DE69017258D1 - Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung. - Google Patents

Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung.

Info

Publication number
DE69017258D1
DE69017258D1 DE69017258T DE69017258T DE69017258D1 DE 69017258 D1 DE69017258 D1 DE 69017258D1 DE 69017258 T DE69017258 T DE 69017258T DE 69017258 T DE69017258 T DE 69017258T DE 69017258 D1 DE69017258 D1 DE 69017258D1
Authority
DE
Germany
Prior art keywords
heating
semiconductor wafer
wafer processing
processing device
cooling wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69017258T
Other languages
English (en)
Other versions
DE69017258T2 (de
Inventor
Chiu-Wing Tsui
Richard H Crockett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69017258D1 publication Critical patent/DE69017258D1/de
Publication of DE69017258T2 publication Critical patent/DE69017258T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/935—Gas flow control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69017258T 1989-05-08 1990-03-30 Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung. Expired - Fee Related DE69017258T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US34852789A 1989-05-08 1989-05-08

Publications (2)

Publication Number Publication Date
DE69017258D1 true DE69017258D1 (de) 1995-04-06
DE69017258T2 DE69017258T2 (de) 1995-08-03

Family

ID=23368419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69017258T Expired - Fee Related DE69017258T2 (de) 1989-05-08 1990-03-30 Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung.

Country Status (5)

Country Link
US (1) US5443997A (de)
EP (1) EP0397315B1 (de)
JP (1) JPH02308529A (de)
KR (1) KR100189646B1 (de)
DE (1) DE69017258T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0635870A1 (de) * 1993-07-20 1995-01-25 Applied Materials, Inc. Eine elektrostatische Halteplatte mit einer gerillten Fläche
JP3386651B2 (ja) 1996-04-03 2003-03-17 株式会社東芝 半導体装置の製造方法および半導体製造装置
US5808175A (en) * 1996-06-03 1998-09-15 Vanguard International Semiconductor Corporation Solving production down time with parallel low pressure sensors
US5856906A (en) * 1997-05-12 1999-01-05 Applied Materials, Inc. Backside gas quick dump apparatus for a semiconductor wafer processing system
US5808176A (en) * 1997-06-03 1998-09-15 Vanguard International Semiconductor Corporation Solving production downtime with parallel low pressure sensors
US6073366A (en) 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
US6075922A (en) * 1997-08-07 2000-06-13 Steag Rtp Systems, Inc. Process for preventing gas leaks in an atmospheric thermal processing chamber
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6957690B1 (en) 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
EP1142001B1 (de) * 1998-11-20 2007-10-03 Steag RTP Systems, Inc. Schnell-aufheiz- und -kühlvorrichtung für halbleiterwafer
US6319569B1 (en) 1998-11-30 2001-11-20 Howmet Research Corporation Method of controlling vapor deposition substrate temperature
EP1083591A4 (de) * 1999-03-05 2008-11-26 Tokyo Electron Ltd Vorrichtung zur plasmabehandlung
US6499777B1 (en) 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism
US6461801B1 (en) 1999-05-27 2002-10-08 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
KR101018259B1 (ko) * 2002-09-10 2011-03-03 액셀리스 테크놀로지스, 인크. 일정 온도 척을 사용하여 가변 온도 프로세스로 기판을 가열하는 방법
US6960528B2 (en) * 2002-09-20 2005-11-01 Academia Sinica Method of forming a nanotip array in a substrate by forming masks on portions of the substrate and etching the unmasked portions
DE102005062977B3 (de) * 2005-12-28 2007-09-13 Sulfurcell Solartechnik Gmbh Verfahren und Vorrichtung zur Umsetzung metallischer Vorläuferschichten zu Chalkopyritschichten von CIGSS-solarzellen
US7820230B2 (en) 2007-08-31 2010-10-26 Panasonic Corporation Plasma doping processing device and method thereof
GB2478269A (en) * 2009-12-18 2011-09-07 Surrey Nanosystems Ltd Nanomaterials growth system and method
JP2012124529A (ja) * 2012-03-12 2012-06-28 Tokyo Electron Ltd 基板処理装置，基板処理方法及び記録媒体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4261762A (en) * 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4680061A (en) * 1979-12-21 1987-07-14 Varian Associates, Inc. Method of thermal treatment of a wafer in an evacuated environment
US4743570A (en) * 1979-12-21 1988-05-10 Varian Associates, Inc. Method of thermal treatment of a wafer in an evacuated environment
JPS5832410A (ja) * 1981-08-06 1983-02-25 ザ・パ−キン−エルマ−・コ−ポレイシヨン ガス状減圧環境下で構造物を処理する方法及び装置
US4512391A (en) * 1982-01-29 1985-04-23 Varian Associates, Inc. Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet
US4392915A (en) * 1982-02-16 1983-07-12 Eaton Corporation Wafer support system
US4508161A (en) * 1982-05-25 1985-04-02 Varian Associates, Inc. Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4457359A (en) * 1982-05-25 1984-07-03 Varian Associates, Inc. Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
US4466872A (en) * 1982-12-23 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for depositing a continuous film of minimum thickness
US4542298A (en) * 1983-06-09 1985-09-17 Varian Associates, Inc. Methods and apparatus for gas-assisted thermal transfer with a semiconductor wafer
JPS6083323A (ja) * 1983-10-14 1985-05-11 Ulvac Corp 基板冷却法
US4527620A (en) * 1984-05-02 1985-07-09 Varian Associates, Inc. Apparatus for controlling thermal transfer in a cyclic vacuum processing system
US4615755A (en) * 1985-08-07 1986-10-07 The Perkin-Elmer Corporation Wafer cooling and temperature control for a plasma etching system
US4609037A (en) * 1985-10-09 1986-09-02 Tencor Instruments Apparatus for heating and cooling articles
JPH0773104B2 (ja) * 1986-02-14 1995-08-02 富士通株式会社 レジスト剥離方法

Also Published As

Publication number Publication date
JPH02308529A (ja) 1990-12-21
EP0397315A3 (de) 1991-11-13
DE69017258T2 (de) 1995-08-03
EP0397315A2 (de) 1990-11-14
KR100189646B1 (ko) 1999-06-01
US5443997A (en) 1995-08-22
EP0397315B1 (de) 1995-03-01
KR900019208A (ko) 1990-12-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee