CN105401182B - 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法 - Google Patents
一种在不锈钢上电镀厚钯的镀液配方及其电镀方法 Download PDFInfo
- Publication number
- CN105401182B CN105401182B CN201510662315.7A CN201510662315A CN105401182B CN 105401182 B CN105401182 B CN 105401182B CN 201510662315 A CN201510662315 A CN 201510662315A CN 105401182 B CN105401182 B CN 105401182B
- Authority
- CN
- China
- Prior art keywords
- plating
- stainless steel
- palladium
- thick
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 116
- 238000007747 plating Methods 0.000 title claims abstract description 79
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 58
- 239000010935 stainless steel Substances 0.000 title claims abstract description 48
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 48
- 238000009713 electroplating Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000012669 liquid formulation Substances 0.000 title claims abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 21
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims abstract description 8
- 235000004279 alanine Nutrition 0.000 claims abstract description 8
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 8
- 125000003963 dichloro group Chemical group Cl* 0.000 claims abstract description 8
- OPGYRRGJRBEUFK-UHFFFAOYSA-L disodium;diacetate Chemical compound [Na+].[Na+].CC([O-])=O.CC([O-])=O OPGYRRGJRBEUFK-UHFFFAOYSA-L 0.000 claims abstract description 8
- 239000001632 sodium acetate Substances 0.000 claims abstract description 8
- 235000017454 sodium diacetate Nutrition 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 239000008367 deionised water Substances 0.000 claims description 14
- 229910021641 deionized water Inorganic materials 0.000 claims description 14
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 10
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 238000005238 degreasing Methods 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- 235000021110 pickles Nutrition 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 5
- 239000004327 boric acid Substances 0.000 claims description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 5
- 239000003995 emulsifying agent Substances 0.000 claims description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 claims description 5
- 235000019341 magnesium sulphate Nutrition 0.000 claims description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 5
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 5
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 5
- 239000001488 sodium phosphate Substances 0.000 claims description 5
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 5
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 5
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 5
- 238000002604 ultrasonography Methods 0.000 claims description 5
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 14
- 238000000576 coating method Methods 0.000 abstract description 14
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 3
- 230000006641 stabilisation Effects 0.000 abstract description 3
- 238000011105 stabilization Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 16
- 238000002242 deionisation method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000005088 metallography Methods 0.000 description 3
- 230000002000 scavenging effect Effects 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- KCIDZIIHRGYJAE-YGFYJFDDSA-L dipotassium;[(2r,3r,4s,5r,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl] phosphate Chemical compound [K+].[K+].OC[C@H]1O[C@H](OP([O-])([O-])=O)[C@H](O)[C@@H](O)[C@H]1O KCIDZIIHRGYJAE-YGFYJFDDSA-L 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
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CN201510662315.7A CN105401182B (zh) | 2015-10-14 | 2015-10-14 | 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法 |
Applications Claiming Priority (1)
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CN201510662315.7A CN105401182B (zh) | 2015-10-14 | 2015-10-14 | 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法 |
Publications (2)
Publication Number | Publication Date |
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CN105401182A CN105401182A (zh) | 2016-03-16 |
CN105401182B true CN105401182B (zh) | 2017-06-23 |
Family
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CN201510662315.7A Expired - Fee Related CN105401182B (zh) | 2015-10-14 | 2015-10-14 | 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法 |
Country Status (1)
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CN (1) | CN105401182B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106811778A (zh) * | 2015-11-27 | 2017-06-09 | 中国科学院大连化学物理研究所 | 组分和厚度可控的钯铜合金膜的制备及钯铜合金膜和应用 |
CN106757204A (zh) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | 一种在不锈钢表面镀钯的渡液及其应用 |
CN106757208A (zh) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | 一种镍钯合金渡液及其应用 |
CN106521576A (zh) * | 2016-11-29 | 2017-03-22 | 江苏澳光电子有限公司 | 一种铜合金表面镀钯的渡液及其应用 |
CN106757207A (zh) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | 一种用于pcb板化学镀镍钯合金的方法 |
CN106757203A (zh) * | 2016-11-29 | 2017-05-31 | 江苏澳光电子有限公司 | 一种钼合金表面化学镀钯的渡液及其应用 |
JP7282136B2 (ja) * | 2021-02-12 | 2023-05-26 | 松田産業株式会社 | パラジウムめっき液及びパラジウムめっき補充液 |
CN115244222A (zh) * | 2021-02-12 | 2022-10-25 | 松田产业株式会社 | 镀钯液和镀钯补充液 |
CN115820039A (zh) * | 2022-12-28 | 2023-03-21 | 厦门大学 | 一种多孔导电油墨、其制备方法及应用 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4328286A (en) * | 1979-04-26 | 1982-05-04 | The International Nickel Co., Inc. | Electrodeposited palladium, method of preparation and electrical contact made thereby |
JPS569387A (en) * | 1979-07-04 | 1981-01-30 | Seiko Instr & Electronics Ltd | Plating method of decorative article |
US4486274A (en) * | 1981-02-27 | 1984-12-04 | At&T Bell Laboratories | Palladium plating prodedure |
US4545868A (en) * | 1981-10-06 | 1985-10-08 | Learonal, Inc. | Palladium plating |
JPS59219483A (ja) * | 1984-03-12 | 1984-12-10 | Masami Kobayashi | ステンレス鋼製品に半田性を付与する方法 |
US4673472A (en) * | 1986-02-28 | 1987-06-16 | Technic Inc. | Method and electroplating solution for deposition of palladium or alloys thereof |
DD264462A1 (de) * | 1987-09-28 | 1989-02-01 | Mikroelektronik Wilhelm Pieck | Palladium/nickel-legierungselektrolyt |
SU1585391A1 (ru) * | 1988-05-16 | 1990-08-15 | Рижское Производственное Объединение Вэф Им.В.И.Ленина | Электролит дл осаждени сплава палладий-никель |
US5178745A (en) * | 1991-05-03 | 1993-01-12 | At&T Bell Laboratories | Acidic palladium strike bath |
JP3560250B2 (ja) * | 1993-02-02 | 2004-09-02 | 新光電気工業株式会社 | 半導体装置用リードフレーム |
FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
JP2002119834A (ja) * | 2000-10-16 | 2002-04-23 | Mitsubishi Kakoki Kaisha Ltd | 無機水素分離膜の製造方法 |
JP3396470B2 (ja) * | 2000-11-21 | 2003-04-14 | 三菱重工業株式会社 | Pd系水素分離膜を製造する方法 |
CN1289716C (zh) * | 2001-11-30 | 2006-12-13 | 松田产业株式会社 | 钯电镀液 |
CN101285203B (zh) * | 2007-04-13 | 2011-04-20 | 碧氢科技开发股份有限公司 | 含钯电镀液及其应用 |
CN101348928B (zh) * | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | 镀钯及镀钯合金之高速方法 |
CN101363129B (zh) * | 2008-09-19 | 2010-09-01 | 北京化工大学 | 一种不锈钢设备在高温非氧化性介质中的防腐处理工艺 |
JP5175156B2 (ja) * | 2008-09-30 | 2013-04-03 | 松田産業株式会社 | パラジウム合金めっき液およびめっき方法 |
CN102168291B (zh) * | 2011-03-16 | 2013-05-01 | 上海中子星化工科技有限公司 | 一种镀钯液 |
CN104611745B (zh) * | 2015-01-25 | 2016-11-30 | 北京化工大学 | 不锈钢表面高耐蚀耐磨性Pd–Co梯度合金电镀工艺 |
-
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- 2015-10-14 CN CN201510662315.7A patent/CN105401182B/zh not_active Expired - Fee Related
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Inventor after: Zhou Haixia Inventor before: Yang Fuguo Inventor before: Zhang Yuhong Inventor before: Yang Fei |
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Effective date of registration: 20180110 Address after: 510630 Guangdong city of Guangzhou province Tianhe District Hua Jing Lu Hai Jin No. 66 room 228 Office Patentee after: The Guangzhou Intellectual Property Service Co. Ltd. Address before: 528000 Jiangwan Road, Chancheng District, Guangdong, No. 18, No. Patentee before: Foshan Science &. Technology College |
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Effective date of registration: 20180514 Address after: 528313, No. 12, No. two road, Tan Village Industrial Zone, Shunde District, Foshan, Guangdong. Patentee after: Foshan Baoshui Stainless Steel Co., Ltd. Address before: 510630 room 228, Hai Jin office, 66 Hua Jing Road, Tianhe District, Guangzhou, Guangdong. Patentee before: The Guangzhou Intellectual Property Service Co. Ltd. |
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