DE69232886T2 - Leitender Klebstoff und Verfahren zur Erzeugung eines leitenden Füllstoffes vom Mikrokapseltyp für den leitenden Klebstoff - Google Patents

Leitender Klebstoff und Verfahren zur Erzeugung eines leitenden Füllstoffes vom Mikrokapseltyp für den leitenden Klebstoff Download PDF

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Publication number
DE69232886T2
DE69232886T2 DE69232886T DE69232886T DE69232886T2 DE 69232886 T2 DE69232886 T2 DE 69232886T2 DE 69232886 T DE69232886 T DE 69232886T DE 69232886 T DE69232886 T DE 69232886T DE 69232886 T2 DE69232886 T2 DE 69232886T2
Authority
DE
Germany
Prior art keywords
conductive
type
particles
tiny
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69232886T
Other languages
German (de)
English (en)
Other versions
DE69232886D1 (de
Inventor
Hiroaki Nakahara-ku Date
Makoto Nakahara-ku Usui
Isao Nakahara-ku Watanabe
Yuko Ohkubo-cho Hozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4263219A external-priority patent/JPH082995B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69232886D1 publication Critical patent/DE69232886D1/de
Publication of DE69232886T2 publication Critical patent/DE69232886T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
DE69232886T 1991-10-24 1992-10-23 Leitender Klebstoff und Verfahren zur Erzeugung eines leitenden Füllstoffes vom Mikrokapseltyp für den leitenden Klebstoff Expired - Lifetime DE69232886T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP30381891 1991-10-24
JP30381891 1991-10-24
JP26321992 1992-09-04
JP4263219A JPH082995B2 (ja) 1991-10-24 1992-09-04 マイクロカプセル型導電性フィラーの作製方法

Publications (2)

Publication Number Publication Date
DE69232886D1 DE69232886D1 (de) 2003-02-06
DE69232886T2 true DE69232886T2 (de) 2005-03-10

Family

ID=26545912

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69232886T Expired - Lifetime DE69232886T2 (de) 1991-10-24 1992-10-23 Leitender Klebstoff und Verfahren zur Erzeugung eines leitenden Füllstoffes vom Mikrokapseltyp für den leitenden Klebstoff
DE69222501T Expired - Lifetime DE69222501T2 (de) 1991-10-24 1992-10-23 Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69222501T Expired - Lifetime DE69222501T2 (de) 1991-10-24 1992-10-23 Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp

Country Status (3)

Country Link
EP (1) EP0539211B1 (https=)
CA (1) CA2081222C (https=)
DE (2) DE69232886T2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3455871B2 (ja) 1997-06-23 2003-10-14 株式会社スリーボンド マイクロカプセル型導電性フィラーの製造方法
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
US6451875B1 (en) 1999-10-12 2002-09-17 Sony Chemicals Corporation Connecting material for anisotropically electroconductive connection
KR20080027388A (ko) 2000-10-23 2008-03-26 세키스이가가쿠 고교가부시키가이샤 피복 입자
US6734466B2 (en) * 2002-03-05 2004-05-11 Agilent Technologies, Inc. Coated phosphor filler and a method of forming the coated phosphor filler
CN105295760A (zh) * 2015-10-23 2016-02-03 浙江欧仁新材料有限公司 一种各向异性导电双面胶
CN111129789A (zh) * 2018-10-31 2020-05-08 北京梦之墨科技有限公司 一种可变电路及电子器件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02103875A (ja) * 1988-10-11 1990-04-16 Stanley Electric Co Ltd 異方性導電材
JPH02103874A (ja) * 1988-10-11 1990-04-16 Stanley Electric Co Ltd 異方性導電膜
JP2906612B2 (ja) * 1990-08-10 1999-06-21 富士通株式会社 マイクロカプセル型導電性接着剤と接着方法
JP3092971B2 (ja) * 1991-06-07 2000-09-25 富士通株式会社 金属微粒子のポリマ被覆方法

Also Published As

Publication number Publication date
DE69222501D1 (de) 1997-11-06
EP0539211B1 (en) 1997-10-01
CA2081222A1 (en) 1993-04-25
DE69222501T2 (de) 1998-02-05
EP0539211A2 (en) 1993-04-28
CA2081222C (en) 1998-10-27
EP0539211A3 (https=) 1994-03-16
DE69232886D1 (de) 2003-02-06

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