DE69203287T2 - Saures Bad zum Aufbringen einer Palladiumzwischenschicht. - Google Patents

Saures Bad zum Aufbringen einer Palladiumzwischenschicht.

Info

Publication number
DE69203287T2
DE69203287T2 DE69203287T DE69203287T DE69203287T2 DE 69203287 T2 DE69203287 T2 DE 69203287T2 DE 69203287 T DE69203287 T DE 69203287T DE 69203287 T DE69203287 T DE 69203287T DE 69203287 T2 DE69203287 T2 DE 69203287T2
Authority
DE
Germany
Prior art keywords
palladium
plating
acid
bath
plating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69203287T
Other languages
German (de)
English (en)
Other versions
DE69203287D1 (de
Inventor
Joseph Anthony Abys
Heinrich Karl Straschil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
AT&T Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Inc filed Critical AT&T Inc
Publication of DE69203287D1 publication Critical patent/DE69203287D1/de
Application granted granted Critical
Publication of DE69203287T2 publication Critical patent/DE69203287T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69203287T 1991-05-03 1992-04-27 Saures Bad zum Aufbringen einer Palladiumzwischenschicht. Expired - Fee Related DE69203287T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,159 US5178745A (en) 1991-05-03 1991-05-03 Acidic palladium strike bath

Publications (2)

Publication Number Publication Date
DE69203287D1 DE69203287D1 (de) 1995-08-10
DE69203287T2 true DE69203287T2 (de) 1996-02-29

Family

ID=24791859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69203287T Expired - Fee Related DE69203287T2 (de) 1991-05-03 1992-04-27 Saures Bad zum Aufbringen einer Palladiumzwischenschicht.

Country Status (7)

Country Link
US (1) US5178745A (enExample)
EP (1) EP0512724B1 (enExample)
JP (1) JPH0776436B2 (enExample)
KR (1) KR0184889B1 (enExample)
DE (1) DE69203287T2 (enExample)
HK (1) HK102396A (enExample)
TW (1) TW211588B (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5639564A (en) * 1993-02-05 1997-06-17 Baldwin Hardware Corporation Multi-layer coated article
US5641579A (en) * 1993-02-05 1997-06-24 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating
US5360991A (en) * 1993-07-29 1994-11-01 At&T Bell Laboratories Integrated circuit devices with solderable lead frame
US5413874A (en) * 1994-06-02 1995-05-09 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5626972A (en) * 1994-06-02 1997-05-06 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5478660A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5478659A (en) * 1994-11-30 1995-12-26 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
US5484663A (en) * 1994-11-30 1996-01-16 Baldwin Hardware Corporation Article having a coating simulating brass
US5482788A (en) * 1994-11-30 1996-01-09 Baldwin Hardware Corporation Article having a protective coating simulating brass
US5552233A (en) * 1995-05-22 1996-09-03 Baldwin Hardware Corporation Article having a decorative and protective multilayer coating simulating brass
US5654108A (en) * 1995-05-22 1997-08-05 Baldwin Hardware Corporation Article having a protective coating simulating brass
US5667904A (en) * 1995-05-22 1997-09-16 Baldwin Hardware Corporation Article having a decorative and protective coating simulating brass
CA2176892C (en) * 1995-05-22 2002-10-29 Stephen R. Moysan, Iii Article having a decorative and protective coating simulating brass
US5675177A (en) * 1995-06-26 1997-10-07 Lucent Technologies Inc. Ultra-thin noble metal coatings for electronic packaging
US5783313A (en) * 1995-12-22 1998-07-21 Baldwin Hardware Corporation Coated Article
US5693427A (en) * 1995-12-22 1997-12-02 Baldwin Hardware Corporation Article with protective coating thereon
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
US6106958A (en) * 1997-04-30 2000-08-22 Masco Corporation Article having a coating
US5989730A (en) * 1997-04-30 1999-11-23 Masco Corporation Article having a decorative and protective multi-layer coating
US5948548A (en) * 1997-04-30 1999-09-07 Masco Corporation Coated article
US5985468A (en) * 1997-04-30 1999-11-16 Masco Corporation Article having a multilayer protective and decorative coating
US6004684A (en) * 1997-04-30 1999-12-21 Masco Corporation Article having a protective and decorative multilayer coating
US5952111A (en) * 1997-04-30 1999-09-14 Masco Corporation Article having a coating thereon
US6033790A (en) * 1997-04-30 2000-03-07 Masco Corporation Article having a coating
US5879532A (en) * 1997-07-09 1999-03-09 Masco Corporation Of Indiana Process for applying protective and decorative coating on an article
US6268060B1 (en) 1997-08-01 2001-07-31 Mascotech Coatings, Inc. Chrome coating having a silicone top layer thereon
US6143431A (en) * 1998-05-04 2000-11-07 Webster; Brian A. Production of Palladium-103
JP4588173B2 (ja) * 2000-06-14 2010-11-24 松田産業株式会社 パラジウム電気めっき液、およびそれを用いためっき方法
US20080138528A1 (en) * 2005-01-12 2008-06-12 Umicore Galvanotechnik Gmbh Method for Depositing Palladium Layers and Palladium Bath Therefor
JP4693813B2 (ja) * 2007-06-12 2011-06-01 ブラザー工業株式会社 ノズルプレートの製造方法
CN102037162B (zh) * 2008-05-07 2013-03-27 尤米科尔电镀技术有限公司 Pd-和Pd-Ni-电镀浴
ATE487812T1 (de) * 2008-11-21 2010-11-15 Umicore Galvanotechnik Gmbh Edelmetallhaltige schichtfolge für dekorative artikel
JP5225903B2 (ja) * 2009-03-23 2013-07-03 本田技研工業株式会社 燃料電池用セパレータの製造方法
DE102010011269B4 (de) * 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
JP5087795B2 (ja) * 2010-08-30 2012-12-05 住友金属鉱山株式会社 ボンディングワイヤ
US10431509B2 (en) 2014-10-31 2019-10-01 General Electric Company Non-magnetic package and method of manufacture
US10196745B2 (en) * 2014-10-31 2019-02-05 General Electric Company Lid and method for sealing a non-magnetic package
CN105401182B (zh) * 2015-10-14 2017-06-23 佛山科学技术学院 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法
JP6875480B2 (ja) * 2019-09-27 2021-05-26 マクセルホールディングス株式会社 蒸着マスク及びその製造方法
JP7759757B2 (ja) * 2021-10-07 2025-10-24 Ｅｅｊａ株式会社 ＰｔＲｕ合金めっき膜及び該ＰｔＲｕ合金めっき膜を備える積層構造

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
JPS55175874U (enExample) * 1979-06-04 1980-12-17
JPS5730024A (en) * 1980-07-30 1982-02-18 Fuji Facom Corp Designating system for graphic form
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
US4454010A (en) * 1982-08-30 1984-06-12 At & T Bell Laboratories Palladium plating procedure
US4552628A (en) * 1982-09-09 1985-11-12 Engelhard Corporation Palladium electroplating and bath thereof
US4511798A (en) * 1983-02-23 1985-04-16 Westinghouse Electric Corp. Meter encoding register with tapered aperture in baffle insert
DE3317493A1 (de) * 1983-05-13 1984-11-15 W.C. Heraeus Gmbh, 6450 Hanau Galvanische abscheidung von palladium-ueberzuegen
US4493754A (en) * 1983-12-30 1985-01-15 At&T Bell Laboratories Electrodes for palladium electroplating process
JPS60248892A (ja) * 1984-05-24 1985-12-09 Electroplating Eng Of Japan Co 高純度パラジウム・ニッケル合金メッキ液及び方法
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium

Also Published As

Publication number Publication date
KR920021741A (ko) 1992-12-18
DE69203287D1 (de) 1995-08-10
US5178745A (en) 1993-01-12
KR0184889B1 (ko) 1999-04-01
EP0512724A3 (en) 1993-04-07
JPH05112888A (ja) 1993-05-07
HK102396A (en) 1996-06-21
EP0512724B1 (en) 1995-07-05
TW211588B (enExample) 1993-08-21
JPH0776436B2 (ja) 1995-08-16
EP0512724A2 (en) 1992-11-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee