CN113292900A - 铝基覆铜板丝印绝缘胶及丝印方法 - Google Patents
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 74
- 239000003292 glue Substances 0.000 title claims abstract description 35
- 238000007650 screen-printing Methods 0.000 title claims description 48
- 238000000034 method Methods 0.000 title claims description 18
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 17
- 239000002253 acid Substances 0.000 claims abstract description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 13
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 12
- YSWBFLWKAIRHEI-UHFFFAOYSA-N 4,5-dimethyl-1h-imidazole Chemical compound CC=1N=CNC=1C YSWBFLWKAIRHEI-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 10
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- 239000002994 raw material Substances 0.000 claims abstract description 10
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 239000011889 copper foil Substances 0.000 claims description 20
- 238000004140 cleaning Methods 0.000 claims description 12
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- HANVTCGOAROXMV-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine;urea Chemical compound O=C.NC(N)=O.NC1=NC(N)=NC(N)=N1 HANVTCGOAROXMV-UHFFFAOYSA-N 0.000 claims description 4
- DYDNPESBYVVLBO-UHFFFAOYSA-N formanilide Chemical compound O=CNC1=CC=CC=C1 DYDNPESBYVVLBO-UHFFFAOYSA-N 0.000 claims description 4
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
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- 238000004026 adhesive bonding Methods 0.000 description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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- 239000011256 inorganic filler Substances 0.000 description 2
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- OVARTBFNCCXQKS-UHFFFAOYSA-N propan-2-one;hydrate Chemical compound O.CC(C)=O OVARTBFNCCXQKS-UHFFFAOYSA-N 0.000 description 1
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- C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
- C09D161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09D161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
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- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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Abstract
本发明公开了铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂40‑60份、树脂20‑40份、双氰胺35‑55份、DMF5‑7份、氧化铝45‑65份、丙酮4.5‑6.5份、二甲基咪唑1‑3份、偶联剂1‑3份、固化剂4‑6份、增韧剂4‑6份、稀释剂2‑4份、聚酯5‑7份、环氧聚氨酯10‑13份和聚丁二烯酸15‑17份;本发明的有益效果是:制成的丝印绝缘胶对铝基覆铜板进行涂装,涂装层可以更薄,涂装更均匀;质量更好;使得铝基覆铜板有更长的使用寿命,绝缘层更可靠,耐热性更高。
Description
技术领域
本发明涉及铝基覆铜板的领域,尤其是涉及一种铝基覆铜板丝印绝缘胶及丝印方法。
背景技术
在现有技术中,电子元器件要求更大功率,更高密度。使用铝基覆铜板可以解决以上要求产生的散热和寿命问题。目前制约我国铝基板走上国际的主要因素是绝缘层的热导率不高,绝缘层可靠性欠佳。国内市场上高导热铝基板,绝缘层采用玻璃纤维和无机填料增强环氧树脂胶粘剂体系或无机填料增强环氧树脂胶粘剂体系,前者胶黏剂中的填料添加量难以提高,热导率普遍≤1.0w/m.k,并且存在绝缘层与铝板结合不良,从而引起的爆板问题。后者热导率可以达到2.0w/m.k以上,但成型工艺制约其发展,通常使用RCC(涂胶铜箔)的方法对厚度105μm以上的厚铜箔铝基板很难涂胶。涂装不均匀。
发明内容
本发明为克服上述情况不足,旨在提供一种能解决上述问题的技术方案。
铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂40-60份、树脂20-40份、双氰胺35-55份、DMF5-7份、氧化铝45-65份、丙酮4.5-6.5份、二甲基咪唑1-3份、偶联剂1-3份、固化剂4-6份、增韧剂4-6份、稀释剂2-4份、聚酯5-7份、环氧聚氨酯10-13份和聚丁二烯酸15-17份。
铝基覆铜板丝印绝缘胶的丝印方法,用于所述的铝基覆铜板丝印绝缘胶,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
作为本发明进一步的方案:所述铺装压制使用设备:真空泵、空气压缩机、上下料架、层压机、铺装托盘及框架。
与现有技术相比,本发明的有益效果是:制成的丝印绝缘胶对铝基覆铜板进行涂装,涂装层可以更薄,涂装更均匀;质量更好;使得铝基覆铜板有更长的使用寿命,绝缘层更可靠,耐热性更高。
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。
具体实施方式
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例一
铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂40-60份、树脂20-40份、双氰胺35-55份、DMF5-7份、氧化铝45-65份、丙酮4.5-6.5份、二甲基咪唑1-3份、偶联剂1-3份、固化剂4-6份、增韧剂4-6份、稀释剂2-4份、聚酯5-7份、环氧聚氨酯10-13份和聚丁二烯酸15-17份。
铝基覆铜板丝印绝缘胶的丝印方法,用于所述的铝基覆铜板丝印绝缘胶,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
实施例二
铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂40份、树脂20份、双氰胺35份、DMF5份、氧化铝45份、丙酮4.5份、二甲基咪唑1份、偶联剂1份、固化剂4份、增韧剂4份、稀释剂2份、聚酯5份、环氧聚氨酯10份和聚丁二烯酸15份。
所述固态胺树脂包括脲醛、三聚氰按甲醛、脲三聚氰胺甲醛和苯胺甲醛等树脂。
铝基覆铜板丝印绝缘胶的丝印方法,用于所述的铝基覆铜板丝印绝缘胶,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
实施例三
铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂50份、树脂30份、双氰胺45份、DMF6份、氧化铝55份、丙酮5.5份、二甲基咪唑2份、偶联剂2份、固化剂5份、增韧剂5份、稀释剂3份、聚酯6份、环氧聚氨酯12份和聚丁二烯酸16份。
所述固态胺树脂包括脲醛、三聚氰按甲醛、脲三聚氰胺甲醛和苯胺甲醛等树脂。
所述脲醛树脂呈半透明状,耐弱酸、弱碱,绝缘性能良好、耐磨性极佳,但遇强酸或强碱易分解,耐候性较差;所述三聚氰胺甲醛树脂又称密胺树脂,其塑料具有良好的耐热性、耐水性、力学性能和电绝缘性能以及优良的耐电弧性、加工性能、耐酸、碱和溶剂性能,制品光泽性好。
铝基覆铜板丝印绝缘胶的丝印方法,用于所述的铝基覆铜板丝印绝缘胶,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
实施例四
铝基覆铜板丝印绝缘胶,包括以下重量份的原料:固态树脂60份、树脂40份、双氰胺55份、DMF7份、氧化铝65份、丙酮6.5份、二甲基咪唑3份、偶联剂3份、固化剂6份、增韧剂6份、稀释剂4份、聚酯7份、环氧聚氨酯13份和聚丁二烯酸17份。
所述固态胺树脂包括脲醛、三聚氰按甲醛、脲三聚氰胺甲醛和苯胺甲醛等树脂。
所述脲醛树脂呈半透明状,耐弱酸、弱碱,绝缘性能良好、耐磨性极佳,但遇强酸或强碱易分解,耐候性较差;所述三聚氰胺甲醛树脂又称密胺树脂,其塑料具有良好的耐热性、耐水性、力学性能和电绝缘性能以及优良的耐电弧性、加工性能、耐酸、碱和溶剂性能,制品光泽性好。
所述树脂相对分子量不确定但通常较高,常温下呈固态、中固态、假固态,有时也可以是液态的有机物质。具有软化或熔融温度范围,在外力作用下有流动倾向,破裂时常呈贝壳状;广义上是指用作塑料基材的聚合物或预聚物;一般不溶于水,能溶于有机溶剂。按来源可分为天然树脂和合成树脂;按其加工行为不同的特点又有热塑性树脂和热固性树脂之分。
所述双氰胺性状白色结晶性粉末、水中溶解度在13℃时为2.26%,在热水中溶解度较大;当水溶液在80℃时逐渐分解产生氨气;无水乙醇(C2H5OH)、乙醚中溶解度在13℃时,分别为1.26%和0.01%;溶于液氨、热水、乙醇、丙酮水合物、二甲基甲酰胺,难溶于乙醚,不溶于苯和氯仿;相对密度(d254)1.40、熔点209.5℃;干燥时性质稳定、不燃烧、低毒,半数致死量(小鼠,经口)>4000mg/kg、空气中最高容许浓度5mg/m3。
铝基覆铜板丝印绝缘胶的丝印方法,用于所述的铝基覆铜板丝印绝缘胶,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
Claims (7)
1.铝基覆铜板丝印绝缘胶,其特征在于,包括以下重量份的原料:固态树脂40-60份、树脂20-40份、双氰胺35-55份、DMF5-7份、氧化铝45-65份、丙酮4.5-6.5份、二甲基咪唑1-3份、偶联剂1-3份、固化剂4-6份、增韧剂4-6份、稀释剂2-4份、聚酯5-7份、环氧聚氨酯10-13份和聚丁二烯酸15-17份。
2.根据权利要求1所述的铝基覆铜板丝印绝缘胶,其特征在于,包括以下重量份的原料:固态树脂40份、树脂20份、双氰胺35份、DMF5份、氧化铝45份、丙酮4.5份、二甲基咪唑1份、偶联剂1份、固化剂4份、增韧剂4份、稀释剂2份、聚酯5份、环氧聚氨酯10份和聚丁二烯酸15份。
3.根据权利要求1所述的铝基覆铜板丝印绝缘胶,其特征在于,包括以下重量份的原料:固态树脂50份、树脂30份、双氰胺45份、DMF6份、氧化铝55份、丙酮5.5份、二甲基咪唑2份、偶联剂2份、固化剂5份、增韧剂5份、稀释剂3份、聚酯6份、环氧聚氨酯12份和聚丁二烯酸16份。
4.根据权利要求1所述的铝基覆铜板丝印绝缘胶,其特征在于,包括以下重量份的原料:固态树脂60份、树脂40份、双氰胺55份、DMF7份、氧化铝65份、丙酮6.5份、二甲基咪唑3份、偶联剂3份、固化剂6份、增韧剂6份、稀释剂4份、聚酯7份、环氧聚氨酯13份和聚丁二烯酸17份。
5.根据权利要求1所述的铝基覆铜板丝印绝缘胶,其特征在于,所述固态胺树脂包括脲醛、三聚氰按甲醛、脲三聚氰胺甲醛和苯胺甲醛等树脂。
6.铝基覆铜板丝印绝缘胶的丝印方法,用于权利要求1-4所述的铝基覆铜板丝印绝缘胶,其特征在于,包括以下步骤:
S1、彻底清洁好丝印机内部的丝印网,安装及定位;
S2、将所述的铝基覆铜板丝印绝缘胶倒进丝印机的供料槽内;
S3、设定丝印速度以及将所需印刷的铝板装进自动进料架上;
S4、启动隧道炉以及开动送料泵,将所述的铝基覆铜板丝印绝缘胶注胶到丝印网上;
S5、开启丝印机,进行自动丝印,并形成待板;
S6、将待板从隧道炉出来后,接板叠好,等待铺装;
S7、剪裁好所需的铜箔尺寸;清洁印刷好的铝板绝缘胶表面;将铜箔铺进托盘的固定位置,再叠一张印刷好的绝缘铝板,绝缘胶面贴着铜箔铺装;
S8、将S7中的绝缘铝板叠到所需的高度后,装上框架,预防在层压中受压过大,产生板面移位;铺装好托盘的板材后,送进上料架;打开空压机并打开层压机进行预热到所设定的进料温度;待压制完成后,用下料架将板材卸下。
7.根据权利要求6所述的铝基覆铜板丝印绝缘胶的丝印方法,其特征在于,所述铺装压制使用设备:真空泵、空气压缩机、上下料架、层压机、铺装托盘及框架。
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Application publication date: 20210824 |