DE69227277D1 - Verfahren zur Benützung von Lötflussmittel, gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung - Google Patents

Verfahren zur Benützung von Lötflussmittel, gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung

Info

Publication number
DE69227277D1
DE69227277D1 DE69227277T DE69227277T DE69227277D1 DE 69227277 D1 DE69227277 D1 DE 69227277D1 DE 69227277 T DE69227277 T DE 69227277T DE 69227277 T DE69227277 T DE 69227277T DE 69227277 D1 DE69227277 D1 DE 69227277D1
Authority
DE
Germany
Prior art keywords
manufacture
circuit board
printed circuit
soldering flux
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69227277T
Other languages
English (en)
Other versions
DE69227277T2 (de
Inventor
Hiroshi Gunji
Kenichi Yamaguchi
Daikichi Tachibana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanwa Laboratory Ltd
Hitachi Ltd
Original Assignee
Sanwa Laboratory Ltd
Hitachi Telecom Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanwa Laboratory Ltd, Hitachi Telecom Technologies Ltd filed Critical Sanwa Laboratory Ltd
Application granted granted Critical
Publication of DE69227277D1 publication Critical patent/DE69227277D1/de
Publication of DE69227277T2 publication Critical patent/DE69227277T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
DE1992627277 1991-05-17 1992-05-15 Verfahren zur Benützung von Lötflussmittel, gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung Expired - Lifetime DE69227277T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16736391 1991-05-17
JP25031391 1991-09-04

Publications (2)

Publication Number Publication Date
DE69227277D1 true DE69227277D1 (de) 1998-11-19
DE69227277T2 DE69227277T2 (de) 1999-06-24

Family

ID=26491427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992627277 Expired - Lifetime DE69227277T2 (de) 1991-05-17 1992-05-15 Verfahren zur Benützung von Lötflussmittel, gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (2) US5478607A (de)
EP (1) EP0513831B1 (de)
KR (1) KR100254016B1 (de)
CA (1) CA2068761C (de)
DE (1) DE69227277T2 (de)
TW (1) TW226346B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW217426B (de) * 1992-01-08 1993-12-11 Mekku Kk
DE4311807C2 (de) * 1993-04-03 1998-03-19 Atotech Deutschland Gmbh Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik
TW263534B (de) * 1993-08-11 1995-11-21 Makkusu Kk
US5975201A (en) * 1994-10-31 1999-11-02 The Johns Hopkins University Heat sink for increasing through-thickness thermal conductivity of organic matrix composite structures
DE4444388A1 (de) * 1994-11-28 1996-05-30 Atotech Deutschland Gmbh Verfahren zum Bonden von Drähten auf oxidationsempfindlichen, lötbaren Metallsubstraten
US6188027B1 (en) 1999-06-30 2001-02-13 International Business Machines Corporation Protection of a plated through hole from chemical attack
US6524644B1 (en) 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
SG99331A1 (en) * 2000-01-13 2003-10-27 Hitachi Ltd Method of producing electronic part with bumps and method of producing elctronic part
JP2002122420A (ja) * 2000-10-16 2002-04-26 Nippon Mektron Ltd 銅面防錆皮膜の厚み測定方法および装置
JP2003031929A (ja) * 2001-07-19 2003-01-31 Tamura Kaken Co Ltd 水溶性プリフラックス、プリント回路基板及びプリント回路基板の金属の表面処理方法
WO2003085656A1 (en) * 2002-04-10 2003-10-16 Sony Corporation Optical recording medium and production method therefor
JP2005026456A (ja) * 2003-07-02 2005-01-27 Toshiba Corp プリント配線板、電子部品実装方法および電子機器
KR100797692B1 (ko) * 2006-06-20 2008-01-23 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
JP5351830B2 (ja) * 2010-05-21 2013-11-27 日東電工株式会社 配線回路基板およびその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2089003A5 (de) * 1970-04-02 1972-01-07 Shikoku Chem
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
US4438190A (en) * 1981-03-04 1984-03-20 Hitachi Chemical Company, Ltd. Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion
KR960008153B1 (ko) * 1989-10-03 1996-06-20 다찌바나 다이끼찌 금속 공작용 표면 처리제
EP0428383A1 (de) * 1989-11-13 1991-05-22 Shikoku Chemicals Corporation Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen
US5176749A (en) * 1991-06-20 1993-01-05 Argus International Preflux coating composition for copper
US5275694A (en) * 1992-03-24 1994-01-04 Sanwa Laboratory Ltd. Process for production of copper through-hole printed wiring boards

Also Published As

Publication number Publication date
TW226346B (de) 1994-07-11
DE69227277T2 (de) 1999-06-24
KR920022941A (ko) 1992-12-19
CA2068761C (en) 1998-09-29
EP0513831B1 (de) 1998-10-14
EP0513831A1 (de) 1992-11-19
CA2068761A1 (en) 1992-11-18
KR100254016B1 (ko) 2000-05-01
US5478607A (en) 1995-12-26
US5441814A (en) 1995-08-15

Similar Documents

Publication Publication Date Title
DE69204516T2 (de) Leiterplatte mit Lötüberzug und Verfahren zu ihrer Herstellung.
DE68909853T2 (de) Verfahren und Film zur Herstellung von gedruckten Schaltungsplatten.
DE69120198D1 (de) Mehrschichtige, gedruckte Leiterplatte und Verfahren zu ihrer Herstellung
DE69412405D1 (de) Leiterplatte und Verfahren zu ihrer Herstellung
DE69208601D1 (de) Verfahren zur Verbindung von Leiterplatten
DE69120869D1 (de) Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung
DE69419219T2 (de) Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten
DE69331511T2 (de) Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung
DE69117381D1 (de) Mehrschichtleiterplatte und Verfahren zu ihrer Herstellung
DE69121501D1 (de) Mehrschichtige Leiterplatte und Verfahren zu ihrer Herstellung
DE69106625D1 (de) Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten.
DE59208656D1 (de) Verfahren zum Beloten und Montieren von Leiterplatten mit Bauelementen
DE69418698D1 (de) Verfahren zur Herstellung von Leiterplatten
DE69636010D1 (de) Gedruckte schaltungsplatte und verfahren zu deren herstellung
DE69215338T2 (de) Mehrschichtige Leiterplatte, Zwischenverbindungsteil und Verfahren zur Herstellung
DE69431828D1 (de) Verfahren zur Herstellung von gedruckten Schaltungskarten
DE69227277T2 (de) Verfahren zur Benützung von Lötflussmittel, gedruckte Schaltungsplatte und Verfahren zu seiner Herstellung
DE69012648D1 (de) Leiterplatte zur Verminderung der elektromagnetischen Störungen und Verfahren dafür.
DE69114930D1 (de) Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten.
DE69317342T2 (de) Leiterplatte aus Aluminiumnitrid und Verfahren zu ihrer Herstellung
DE59009928D1 (de) Verfahren zum Beloten von Leiterplatten.
DE69115619D1 (de) Leiterplatte und Verfahren zu ihrer Herstellung
DE69326925T2 (de) Verfahren zur Herstellung von gedruckten Leiterplatten
DE69803664D1 (de) Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten
DE59502633D1 (de) Verfahren zur Codierung von Leiterplatten

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI, LTD., TOKYO, JP

Owner name: SANWA LABORATORY LTD., TOKIO/TOKYO, JP