PL2556732T3 - Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet - Google Patents

Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet

Info

Publication number
PL2556732T3
PL2556732T3 PL11712439T PL11712439T PL2556732T3 PL 2556732 T3 PL2556732 T3 PL 2556732T3 PL 11712439 T PL11712439 T PL 11712439T PL 11712439 T PL11712439 T PL 11712439T PL 2556732 T3 PL2556732 T3 PL 2556732T3
Authority
PL
Poland
Prior art keywords
lamination core
labels
electronic cards
lamination
core
Prior art date
Application number
PL11712439T
Other languages
English (en)
Inventor
Robert Singleton
Original Assignee
Innovatier Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovatier Inc filed Critical Innovatier Inc
Publication of PL2556732T3 publication Critical patent/PL2556732T3/pl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H10W74/01—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C2045/1784—Component parts, details or accessories not otherwise provided for; Auxiliary operations not otherwise provided for
    • B29C2045/179—Frames or machine parts made of concrete
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable
    • Y10T428/2826—Synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
PL11712439T 2010-04-05 2011-03-25 Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet PL2556732T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US32096910P 2010-04-05 2010-04-05
EP11712439.6A EP2556732B1 (en) 2010-04-05 2011-03-25 A pre-lamination core and method for making a pre-lamination core for electronic cards and tags
PCT/US2011/029940 WO2011126766A1 (en) 2010-04-05 2011-03-25 A pre-lamination core and method for making a pre-lamination core for electronic cards and tags

Publications (1)

Publication Number Publication Date
PL2556732T3 true PL2556732T3 (pl) 2019-10-31

Family

ID=43971033

Family Applications (1)

Application Number Title Priority Date Filing Date
PL11712439T PL2556732T3 (pl) 2010-04-05 2011-03-25 Rdzeń dla wstępnego laminowania oraz sposób wytwarzania rdzenia dla wstępnego laminowania dla elektronicznych kart oraz etykiet

Country Status (12)

Country Link
US (1) US8657983B2 (pl)
EP (2) EP3522686A1 (pl)
JP (1) JP2013524364A (pl)
KR (1) KR20130069564A (pl)
CN (1) CN102884871B (pl)
CA (1) CA2795294C (pl)
ES (1) ES2716839T3 (pl)
MX (1) MX2012011488A (pl)
PL (1) PL2556732T3 (pl)
RU (1) RU2564103C2 (pl)
TW (1) TWI531976B (pl)
WO (1) WO2011126766A1 (pl)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9603280B2 (en) 2014-05-30 2017-03-21 EMC IP Holding Company LLC Flash module
US11537758B2 (en) 2017-05-23 2022-12-27 Fiteq, Inc. Process for pick and place of electronic components in a vacuum
US10706344B1 (en) * 2017-05-23 2020-07-07 Fiteq, Inc. Process for maintaining registration of an array through use of a carrier in process flow
US11097212B2 (en) 2017-08-21 2021-08-24 Plasma Tech Holdings, Llc Tailing pond remediation
US10970612B2 (en) 2018-10-22 2021-04-06 Fiteq, Inc. Interactive core for electronic cards
FR3098371B1 (fr) * 2019-07-05 2021-09-24 Linxens Holding Dispositif de connexion de carte a puce sur textile
CN116235180B (zh) 2020-09-25 2025-09-30 兰克森控股公司 智能卡的预层合嵌体、形成智能卡的预层合嵌体的方法、以及智能卡
WO2023034642A1 (en) 2021-09-06 2023-03-09 Metaland Llc Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064872A (en) * 1976-09-02 1977-12-27 Ashley-Butler, Inc. Temperature measuring device of a liquid crystal laminate
US4339407A (en) 1980-10-02 1982-07-13 Alden Research Foundation Electronic circuit encapsulation
US4961893A (en) 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
KR900702481A (ko) 1988-06-21 1990-12-07 원본미기재 휴대용 전자 토큰 제조방법
US5417905A (en) 1989-05-26 1995-05-23 Esec (Far East) Limited Method of making a card having decorations on both faces
JP2560895B2 (ja) 1990-07-25 1996-12-04 三菱電機株式会社 Ｉｃカードの製造方法およびｉｃカード
DE4038126C2 (de) 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
US5432705A (en) 1991-05-31 1995-07-11 Itronix Corporation Administrative computer and testing apparatus
FR2691563B1 (fr) * 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
FR2702067B1 (fr) 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
JPH09510407A (ja) * 1994-01-26 1997-10-21 アンプ−アクゾ リンラム ブイオーエフ 複合ラミネートを作る方法およびそうして作られたｐｗｂ基板
FR2716555B1 (fr) 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5423705A (en) 1994-03-28 1995-06-13 Kransco Flying disc with laminate surfacing
EP0763769A1 (en) * 1995-09-13 1997-03-19 Polaroid Corporation A camera with film processing means
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
US6025054A (en) 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
DE10126368A1 (de) * 2001-05-30 2002-12-19 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zur Herstellung eines tragbaren Datenträgers
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
RU2485587C2 (ru) * 2006-04-10 2013-06-20 Инновейтир, Инк. Электронная вкладка (варианты), смарт-карта (варианты) и способы изготовления электронной вкладки и смарт-карты (варианты)

Also Published As

Publication number Publication date
CA2795294A1 (en) 2011-10-13
WO2011126766A1 (en) 2011-10-13
TWI531976B (zh) 2016-05-01
CN102884871B (zh) 2017-06-16
US20110242772A1 (en) 2011-10-06
CN102884871A (zh) 2013-01-16
EP3522686A1 (en) 2019-08-07
RU2012143002A (ru) 2014-05-20
MX2012011488A (es) 2012-12-17
US8657983B2 (en) 2014-02-25
JP2013524364A (ja) 2013-06-17
EP2556732B1 (en) 2019-01-02
CA2795294C (en) 2020-07-21
TW201201109A (en) 2012-01-01
KR20130069564A (ko) 2013-06-26
RU2564103C2 (ru) 2015-09-27
EP2556732A1 (en) 2013-02-13
ES2716839T3 (es) 2019-06-17

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