DE69114930D1 - Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten. - Google Patents
Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten.Info
- Publication number
- DE69114930D1 DE69114930D1 DE69114930T DE69114930T DE69114930D1 DE 69114930 D1 DE69114930 D1 DE 69114930D1 DE 69114930 T DE69114930 T DE 69114930T DE 69114930 T DE69114930 T DE 69114930T DE 69114930 D1 DE69114930 D1 DE 69114930D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- mounting
- printed circuit
- circuit boards
- soldering flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/546,646 US5009724A (en) | 1990-07-02 | 1990-07-02 | Soldering flux and method of its use in fabricating and assembling circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69114930D1 true DE69114930D1 (de) | 1996-01-11 |
DE69114930T2 DE69114930T2 (de) | 1996-07-11 |
Family
ID=24181363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69114930T Expired - Fee Related DE69114930T2 (de) | 1990-07-02 | 1991-06-25 | Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5009724A (de) |
EP (1) | EP0466355B1 (de) |
JP (1) | JP2609378B2 (de) |
DE (1) | DE69114930T2 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198038A (en) * | 1990-05-15 | 1993-03-30 | Hughes Aircraft Company | Foaming flux for automatic soldering process |
US5069730A (en) * | 1991-01-28 | 1991-12-03 | At&T Bell Laboratories | Water-soluble soldering paste |
US5127571A (en) * | 1991-10-31 | 1992-07-07 | International Business Machines Corporation | Water soluble soldering preflux and method of application |
US5215602A (en) * | 1992-05-29 | 1993-06-01 | At&T Bell Laboratories | Water-soluble flux |
US6077725A (en) * | 1992-09-03 | 2000-06-20 | Lucent Technologies Inc | Method for assembling multichip modules |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
US7108755B2 (en) * | 2002-07-30 | 2006-09-19 | Motorola, Inc. | Simplification of ball attach method using super-saturated fine crystal flux |
US20050067468A1 (en) * | 2003-09-30 | 2005-03-31 | Daoqiang Lu | Fluxes for flip chip assembly using water soluble polymers |
US20070284412A1 (en) * | 2006-05-31 | 2007-12-13 | Prakash Anna M | Solder flux composition |
US7780801B2 (en) * | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
CN101234460B (zh) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | 水溶性热浸镀锡助焊剂及其制备方法 |
US7956114B2 (en) * | 2009-03-09 | 2011-06-07 | Raytheon Company | Water immiscible rosin mildly activated flux |
CN101890595B (zh) * | 2010-07-02 | 2012-07-04 | 厦门大学 | 一种用于无铅药芯焊丝的低松香免清洗助焊剂及其制备方法 |
CN103521952A (zh) * | 2012-07-06 | 2014-01-22 | 重庆微世特电子材料有限公司 | 粘焊两用型无卤电子助剂及其制备方法 |
US8887981B2 (en) | 2013-03-15 | 2014-11-18 | Raytheon Company | Temporary adhesive for component bonding |
CN104772581B (zh) * | 2015-04-28 | 2016-07-06 | 苏州永创达电子有限公司 | 一种助焊剂 |
CN108326470B (zh) * | 2017-12-11 | 2020-12-04 | 五河县俊宝钢结构有限公司 | 一种环保水清洗型助焊剂 |
CN108465984B (zh) * | 2018-06-28 | 2020-09-04 | 广东剑鑫科技股份有限公司 | 一种无卤水溶性助焊剂及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2806808A (en) * | 1953-02-16 | 1957-09-17 | Muetzel Peter Siegfried | Soldering fluxes |
US3158120A (en) * | 1960-10-17 | 1964-11-24 | Fairmount Chem | Core solder |
US3746620A (en) * | 1971-07-13 | 1973-07-17 | Nl Industries Inc | Water soluble flux composition |
US4153482A (en) * | 1977-11-15 | 1979-05-08 | Chevron Research Company | Process for soldering using a phosphorus-containing liquid flux |
US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
US4441938A (en) * | 1983-03-29 | 1984-04-10 | International Business Machines Corporation | Soldering flux |
US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
US4561913A (en) * | 1984-03-12 | 1985-12-31 | At&T Technologies, Inc. | Soldering flux additive |
SE457335B (sv) * | 1984-07-20 | 1988-12-19 | Ytkemiska Inst | Flussmedel foer mjukloedning samt foerfarande foer mjukloedning med anvaendning av flussmedlet |
JPS61242790A (ja) * | 1985-04-19 | 1986-10-29 | Asahi Kagaku Kenkyusho:Kk | 半田付け用フラツクス |
JPS62137195A (ja) * | 1985-12-10 | 1987-06-20 | Sanko Kagaku Kk | ハンダ用フラツクス組成物 |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
-
1990
- 1990-07-02 US US07/546,646 patent/US5009724A/en not_active Expired - Lifetime
-
1991
- 1991-06-25 DE DE69114930T patent/DE69114930T2/de not_active Expired - Fee Related
- 1991-06-25 EP EP91305761A patent/EP0466355B1/de not_active Expired - Lifetime
- 1991-06-26 JP JP3180496A patent/JP2609378B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH04237593A (ja) | 1992-08-26 |
DE69114930T2 (de) | 1996-07-11 |
JP2609378B2 (ja) | 1997-05-14 |
US5009724A (en) | 1991-04-23 |
EP0466355B1 (de) | 1995-11-29 |
EP0466355A1 (de) | 1992-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |