DE69213548D1 - Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen - Google Patents

Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen

Info

Publication number
DE69213548D1
DE69213548D1 DE69213548T DE69213548T DE69213548D1 DE 69213548 D1 DE69213548 D1 DE 69213548D1 DE 69213548 T DE69213548 T DE 69213548T DE 69213548 T DE69213548 T DE 69213548T DE 69213548 D1 DE69213548 D1 DE 69213548D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
cooling semiconductor
cooling
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69213548T
Other languages
English (en)
Other versions
DE69213548T2 (de
Inventor
Kenneth J Bahng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24817372&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69213548(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69213548D1 publication Critical patent/DE69213548D1/de
Publication of DE69213548T2 publication Critical patent/DE69213548T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69213548T 1991-05-15 1992-05-15 Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen Expired - Fee Related DE69213548T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/701,437 US5199483A (en) 1991-05-15 1991-05-15 Method and apparatus for cooling wafers

Publications (2)

Publication Number Publication Date
DE69213548D1 true DE69213548D1 (de) 1996-10-17
DE69213548T2 DE69213548T2 (de) 1997-01-23

Family

ID=24817372

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69213548T Expired - Fee Related DE69213548T2 (de) 1991-05-15 1992-05-15 Vorrichtung und Verfahren um Halbleiterscheiben zu Kühlen

Country Status (5)

Country Link
US (1) US5199483A (de)
EP (1) EP0513834B2 (de)
JP (1) JP2951478B2 (de)
KR (1) KR100245289B1 (de)
DE (1) DE69213548T2 (de)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421893A (en) * 1993-02-26 1995-06-06 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
NL9300389A (nl) * 1993-03-04 1994-10-03 Xycarb Bv Substraatdrager.
US5366002A (en) * 1993-05-05 1994-11-22 Applied Materials, Inc. Apparatus and method to ensure heat transfer to and from an entire substrate during semiconductor processing
DE69404397T2 (de) * 1993-07-13 1997-11-13 Applied Materials Inc Verbesserte Suszeptor Ausführung
DE69401863T2 (de) * 1993-07-15 1997-07-03 Applied Materials Inc Verbesserte Suszeptor Ausführung
JPH0786247A (ja) * 1993-09-16 1995-03-31 Hitachi Ltd 減圧雰囲気内における被処理物の処理方法及び処理装置
US5588827A (en) * 1993-12-17 1996-12-31 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
EP0733130A4 (de) * 1993-12-17 1997-04-02 Brooks Automation Inc Vorrichtung zum heizen und kuehlen von wafers
US6086680A (en) * 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US6113702A (en) * 1995-09-01 2000-09-05 Asm America, Inc. Wafer support system
AU6962196A (en) 1995-09-01 1997-03-27 Advanced Semiconductor Materials America, Inc. Wafer support system
US5697427A (en) * 1995-12-22 1997-12-16 Applied Materials, Inc. Apparatus and method for cooling a substrate
US5885353A (en) 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
JPH1064985A (ja) * 1996-08-23 1998-03-06 Sony Corp ウエハステージ、ウエハの温度調整方法及びドライエッチング装置
KR100264202B1 (ko) * 1997-01-28 2000-09-01 김영환 웨이퍼 산화막 형성 장치
US6432203B1 (en) * 1997-03-17 2002-08-13 Applied Komatsu Technology, Inc. Heated and cooled vacuum chamber shield
WO1999000837A1 (en) * 1997-06-30 1999-01-07 Lam Research Corporation Vacuum processing chamber workpiece lifter
US6312525B1 (en) 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
JP2001522142A (ja) 1997-11-03 2001-11-13 エーエスエム アメリカ インコーポレイテッド 改良された低質量ウェハ支持システム
JP3909944B2 (ja) 1998-01-12 2007-04-25 キヤノンアネルバ株式会社 情報記録ディスク用基板の冷却機構及びこの冷却機構を備えた基板処理装置
US6163073A (en) * 1998-04-17 2000-12-19 International Business Machines Corporation Integrated heatsink and heatpipe
US6119368A (en) * 1998-04-30 2000-09-19 Conexant Systems, Inc. Apparatus for reducing cool chamber particles
US6431807B1 (en) * 1998-07-10 2002-08-13 Novellus Systems, Inc. Wafer processing architecture including single-wafer load lock with cooling unit
US6108937A (en) * 1998-09-10 2000-08-29 Asm America, Inc. Method of cooling wafers
US6957690B1 (en) * 1998-09-10 2005-10-25 Asm America, Inc. Apparatus for thermal treatment of substrates
US6328858B1 (en) 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
US6217272B1 (en) 1998-10-01 2001-04-17 Applied Science And Technology, Inc. In-line sputter deposition system
US6180926B1 (en) 1998-10-19 2001-01-30 Applied Materials, Inc. Heat exchanger apparatus for a semiconductor wafer support and method of fabricating same
DE69937255T2 (de) * 1998-11-20 2008-07-03 Steag RTP Systems, Inc., San Jose Schnell-aufheiz- und -kühlvorrichtung für halbleiterwafer
US6173948B1 (en) * 1999-01-20 2001-01-16 International Business Machines Corporation Dimensional compensating vacuum fixture
US6440261B1 (en) 1999-05-25 2002-08-27 Applied Materials, Inc. Dual buffer chamber cluster tool for semiconductor wafer processing
US6558509B2 (en) * 1999-11-30 2003-05-06 Applied Materials, Inc. Dual wafer load lock
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
US7037797B1 (en) 2000-03-17 2006-05-02 Mattson Technology, Inc. Localized heating and cooling of substrates
US6977014B1 (en) * 2000-06-02 2005-12-20 Novellus Systems, Inc. Architecture for high throughput semiconductor processing applications
US6860965B1 (en) 2000-06-23 2005-03-01 Novellus Systems, Inc. High throughput architecture for semiconductor processing
US6290491B1 (en) * 2000-06-29 2001-09-18 Motorola, Inc. Method for heating a semiconductor wafer in a process chamber by a shower head, and process chamber
US6821912B2 (en) 2000-07-27 2004-11-23 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6530733B2 (en) 2000-07-27 2003-03-11 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
US6682288B2 (en) 2000-07-27 2004-01-27 Nexx Systems Packaging, Llc Substrate processing pallet and related substrate processing method and machine
KR100960773B1 (ko) * 2000-09-15 2010-06-01 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 더블 이중 슬롯 로드록
US6609869B2 (en) 2001-01-04 2003-08-26 Asm America Transfer chamber with integral loadlock and staging station
JP3837736B2 (ja) * 2001-07-02 2006-10-25 ウシオ電機株式会社 レジスト硬化装置のワークステージ
JP2003060012A (ja) * 2001-08-08 2003-02-28 Asm Japan Kk 半導体処理用反応チャンバ
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
US6908865B2 (en) * 2001-09-28 2005-06-21 Applied Materials, Inc. Method and apparatus for cleaning substrates
US6899507B2 (en) * 2002-02-08 2005-05-31 Asm Japan K.K. Semiconductor processing apparatus comprising chamber partitioned into reaction and transfer sections
US20030168174A1 (en) 2002-03-08 2003-09-11 Foree Michael Todd Gas cushion susceptor system
US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
US6861321B2 (en) 2002-04-05 2005-03-01 Asm America, Inc. Method of loading a wafer onto a wafer holder to reduce thermal shock
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US20050170314A1 (en) * 2002-11-27 2005-08-04 Richard Golden Dental pliers design with offsetting jaw and pad elements for assisting in removing upper and lower teeth and method for removing teeth utilizing the dental plier design
US7033443B2 (en) * 2003-03-28 2006-04-25 Axcelis Technologies, Inc. Gas-cooled clamp for RTP
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7000418B2 (en) * 2004-05-14 2006-02-21 Intevac, Inc. Capacitance sensing for substrate cooling
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
JP4860167B2 (ja) * 2005-03-30 2012-01-25 東京エレクトロン株式会社 ロードロック装置，処理システム及び処理方法
US20060273815A1 (en) * 2005-06-06 2006-12-07 Applied Materials, Inc. Substrate support with integrated prober drive
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
JP5280861B2 (ja) * 2006-01-19 2013-09-04 エーエスエム アメリカ インコーポレイテッド 高温ａｌｄインレットマニホールド
US7665951B2 (en) * 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
JP2008198739A (ja) * 2007-02-09 2008-08-28 Tokyo Electron Ltd 載置台構造、これを用いた処理装置及びこの装置の使用方法
US20080251019A1 (en) * 2007-04-12 2008-10-16 Sriram Krishnaswami System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
JP5795162B2 (ja) 2007-05-18 2015-10-14 ブルックス オートメーション インコーポレイテッド ロードロック高速排気および通気
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
KR20090001091A (ko) * 2007-06-29 2009-01-08 (주)티티에스 외부발열부재가 구성된 반도체 제조장치
US8092606B2 (en) 2007-12-18 2012-01-10 Asm Genitech Korea Ltd. Deposition apparatus
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
US20100247804A1 (en) * 2009-03-24 2010-09-30 Applied Materials, Inc. Biasable cooling pedestal
US20120000426A1 (en) * 2010-06-30 2012-01-05 Primestar Solar, Inc. Integrated gearbox and rotary feedthrough system for a vacuum chamber structure
US9719166B2 (en) * 2011-06-21 2017-08-01 Spts Technologies Limited Method of supporting a workpiece during physical vapour deposition
US20130021604A1 (en) * 2011-07-20 2013-01-24 Richard Sun Automated Sample Positioning System For Ellipsometers
US9574268B1 (en) 2011-10-28 2017-02-21 Asm America, Inc. Pulsed valve manifold for atomic layer deposition
US9388492B2 (en) 2011-12-27 2016-07-12 Asm America, Inc. Vapor flow control apparatus for atomic layer deposition
US8970114B2 (en) 2013-02-01 2015-03-03 Lam Research Corporation Temperature controlled window of a plasma processing chamber component
US10662527B2 (en) 2016-06-01 2020-05-26 Asm Ip Holding B.V. Manifolds for uniform vapor deposition
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US11492701B2 (en) 2019-03-19 2022-11-08 Asm Ip Holding B.V. Reactor manifolds
US11404302B2 (en) 2019-05-22 2022-08-02 Asm Ip Holding B.V. Substrate susceptor using edge purging
KR20210048408A (ko) 2019-10-22 2021-05-03 에이에스엠 아이피 홀딩 비.브이. 반도체 증착 반응기 매니폴드
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
DE102020109265A1 (de) 2020-04-02 2021-10-07 Apeva Se Substrathalter mit einer elastischen Substratauflage
CN113451183B (zh) * 2020-06-03 2023-03-31 重庆康佳光电技术研究院有限公司 一种晶圆盒
USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5269578A (en) * 1975-12-08 1977-06-09 Hitachi Ltd Wafer suscepter
JPS5450790A (en) * 1977-09-30 1979-04-20 Nippon Atom Ind Group Co Ltd Neutron flux distribution of axial derection in reactor measuring device
JPS5572029A (en) * 1978-11-27 1980-05-30 Nec Corp Tray for semiconductor wafer
JPS5689743A (en) * 1979-12-24 1981-07-21 Toshiba Corp Fixed stand by adsorption under reduced pressure
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
US4724621A (en) * 1986-04-17 1988-02-16 Varian Associates, Inc. Wafer processing chuck using slanted clamping pins
US4842683A (en) * 1986-12-19 1989-06-27 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
JPH06103663B2 (ja) * 1987-01-21 1994-12-14 東京エレクトロン株式会社 処理装置
US4955590A (en) * 1988-12-08 1990-09-11 Tokyo Electron Limited Plate-like member receiving apparatus
US5034199A (en) * 1987-11-13 1991-07-23 Kopin Corporation Zone melt recrystallization apparatus
JPH01283391A (ja) * 1988-05-09 1989-11-14 Tokyo Electron Ltd エッチング装置
KR0155545B1 (ko) * 1988-06-27 1998-12-01 고다까 토시오 기판의 열처리 장치
JPH0279027U (de) * 1988-12-05 1990-06-18
JP2875341B2 (ja) * 1990-05-23 1999-03-31 沖電気工業株式会社 プラズマｃｖｄ装置
JPH0451541A (ja) * 1990-06-19 1992-02-20 Tokyo Electron Ltd 半導体基板用載置台
JP3073432U (ja) * 2000-05-22 2000-11-30 和義 松元 イカ釣り用掛け針

Also Published As

Publication number Publication date
KR100245289B1 (ko) 2000-02-15
JP2951478B2 (ja) 1999-09-20
DE69213548T2 (de) 1997-01-23
EP0513834B2 (de) 2005-05-04
EP0513834A1 (de) 1992-11-19
US5199483A (en) 1993-04-06
KR920022409A (ko) 1992-12-19
JPH05166916A (ja) 1993-07-02
EP0513834B1 (de) 1996-09-11

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Legal Events

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8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8339 Ceased/non-payment of the annual fee