DE69301760D1 - Mindestens einen elektronischen Baustein enthaltende Karte und Verfahren zur Herstellung der Karte - Google Patents

Mindestens einen elektronischen Baustein enthaltende Karte und Verfahren zur Herstellung der Karte

Info

Publication number
DE69301760D1
DE69301760D1 DE69301760T DE69301760T DE69301760D1 DE 69301760 D1 DE69301760 D1 DE 69301760D1 DE 69301760 T DE69301760 T DE 69301760T DE 69301760 T DE69301760 T DE 69301760T DE 69301760 D1 DE69301760 D1 DE 69301760D1
Authority
DE
Germany
Prior art keywords
card
producing
electronic component
electronic element
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69301760T
Other languages
English (en)
Other versions
DE69301760T3 (de
DE69301760T2 (de
Inventor
Francois Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAGRALD S.A., LA CHAUX-DE-FONDS, CH
Original Assignee
Francois Droz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9430009&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69301760(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Francois Droz filed Critical Francois Droz
Application granted granted Critical
Publication of DE69301760D1 publication Critical patent/DE69301760D1/de
Publication of DE69301760T2 publication Critical patent/DE69301760T2/de
Publication of DE69301760T3 publication Critical patent/DE69301760T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal
DE69301760T 1992-05-19 1993-05-08 Mindestens einen elektronischen Baustein enthaltende Karte und Verfahren zur Herstellung der Karte Expired - Lifetime DE69301760T3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9206169A FR2691563B1 (fr) 1992-05-19 1992-05-19 Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
FR9206169 1992-05-19

Publications (3)

Publication Number Publication Date
DE69301760D1 true DE69301760D1 (de) 1996-04-18
DE69301760T2 DE69301760T2 (de) 1996-09-26
DE69301760T3 DE69301760T3 (de) 2006-03-30

Family

ID=9430009

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69301760T Expired - Lifetime DE69301760T3 (de) 1992-05-19 1993-05-08 Mindestens einen elektronischen Baustein enthaltende Karte und Verfahren zur Herstellung der Karte

Country Status (15)

Country Link
US (2) US5399847A (de)
EP (1) EP0570784B2 (de)
JP (1) JP3326568B2 (de)
KR (1) KR100301315B1 (de)
AT (1) ATE135479T1 (de)
AU (1) AU673667B2 (de)
CA (1) CA2095594C (de)
DE (1) DE69301760T3 (de)
DK (1) DK0570784T4 (de)
ES (1) ES2087604T5 (de)
FI (1) FI102222B1 (de)
FR (1) FR2691563B1 (de)
HK (1) HK1007015A1 (de)
MY (1) MY109784A (de)
NO (1) NO308274B1 (de)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
DE69401634T3 (de) * 1993-03-18 2002-06-13 Nagrald S A Verfahren zur herstellung einer karte, die mindestens einen elektronischen baustein enthält,und nach einem solchen verfahren hergestellte karte
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
US5451763A (en) * 1994-07-05 1995-09-19 Alto Corporation Personal medical IC card and read/write unit
US5837992A (en) * 1994-07-15 1998-11-17 Shinko Nameplate Co., Ltd. Memory card and its manufacturing method
JP2829494B2 (ja) * 1994-07-15 1998-11-25 新光ネームプレート株式会社 メモリカード及びその製造方法
DE4425736C2 (de) * 1994-07-21 1997-12-18 Micro Sensys Gmbh Einbauschale für Daten- oder Codeträger
FR2723228B1 (fr) * 1994-07-26 1996-09-20 Bourgogne Grasset Jeton de jeu perfectionne
FR2724477B1 (fr) * 1994-09-13 1997-01-10 Gemplus Card Int Procede de fabrication de cartes sans contact
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE4437844C2 (de) * 1994-10-22 2001-03-08 Cubit Electronics Gmbh Kontaktloser Datenträger und Verfahren zu seiner Herstellung
FR2727541B1 (fr) * 1994-11-25 1997-01-17 Droz Francois Carte incorporant au moins une bobine
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
FR2730576B1 (fr) * 1995-02-15 1997-04-04 Gemplus Card Int Procede de fabrication de cartes electroniques et cartes obtenues par un tel procede
DE19521111C2 (de) * 1995-06-09 1997-12-18 Wendisch Karl Heinz Ausweis-Chipkarte mit Antennenwicklungsinlet
JP4015717B2 (ja) * 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
DE19529640A1 (de) * 1995-08-11 1997-02-13 Giesecke & Devrient Gmbh Spulenelement für einen Datenträger mit integriertem Schaltkreis und nichtberührender Kopplung
FR2739587B1 (fr) * 1995-10-09 1997-11-07 Bourgogne Grasset Jeton de jeu
DE19538233A1 (de) * 1995-10-13 1997-04-17 Siemens Ag Trägerelement zum Einbau in eine Chipkarte
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
AU7689596A (en) * 1995-12-05 1997-06-27 Michel Bisson Contactless electronic transponder with printed loop antenna circuit
WO1997042598A1 (en) * 1996-05-09 1997-11-13 Atmel Corporation Smart card formed with two joined sheets
US6027027A (en) * 1996-05-31 2000-02-22 Lucent Technologies Inc. Luggage tag assembly
DE19630947C2 (de) * 1996-07-31 2000-08-24 Ods Landis & Gyr Gmbh & Co Kg Kontaktlose Chipkarte
JPH10193849A (ja) * 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
JPH10203066A (ja) 1997-01-28 1998-08-04 Hitachi Ltd 非接触ｉｃカード
FR2760113B1 (fr) * 1997-02-24 1999-06-04 Gemplus Card Int Procede de fabrication de carte sans contact a antenne bobinee
FR2760331B1 (fr) * 1997-03-10 1999-04-30 Bourgogne Grasset Jeton a puce electronique
ATE235847T1 (de) 1997-03-10 2003-04-15 Bourgogne Grasset Marke mit elektronischen chip
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
JPH1134553A (ja) * 1997-07-18 1999-02-09 Rohm Co Ltd Ｉｃモジュール、およびその製造方法、ならびにこれを備えたｉｃカード
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
AT408384B (de) * 1998-01-30 2001-11-26 Skidata Ag Datenträger in kartenform
US6208019B1 (en) * 1998-03-13 2001-03-27 Kabushiki Kaisha Toshiba Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
US6175124B1 (en) * 1998-06-30 2001-01-16 Lsi Logic Corporation Method and apparatus for a wafer level system
DE19843425A1 (de) * 1998-09-22 2000-03-23 Kunz Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
US6630370B2 (en) * 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card
CN1520612A (zh) * 1999-02-24 2004-08-11 ��³����ʽ���� 集成电路元件及其制造方法和承载集成电路元件的信息载体及其制造方法
FR2805067B1 (fr) 2000-02-15 2003-09-12 Bourgogne Grasset Jeton a puce electronique et procedes de fabrication d'un tel jeton
US7267614B1 (en) * 2000-05-10 2007-09-11 Walker Digital, Llc Gaming token having a variable value
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
KR20020083057A (ko) * 2001-04-25 2002-11-01 김원태 혼합강정(떡, 과실맛 젤리 또는 시럽, 해조류)의 제조방법
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US6586078B2 (en) * 2001-07-05 2003-07-01 Soundcraft, Inc. High pressure lamination of electronic cards
FR2833102B1 (fr) * 2001-12-03 2004-02-27 Bourgogne Grasset Dispositif de rangement electronique pour jetons de jeu
EP1485867A4 (de) * 2001-12-24 2012-02-22 L 1 Secure Credentialing Inc Kontakt-chipkarten mit einem dokumentkern, kontaktlose chipkarten mit identifikationsdokument mehrschichtiger struktur auf pet-basis und verfahren zu ihrer herstellung
AU2002364746A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Systems, compositions, and methods for full color laser engraving of id documents
EP1500043B1 (de) * 2002-04-24 2008-07-30 Mineral Lassen LLC Herstellungsverfahren für eine drahtlose kommunikationseinrichtung und herstellungsvorrichtung
EP1614064B1 (de) 2003-04-16 2010-12-08 L-1 Secure Credentialing, Inc. Dreidimensionale datenspeicherung
FR2854972B1 (fr) * 2003-05-12 2005-07-15 Bourgogne Grasset Poste de lecture et/ou d'ecriture pour jetons de jeu electroniques
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US7748636B2 (en) * 2004-11-16 2010-07-06 Dpd Patent Trust Ltd. Portable identity card reader system for physical and logical access
JP2006244317A (ja) * 2005-03-04 2006-09-14 Nippon Sheet Glass Co Ltd パネル用中間膜体、パネル、および、電子タグ
US7237724B2 (en) 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
ES2425355T3 (es) * 2005-04-07 2013-10-14 Gaming Partners International Procedimiento de gestión de una pluralidad de lectores de fichas con chip electrónico y equipos de puesta en práctica de dicho procedimiento
FR2888372B1 (fr) * 2005-07-08 2007-10-12 Caming Partners Internationale Jeton a puce electronique et son procede de fabrication
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070026949A1 (en) * 2005-07-28 2007-02-01 Gaming Partners International Equipment for transporting chips and chip carrier structure therefor
CA2553949C (fr) * 2005-11-09 2016-02-16 Pierre Chapet Jeton a insert a puce electronique
US7780713B2 (en) * 2006-01-04 2010-08-24 Roberts John B Heat absorbing pack
DE102006001777B4 (de) * 2006-01-12 2008-01-31 Ses Rfid Solutions Gmbh Verfahren zum Erzeugen eines Raumgebildes mit einem Transponder
AU2007243634A1 (en) * 2006-04-10 2007-11-08 Innovatier, Inc. An electronic inlay module for electronic cards and tags, electronic card and methods for manufacturing such electronic inlay modules and cards
KR101175830B1 (ko) 2006-06-19 2012-08-24 나그라아이디 에스.에이. 하나 이상의 전자 모듈을 포함하는 카드를 조립하기 위한 방법, 상기 방법에서의 조립체 및 중간물
MX2008016464A (es) * 2006-06-19 2009-04-02 Nagraid Sa Metodo para la manufactura de tarjetas que comprende al menos un modulo electronico, montaje producido durante este metodo y productos intermedios.
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US8092293B2 (en) * 2006-09-13 2012-01-10 Igt Method and apparatus for tracking play at a roulette table
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8382582B2 (en) 2006-09-26 2013-02-26 Igt Systems and methods for portable wagering mediums
ATE534970T1 (de) 2006-10-12 2011-12-15 Hid Global Gmbh In einen flexiblen mehrschichtigen träger eingebetteter transponder
US20080105751A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Authenticating Cards
US20080109309A1 (en) * 2006-10-31 2008-05-08 Steven Landau Powered Print Advertisements, Product Packaging, and Trading Cards
JP4860436B2 (ja) 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
WO2008082617A2 (en) * 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
US7967214B2 (en) * 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8231455B2 (en) * 2007-02-05 2012-07-31 Igt Method and apparatus for providing a bonus to a player
US9107336B2 (en) 2007-02-09 2015-08-11 Nagraid S.A. Method of fabricating electronic cards including at least one printed pattern
KR101117921B1 (ko) * 2007-03-19 2012-06-20 나그라아이디 에스.에이. 디지털 디스플레이를 포함하는 카드
US8511571B2 (en) 2007-03-19 2013-08-20 Nagraid S.A. Intermediate product intervening in the manufacturing of electronic cards
WO2008116151A1 (en) 2007-03-21 2008-09-25 Walker Digital, Llc Gameplay-altering portable wagering media
KR20100015378A (ko) * 2007-03-23 2010-02-12 이노배티어, 인코프레이티드 스텝 카드 및 스텝 카드를 제조하는 방법
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
ES2397969T3 (es) * 2007-05-25 2013-03-12 Gaming Partners International Ficha con dispositivo electrónico
FR2917871B1 (fr) * 2007-06-21 2010-10-22 Smart Packaging Solutions Sps Insert securise notamment pour carte a puce
WO2009000636A1 (fr) * 2007-06-26 2008-12-31 Nagraid S.A. Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire
PL2168082T3 (pl) * 2007-06-26 2013-08-30 Nagravision Sa Sposób wytwarzania kart zawierających co najmniej jeden układ elektroniczny
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US7707706B2 (en) * 2007-06-29 2010-05-04 Ruhlamat Gmbh Method and arrangement for producing a smart card
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
EP3298995A1 (de) * 2008-06-25 2018-03-28 Novartis AG Augenimplantat mit formänderungsfähigkeiten
US20100090801A1 (en) * 2008-10-10 2010-04-15 Kwok Fong Wong Serial bus fingerprint scanner with led indicators
HK1119371A2 (en) * 2008-10-10 2009-02-27 Wong Kwok Fong A usb fingerprint device with led indicators
HK1125258A2 (en) * 2008-10-10 2009-07-31 Wong Kwok Fong A storage device with rf fingerprint scanning system
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
HK1130618A2 (en) * 2008-10-30 2010-05-14 Shining Union Ltd A financial transaction card
US20100110009A1 (en) * 2008-10-31 2010-05-06 Kwok Fong Wong Computer Mouse
US20100156595A1 (en) * 2008-12-24 2010-06-24 Kwok Fong Wong Control Panel for Controlling Information Processing System
US8111136B2 (en) * 2009-01-23 2012-02-07 Shining Union Limited USB fingerprint scanner with touch sensor
US8111135B2 (en) * 2009-01-23 2012-02-07 Shining Union Limited USB fingerprint scanner with touch sensor
HK1124479A2 (en) * 2009-03-19 2009-07-10 Wong Kwok Fong Microelectronic lock device
US8690064B2 (en) * 2009-04-30 2014-04-08 Abnote Usa, Inc. Transaction card assembly and methods of manufacture
HK1138478A2 (en) * 2009-06-18 2010-08-20 Shining Union Ltd A password input device
EP2373019A1 (de) 2010-03-29 2011-10-05 Nagravision S.A. Sichere Decodierung eines Audio- bzw. Videodatenstroms
PL2556732T3 (pl) 2010-04-05 2019-10-31 Innovatier Inc Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet
US8195236B2 (en) 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
JP5641845B2 (ja) * 2010-09-28 2014-12-17 トッパン・フォームズ株式会社 情報媒体
JP5525980B2 (ja) * 2010-09-28 2014-06-18 トッパン・フォームズ株式会社 情報媒体およびその製造方法
JP2012073965A (ja) * 2010-09-29 2012-04-12 Toppan Forms Co Ltd 情報媒体およびその製造方法
JP5542024B2 (ja) * 2010-09-30 2014-07-09 トッパン・フォームズ株式会社 情報媒体の製造方法
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
CN102222262B (zh) * 2011-02-19 2016-08-24 上海祯显电子科技有限公司 一种非接触智能卡
EP2898529B1 (de) 2012-09-18 2019-08-14 Assa Abloy Ab Verfahren zum schutz eines elektrischen bauelements in einem laminat
US20170243104A1 (en) * 2013-03-14 2017-08-24 X-Card Holdings, Llc Information carrying card for displaying one time passcodes, and method of making the same
EP2869243A1 (de) 2013-10-31 2015-05-06 Gemalto SA Chipkarte mit Batterie, und Herstellungsverfahren einer solchen Karte
US20150286921A1 (en) * 2014-04-03 2015-10-08 Infineon Technologies Ag Chip card substrate and method of forming a chip card substrate
CN104021415A (zh) * 2014-06-27 2014-09-03 南通富士通微电子股份有限公司 电子标签
US11034068B2 (en) 2018-04-30 2021-06-15 Raytheon Company Encapsulating electronics in high-performance thermoplastics

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1140261A (en) * 1964-04-29 1969-01-15 Elisa Berthelsen Improvements in and relating to structural frames such as window frames
US3551270A (en) * 1967-01-30 1970-12-29 Melvin Sharkey Bonding air-impervious flexible sheets using an adhesive,perforated,inner sheet and article produced thereby
US3836414A (en) * 1971-06-11 1974-09-17 Gen Binding Corp Method for eliminating bubbles in laminates
US3923581A (en) * 1971-06-25 1975-12-02 Texas Instruments Inc Method of making a thermal display system
FR2345769A1 (fr) * 1976-03-25 1977-10-21 Blazevic Milos Dispositif d'enregistrement, de lecture et de traduction automatique et support correspondant
FR2395609A1 (fr) * 1977-06-24 1979-01-19 Radiotechnique Compelec Panneau generateur a cellules solaires noyees dans un stratifie et procede pour l'obtenir
US4297401A (en) * 1978-12-26 1981-10-27 Minnesota Mining & Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
US4388128A (en) * 1980-03-17 1983-06-14 Matsushita Electric Industrial Co., Ltd. Solid-state color-image sensor and process for fabricating the same
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
US4668314A (en) * 1983-10-25 1987-05-26 Casio Computer Co., Ltd. Method of manufacturing a small electronic device
JPS62154868U (de) * 1985-08-09 1987-10-01
US5145538A (en) * 1986-04-03 1992-09-08 Kabushiki Kaisha Sebun Shiizu Manufacturing Processes for integrated article bearing indicia
DE3611151A1 (de) * 1986-04-03 1987-10-08 Sebun Shiizu Fujisawa Kk Integriertes erzeugnis zur anzeige und herstellverfahren fuer das erzeugnis
US4795898A (en) * 1986-04-28 1989-01-03 American Telephone And Telegraph Company Personal memory card having a contactless interface using differential data transfer
JPS63149191A (ja) * 1986-12-15 1988-06-21 日立マクセル株式会社 Ｉｃカ−ド
JPH01129387A (ja) * 1987-11-13 1989-05-22 Toshiba Corp 券類発行装置
DE68912426T2 (de) * 1988-06-21 1994-05-11 Gec Avery Ltd Herstellung von tragbaren elektronischen Karten.
US5067008A (en) * 1989-08-11 1991-11-19 Hitachi Maxell, Ltd. Ic package and ic card incorporating the same thereinto
GB2253591A (en) * 1991-03-15 1992-09-16 Gec Avery Ltd Integrated circuit card

Also Published As

Publication number Publication date
NO931788D0 (no) 1993-05-18
ES2087604T5 (es) 2005-04-01
FI102222B (fi) 1998-10-30
KR940006062A (ko) 1994-03-23
EP0570784B2 (de) 2004-09-01
AU673667B2 (en) 1996-11-21
JP3326568B2 (ja) 2002-09-24
FI102222B1 (fi) 1998-10-30
FI932257A (fi) 1993-11-20
FI932257A0 (fi) 1993-05-18
US5741392A (en) 1998-04-21
EP0570784B1 (de) 1996-03-13
JPH0652374A (ja) 1994-02-25
ATE135479T1 (de) 1996-03-15
MY109784A (en) 1997-06-30
CA2095594A1 (en) 1993-11-20
AU3860693A (en) 1993-11-25
ES2087604T3 (es) 1996-07-16
DK0570784T4 (da) 2005-01-10
FR2691563B1 (fr) 1996-05-31
EP0570784A1 (de) 1993-11-24
HK1007015A1 (en) 1999-03-26
DE69301760T3 (de) 2006-03-30
DE69301760T2 (de) 1996-09-26
CA2095594C (en) 2007-03-13
FR2691563A1 (fr) 1993-11-26
KR100301315B1 (ko) 2001-10-22
NO931788L (no) 1993-11-22
NO308274B1 (no) 2000-08-21
US5399847A (en) 1995-03-21
DK0570784T3 (da) 1996-07-22

Similar Documents

Publication Publication Date Title
DE69301760D1 (de) Mindestens einen elektronischen Baustein enthaltende Karte und Verfahren zur Herstellung der Karte
DE59610675D1 (de) Verfahren und Vorrichtung zur Herstelliung eines IC-Kartenmoduls
EP0726541A3 (de) Verfahren zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte
DE3587041D1 (de) Verfahren zur herstellung von isolatorschichten aus silylierten polysilsesquioxanen auf elektronischen gedruckten schaltung.
DE3586666D1 (de) Karte mit ic-baustein und verfahren zur herstellung derselben.
ATE198942T1 (de) Verfahren zur herstellung einer chipkarte sowie chipkarte
DE59813280D1 (de) Verfahren zur Herstellung eines Datenträgers
DE69011292D1 (de) Verfahren zur herstellung von elektronischen komponenten mit einer spule aus dünndraht.
DE68923417D1 (de) Verfahren zur herstellung von keramischen elektronischen schichtbauelementen.
DE59607684D1 (de) Verfahren und vorrichtung zur herstellung einer transpondereinheit sowie transpondereinheit
DE69100556D1 (de) Verfahren zur Erzeugung von Transformatoröl aus hydrogekracktem Material.
ATE189932T1 (de) Verfahren zur herstellung von ausweiskarten mit elektrischen modulen
DE68910803T2 (de) Verfahren zur Herstellung von Mesophasenpech aus isotropem Pech.
ATE152538T1 (de) Elektronisches gerät zur durchführung einer vielzahl von funktionen
ATE259980T1 (de) Verfahren zur herstellung einer ic-karte und eine solche hergestellte karte
ATE173105T1 (de) Verfahren zur herstellung einer karte, die mindestens einen elektronischen baustein enthält
DE68914109T2 (de) Verfahren und Vorrichtung zur Herstellung einer Doppelwendelfeder aus thermostatischem Metall.
DE68911125T2 (de) Verfahren zur Herstellung der keramischen elektronischen Komponenten von mehreren Schichten.
DE3878626T2 (de) Verfahren zur herstellung von m-xylol aus o-xylol.
TH24258EX (th) คาร์ดที่ประกอบด้วยชิ้นส่วนอิเลคทรอนิคอย่างน้อย 1 ส่วน และวิธีการผลิตคาร์ดดังกล่าว
DE69105192T2 (de) Kompositelement für einen elektronischen Verbinder und Verfahren zur Herstellung eines solchen Elements.

Legal Events

Date Code Title Description
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: NAGRALD S.A., LA CHAUX-DE-FONDS, CH

8381 Inventor (new situation)

Free format text: DROZ, FRANCOIS, LA CHAUX-DE FONDS, CH

8366 Restricted maintained after opposition proceedings
8310 Action for declaration of annulment
8313 Request for invalidation rejected/withdrawn