JPS5269578A - Wafer suscepter - Google Patents
Wafer suscepterInfo
- Publication number
- JPS5269578A JPS5269578A JP14502475A JP14502475A JPS5269578A JP S5269578 A JPS5269578 A JP S5269578A JP 14502475 A JP14502475 A JP 14502475A JP 14502475 A JP14502475 A JP 14502475A JP S5269578 A JPS5269578 A JP S5269578A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- suscepter
- susceptor
- secape
- occruring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To eliminate displacement occruring at loading of wafer onto susceptor by forming grooves for vapor secape on the surface of semiconductor wafer mounting susceptor which is installed inside reaction furnace.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14502475A JPS5269578A (en) | 1975-12-08 | 1975-12-08 | Wafer suscepter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14502475A JPS5269578A (en) | 1975-12-08 | 1975-12-08 | Wafer suscepter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5269578A true JPS5269578A (en) | 1977-06-09 |
Family
ID=15375652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14502475A Pending JPS5269578A (en) | 1975-12-08 | 1975-12-08 | Wafer suscepter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5269578A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5572029A (en) * | 1978-11-27 | 1980-05-30 | Nec Corp | Tray for semiconductor wafer |
JPH0338357U (en) * | 1989-08-21 | 1991-04-12 | ||
JPH05166916A (en) * | 1991-05-15 | 1993-07-02 | Applied Materials Inc | Method and apparatus for cooling wafer |
JPH07169824A (en) * | 1993-12-13 | 1995-07-04 | Anelva Corp | Substrate heating and cooling mechanism |
JPH09120987A (en) * | 1995-07-10 | 1997-05-06 | Watkins Johnson Co | Electrostatic chuck assembly |
US6506257B2 (en) | 2000-06-01 | 2003-01-14 | Tokyo Electron Limited | Single-substrate-processing apparatus for semiconductor process |
-
1975
- 1975-12-08 JP JP14502475A patent/JPS5269578A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5572029A (en) * | 1978-11-27 | 1980-05-30 | Nec Corp | Tray for semiconductor wafer |
JPH0338357U (en) * | 1989-08-21 | 1991-04-12 | ||
JPH05166916A (en) * | 1991-05-15 | 1993-07-02 | Applied Materials Inc | Method and apparatus for cooling wafer |
JPH07169824A (en) * | 1993-12-13 | 1995-07-04 | Anelva Corp | Substrate heating and cooling mechanism |
JPH09120987A (en) * | 1995-07-10 | 1997-05-06 | Watkins Johnson Co | Electrostatic chuck assembly |
US5838528A (en) * | 1995-07-10 | 1998-11-17 | Watkins-Johnson Company | Electrostatic chuck assembly |
US6506257B2 (en) | 2000-06-01 | 2003-01-14 | Tokyo Electron Limited | Single-substrate-processing apparatus for semiconductor process |
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