 树脂组合物及使用其制作的半固化片及金属箔层压板 | |
JP2011225853A (ja) | リン含有アクリル樹脂及びその製造方法、アクリル樹脂組成物、樹脂フィルム、プリプレグ、樹脂付金属箔、金属箔張積層板、ならびにプリント配線板 | |
JPH11200218A (ja) | 耐熱性不織布 | |
JP2000169605A (ja) | 積層板用プリプレグシ―トおよびその製造法 | |
CN203645917U (zh) | 一种高导热金属基板 | |
CN102984886A (zh) | 双面fpc卷式接料生产工艺 | |
CN202005063U (zh) | 覆铜板 | |
JPH08283434A (ja) | 積層板の製造法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180518 |
|
RJ01 | Rejection of invention patent application after publication |