DE69106625D1 - Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten. - Google Patents

Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten.

Info

Publication number
DE69106625D1
DE69106625D1 DE69106625T DE69106625T DE69106625D1 DE 69106625 D1 DE69106625 D1 DE 69106625D1 DE 69106625 T DE69106625 T DE 69106625T DE 69106625 T DE69106625 T DE 69106625T DE 69106625 D1 DE69106625 D1 DE 69106625D1
Authority
DE
Germany
Prior art keywords
drilling
holes
printed circuit
circuit boards
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69106625T
Other languages
English (en)
Other versions
DE69106625T2 (de
Inventor
Morio Gaku
Hidenori Kimbara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Publication of DE69106625D1 publication Critical patent/DE69106625D1/de
Application granted granted Critical
Publication of DE69106625T2 publication Critical patent/DE69106625T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
DE69106625T 1990-08-08 1991-07-31 Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten. Expired - Lifetime DE69106625T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2208239A JP2855824B2 (ja) 1990-08-08 1990-08-08 プリント配線板の孔明け加工法

Publications (2)

Publication Number Publication Date
DE69106625D1 true DE69106625D1 (de) 1995-02-23
DE69106625T2 DE69106625T2 (de) 1995-05-18

Family

ID=16552963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69106625T Expired - Lifetime DE69106625T2 (de) 1990-08-08 1991-07-31 Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten.

Country Status (6)

Country Link
US (1) US5082402A (de)
EP (1) EP0470757B1 (de)
JP (1) JP2855824B2 (de)
KR (1) KR100225273B1 (de)
DE (1) DE69106625T2 (de)
TW (1) TW223731B (de)

Families Citing this family (50)

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Publication number Priority date Publication date Assignee Title
AU658320B2 (en) * 1992-08-20 1995-04-06 Shell Internationale Research Maatschappij B.V. Copolymer compositions comprising a copolymer and one or more lubricating additives
JP2828129B2 (ja) * 1993-06-07 1998-11-25 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
US5507603A (en) * 1993-08-05 1996-04-16 Dai-Ichi Kogyo Seiyaku Co., Ltd. Method for drilling thru-holes on a lamination substrate and a sheet used therein
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5984523A (en) * 1998-02-03 1999-11-16 International Business Machines Corporation Method for recording the heat generated in a hole wall of a substrate during a drilling operation
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6200074B1 (en) * 1999-04-07 2001-03-13 James J. Miller Method for drilling circuit boards
JP4342119B2 (ja) 2000-04-06 2009-10-14 株式会社神戸製鋼所 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
US6890664B2 (en) * 2000-09-14 2005-05-10 Ohtomo Chemical Inc., Corp. Entry boards for use in drilling small holes
JP4968652B2 (ja) * 2001-07-17 2012-07-04 日本合成化学工業株式会社 プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
JP3976228B2 (ja) * 2001-11-09 2007-09-12 日本合成化学工業株式会社 プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法
JP3976233B2 (ja) * 2001-12-18 2007-09-12 日本合成化学工業株式会社 プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same
US8062746B2 (en) * 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
CN100348411C (zh) * 2004-04-13 2007-11-14 叶云照 钻孔润滑铝质复合材料
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
TWI260094B (en) 2005-06-13 2006-08-11 Au Optronics Corp Active device matrix substrate
CN100478131C (zh) * 2006-04-11 2009-04-15 合正科技股份有限公司 高速钻孔用散热辅助板材
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
US8095616B2 (en) * 2006-10-05 2012-01-10 Waratek Pty Ltd. Contention detection
KR20080055264A (ko) * 2006-12-15 2008-06-19 홍부진 천공 가공용 쉬트
WO2008072930A2 (en) * 2006-12-15 2008-06-19 Bu Jin Hong Sheets for drilling
WO2009045932A1 (en) 2007-09-28 2009-04-09 Tri-Star Laminates, Inc. Improved systems and methods for drilling holes in printed circuit boards
JP4483929B2 (ja) * 2007-10-30 2010-06-16 セイコーエプソン株式会社 導体パターン形成用インク、導体パターンおよび配線基板
JP5195404B2 (ja) * 2007-12-26 2013-05-08 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
KR101153259B1 (ko) * 2009-06-01 2012-06-07 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 드릴 구멍뚫기용 엔트리 시트
MY157756A (en) 2010-06-18 2016-07-15 Mitsubishi Gas Chemical Co Entry sheet for drilling
WO2012035771A1 (ja) 2010-09-17 2012-03-22 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシート
MY162029A (en) 2012-03-09 2017-05-31 Mitsubishi Gas Chemical Co Entry sheet for drilling use
RU2603400C2 (ru) 2012-03-21 2016-11-27 Мицубиси Гэс Кемикал Компани, Инк. Прокладочный лист для сверления и способ сверления
MY168401A (en) 2012-03-27 2018-11-01 Mitsubishi Gas Chemical Co Entry sheet for drilling
JP6206700B2 (ja) * 2013-03-28 2017-10-04 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法
US9358618B2 (en) 2013-07-29 2016-06-07 Globalfoundries Inc. Implementing reduced drill smear
WO2015152162A1 (ja) 2014-03-31 2015-10-08 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート
US10486324B2 (en) 2015-03-19 2019-11-26 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling processing using same
CN107428020B (zh) 2015-03-19 2019-05-17 三菱瓦斯化学株式会社 钻孔用盖板和使用其的钻孔加工方法
US11383307B2 (en) 2015-09-02 2022-07-12 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling processing using same
EP3157310A1 (de) 2015-10-12 2017-04-19 Agfa Graphics Nv Erfassungsblatt zur perforation elektrischer platten, wie etwa leiterplatten
RU2693232C1 (ru) * 2015-11-26 2019-07-01 Мицубиси Гэс Кемикал Компани, Инк. Способ резки армированного волокнами композиционного материала
BR112018007991A2 (pt) 2016-02-17 2018-10-30 Mitsubishi Gas Chemical Company, Inc. método de trabalho de corte e método para produzir um produto cortado
CN108778650B (zh) 2016-03-14 2019-07-26 三菱瓦斯化学株式会社 钻孔用盖板和使用其的钻孔加工方法
US11819930B2 (en) 2016-11-14 2023-11-21 Mitsubishi Gas Chemical Company, Inc. Material for built-up edge formation and built-up edge formation method
JP7057901B2 (ja) 2017-05-25 2022-04-21 三菱瓦斯化学株式会社 切削加工補助潤滑材、切削加工補助潤滑シート、及び切削加工方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2488676B1 (fr) * 1980-08-18 1986-03-28 Dacral Procede de traitement de toles prerevetues avant faconnage
JPS5780495A (en) * 1980-11-07 1982-05-20 Kao Corp Plastic working oil composition for metal
US4519732A (en) * 1983-12-09 1985-05-28 United Technologies Corporation Method for the machining of composite materials
JPS619439A (ja) * 1984-06-25 1986-01-17 Hitachi Chem Co Ltd 印刷配線板用プリプレグの製造方法
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards

Also Published As

Publication number Publication date
JPH0492494A (ja) 1992-03-25
KR100225273B1 (ko) 1999-10-15
JP2855824B2 (ja) 1999-02-10
EP0470757B1 (de) 1995-01-11
EP0470757A3 (en) 1992-06-24
TW223731B (de) 1994-05-11
EP0470757A2 (de) 1992-02-12
US5082402A (en) 1992-01-21
DE69106625T2 (de) 1995-05-18
KR920005676A (ko) 1992-03-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition