DE69232012T2 - Mehrschichtpackung - Google Patents

Mehrschichtpackung

Info

Publication number
DE69232012T2
DE69232012T2 DE69232012T DE69232012T DE69232012T2 DE 69232012 T2 DE69232012 T2 DE 69232012T2 DE 69232012 T DE69232012 T DE 69232012T DE 69232012 T DE69232012 T DE 69232012T DE 69232012 T2 DE69232012 T2 DE 69232012T2
Authority
DE
Germany
Prior art keywords
conductive layer
contact points
package
contact point
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69232012T
Other languages
German (de)
English (en)
Other versions
DE69232012D1 (de
Inventor
Naohiko Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69232012D1 publication Critical patent/DE69232012D1/de
Application granted granted Critical
Publication of DE69232012T2 publication Critical patent/DE69232012T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W44/20—
    • H10W42/00—
    • H10W70/451—
    • H10W70/467—
    • H10W70/635—
    • H10W70/685—
    • H10W70/682—
    • H10W72/07554—
    • H10W72/547—
    • H10W72/884—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
DE69232012T 1991-06-06 1992-06-05 Mehrschichtpackung Expired - Lifetime DE69232012T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13461391 1991-06-06
JP4139006A JPH05160292A (ja) 1991-06-06 1992-05-29 多層パッケージ

Publications (2)

Publication Number Publication Date
DE69232012D1 DE69232012D1 (de) 2001-09-27
DE69232012T2 true DE69232012T2 (de) 2002-03-14

Family

ID=26468670

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69232012T Expired - Lifetime DE69232012T2 (de) 1991-06-06 1992-06-05 Mehrschichtpackung

Country Status (4)

Country Link
US (1) US5309024A (cg-RX-API-DMAC10.html)
EP (1) EP0517247B1 (cg-RX-API-DMAC10.html)
JP (1) JPH05160292A (cg-RX-API-DMAC10.html)
DE (1) DE69232012T2 (cg-RX-API-DMAC10.html)

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TW238431B (cg-RX-API-DMAC10.html) 1992-12-01 1995-01-11 Stanford W Crane Jr
US5634821A (en) * 1992-12-01 1997-06-03 Crane, Jr.; Stanford W. High-density electrical interconnect system
US5338970A (en) * 1993-03-24 1994-08-16 Intergraph Corporation Multi-layered integrated circuit package with improved high frequency performance
JP3287673B2 (ja) * 1993-11-30 2002-06-04 富士通株式会社 半導体装置
US5679978A (en) * 1993-12-06 1997-10-21 Fujitsu Limited Semiconductor device having resin gate hole through substrate for resin encapsulation
US6111306A (en) 1993-12-06 2000-08-29 Fujitsu Limited Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
EP0749600B1 (en) * 1994-03-11 2001-07-11 The Panda Project Modular architecture for high bandwidth computers
US5541449A (en) * 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5543586A (en) * 1994-03-11 1996-08-06 The Panda Project Apparatus having inner layers supporting surface-mount components
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
US5576931A (en) * 1994-05-03 1996-11-19 The Panda Project Computer with two fans and two air circulation areas
TW276356B (cg-RX-API-DMAC10.html) * 1994-06-24 1996-05-21 Ibm
US5654204A (en) * 1994-07-20 1997-08-05 Anderson; James C. Die sorter
US5461260A (en) * 1994-08-01 1995-10-24 Motorola Inc. Semiconductor device interconnect layout structure for reducing premature electromigration failure due to high localized current density
US6031723A (en) * 1994-08-18 2000-02-29 Allen-Bradley Company, Llc Insulated surface mount circuit board construction
US5483099A (en) * 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
EP0706208B1 (en) * 1994-10-03 2002-06-12 Kabushiki Kaisha Toshiba Method of manufacturing of a semiconductor package integral with semiconductor chip.
US5714801A (en) * 1995-03-31 1998-02-03 Kabushiki Kaisha Toshiba Semiconductor package
JP3432963B2 (ja) * 1995-06-15 2003-08-04 沖電気工業株式会社 半導体集積回路
JP2716005B2 (ja) * 1995-07-04 1998-02-18 日本電気株式会社 ワイヤボンド型半導体装置
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
US5623160A (en) * 1995-09-14 1997-04-22 Liberkowski; Janusz B. Signal-routing or interconnect substrate, structure and apparatus
MY123146A (en) * 1996-03-28 2006-05-31 Intel Corp Perimeter matrix ball grid array circuit package with a populated center
US5895977A (en) * 1996-08-08 1999-04-20 Intel Corporation Bond pad functional layout on die to improve package manufacturability and assembly
US5866949A (en) * 1996-12-02 1999-02-02 Minnesota Mining And Manufacturing Company Chip scale ball grid array for integrated circuit packaging
US5990545A (en) * 1996-12-02 1999-11-23 3M Innovative Properties Company Chip scale ball grid array for integrated circuit package
KR100237328B1 (ko) * 1997-02-26 2000-01-15 김규현 반도체 패키지의 구조 및 제조방법
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
JPH10303562A (ja) * 1997-04-30 1998-11-13 Toshiba Corp プリント配線板
US6100853A (en) * 1997-09-10 2000-08-08 Hughes Electronics Corporation Receiver/transmitter system including a planar waveguide-to-stripline adapter
US6028354A (en) 1997-10-14 2000-02-22 Amkor Technology, Inc. Microelectronic device package having a heat sink structure for increasing the thermal conductivity of the package
US6133628A (en) * 1997-12-18 2000-10-17 Advanced Micro Devices, Inc. Metal layer interconnects with improved performance characteristics
US6169664B1 (en) * 1998-01-05 2001-01-02 Texas Instruments Incorporated Selective performance enhancements for interconnect conducting paths
JP3610221B2 (ja) * 1998-01-27 2005-01-12 キヤノン株式会社 多層プリント配線基板
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
US6141869A (en) * 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier
US6664620B2 (en) 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
GB2377080B (en) 2001-09-11 2003-05-07 Sendo Int Ltd Integrated circuit package and printed circuit board arrangement
EP1376698A1 (en) * 2002-06-25 2004-01-02 STMicroelectronics S.r.l. Electrically erasable and programable non-volatile memory cell
JP4206885B2 (ja) * 2003-09-26 2009-01-14 ソニー株式会社 半導体装置の製造方法
KR20070107746A (ko) 2005-03-01 2007-11-07 엑스2와이 어테뉴에이터스, 엘.엘.씨 내부 중첩된 조절기
US8057240B2 (en) * 2010-03-23 2011-11-15 Tyco Electronics Corporation Circuit board for an electrical connector assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161843A (ja) * 1983-03-07 1984-09-12 Hitachi Ltd 半導体装置
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
JPS62216240A (ja) * 1986-03-17 1987-09-22 Nec Ic Microcomput Syst Ltd 集積回路パツケ−ジ
JPH0777247B2 (ja) * 1986-09-17 1995-08-16 富士通株式会社 半導体装置の製造方法
JPH088321B2 (ja) * 1987-01-19 1996-01-29 住友電気工業株式会社 集積回路パツケ−ジ
US5066831A (en) * 1987-10-23 1991-11-19 Honeywell Inc. Universal semiconductor chip package
US4972253A (en) * 1988-06-27 1990-11-20 Digital Equipment Corporation Programmable ceramic high performance custom package
US4943845A (en) * 1988-08-02 1990-07-24 Northern Telecom Limited Thick film packages with common wafer aperture placement
JPH02239649A (ja) * 1989-03-14 1990-09-21 Fujitsu Ltd ピン・グリッド・アレイディバイスとその搭載用基板
JPH02267947A (ja) * 1989-04-07 1990-11-01 Mitsubishi Electric Corp 半導体装置
US4949453A (en) * 1989-06-15 1990-08-21 Cray Research, Inc. Method of making a chip carrier with terminating resistive elements
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package

Also Published As

Publication number Publication date
EP0517247A2 (en) 1992-12-09
US5309024A (en) 1994-05-03
DE69232012D1 (de) 2001-09-27
EP0517247A3 (cg-RX-API-DMAC10.html) 1994-02-16
JPH05160292A (ja) 1993-06-25
EP0517247B1 (en) 2001-08-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition