DE68928468T2 - Vorrichtung und Verfahren zur Kühlung von Substraten - Google Patents
Vorrichtung und Verfahren zur Kühlung von SubstratenInfo
- Publication number
- DE68928468T2 DE68928468T2 DE68928468T DE68928468T DE68928468T2 DE 68928468 T2 DE68928468 T2 DE 68928468T2 DE 68928468 T DE68928468 T DE 68928468T DE 68928468 T DE68928468 T DE 68928468T DE 68928468 T2 DE68928468 T2 DE 68928468T2
- Authority
- DE
- Germany
- Prior art keywords
- cooling substrates
- substrates
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/195,707 US4949783A (en) | 1988-05-18 | 1988-05-18 | Substrate transport and cooling apparatus and method for same |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68928468D1 DE68928468D1 (de) | 1998-01-15 |
DE68928468T2 true DE68928468T2 (de) | 1998-07-02 |
Family
ID=22722447
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE0342940T Pending DE342940T1 (de) | 1988-05-18 | 1989-05-17 | Vorrichtung und Verfahren zur Beförderung und zur Kühlung von Substraten. |
DE68928468T Expired - Lifetime DE68928468T2 (de) | 1988-05-18 | 1989-05-17 | Vorrichtung und Verfahren zur Kühlung von Substraten |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE0342940T Pending DE342940T1 (de) | 1988-05-18 | 1989-05-17 | Vorrichtung und Verfahren zur Beförderung und zur Kühlung von Substraten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4949783A (de) |
EP (1) | EP0342940B1 (de) |
JP (1) | JP2717308B2 (de) |
DE (2) | DE342940T1 (de) |
Families Citing this family (93)
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---|---|---|---|---|
US5484011A (en) * | 1986-12-19 | 1996-01-16 | Applied Materials, Inc. | Method of heating and cooling a wafer during semiconductor processing |
US5228501A (en) * | 1986-12-19 | 1993-07-20 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism and heater/cooler |
US5180000A (en) * | 1989-05-08 | 1993-01-19 | Balzers Aktiengesellschaft | Workpiece carrier with suction slot for a disk-shaped workpiece |
DE3943482C2 (de) * | 1989-05-08 | 1994-07-07 | Balzers Hochvakuum | Werkstückträger für ein scheibenförmiges Werkstück, sowie Vakuumprozeßkammer |
US5673750A (en) * | 1990-05-19 | 1997-10-07 | Hitachi, Ltd. | Vacuum processing method and apparatus |
KR0165898B1 (ko) * | 1990-07-02 | 1999-02-01 | 미다 가쓰시게 | 진공처리방법 및 장치 |
USH1145H (en) | 1990-09-25 | 1993-03-02 | Sematech, Inc. | Rapid temperature response wafer chuck |
EP0491503A3 (de) * | 1990-12-19 | 1992-07-22 | AT&T Corp. | Verfahren zur Ablagerung von Metall |
US5267607A (en) * | 1991-05-28 | 1993-12-07 | Tokyo Electron Limited | Substrate processing apparatus |
JP2577162B2 (ja) * | 1991-06-17 | 1997-01-29 | アプライド マテリアルズ インコーポレイテッド | ロードロックチャンバにおける加熱されたシリコン基板に生じる温度差を制御する方法および装置 |
JPH05166757A (ja) * | 1991-12-13 | 1993-07-02 | Tokyo Electron Ltd | 被処理体の温調装置 |
US5343012A (en) * | 1992-10-06 | 1994-08-30 | Hardy Walter N | Differentially pumped temperature controller for low pressure thin film fabrication process |
JPH06204157A (ja) * | 1992-12-25 | 1994-07-22 | Tokyo Electron Tohoku Ltd | 縦型熱処理装置 |
KR960006958B1 (ko) * | 1993-02-06 | 1996-05-25 | 현대전자산업주식회사 | 이시알 장비 |
TW277139B (de) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
US5738751A (en) * | 1994-09-01 | 1998-04-14 | Applied Materials, Inc. | Substrate support having improved heat transfer |
US5595241A (en) * | 1994-10-07 | 1997-01-21 | Sony Corporation | Wafer heating chuck with dual zone backplane heating and segmented clamping member |
JP4079992B2 (ja) * | 1994-10-17 | 2008-04-23 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法 |
TW281795B (de) * | 1994-11-30 | 1996-07-21 | Sharp Kk | |
US5746930A (en) * | 1995-01-03 | 1998-05-05 | Texas Instruments Incorporated | Method and structure for forming an array of thermal sensors |
US5603848A (en) * | 1995-01-03 | 1997-02-18 | Texas Instruments Incorporated | Method for etching through a substrate to an attached coating |
US5626773A (en) * | 1995-01-03 | 1997-05-06 | Texas Instruments Incorporated | Structure and method including dry etching techniques for forming an array of thermal sensitive elements |
US5605600A (en) * | 1995-03-13 | 1997-02-25 | International Business Machines Corporation | Etch profile shaping through wafer temperature control |
US5679404A (en) * | 1995-06-07 | 1997-10-21 | Saint-Gobain/Norton Industrial Ceramics Corporation | Method for depositing a substance with temperature control |
US6140612A (en) * | 1995-06-07 | 2000-10-31 | Lam Research Corporation | Controlling the temperature of a wafer by varying the pressure of gas between the underside of the wafer and the chuck |
US6113702A (en) | 1995-09-01 | 2000-09-05 | Asm America, Inc. | Wafer support system |
US6053982A (en) | 1995-09-01 | 2000-04-25 | Asm America, Inc. | Wafer support system |
US5775416A (en) * | 1995-11-17 | 1998-07-07 | Cvc Products, Inc. | Temperature controlled chuck for vacuum processing |
US5697427A (en) * | 1995-12-22 | 1997-12-16 | Applied Materials, Inc. | Apparatus and method for cooling a substrate |
US5948283A (en) * | 1996-06-28 | 1999-09-07 | Lam Research Corporation | Method and apparatus for enhancing outcome uniformity of direct-plasma processes |
GB2325939B (en) * | 1997-01-02 | 2001-12-19 | Cvc Products Inc | Thermally conductive chuck for vacuum processor |
US5936829A (en) * | 1997-01-02 | 1999-08-10 | Cvc Products, Inc. | Thermally conductive chuck for vacuum processor |
US6183523B1 (en) | 1997-03-03 | 2001-02-06 | Tokyo Electron Limited | Apparatus for thermal control of variously sized articles in vacuum |
US6073366A (en) | 1997-07-11 | 2000-06-13 | Asm America, Inc. | Substrate cooling system and method |
KR20010023014A (ko) * | 1997-08-28 | 2001-03-26 | 씨브이씨 프로덕츠 인코포레이티드 | 다중스테이션 장비용 웨이퍼 핸들러 |
US6138745A (en) | 1997-09-26 | 2000-10-31 | Cvc Products, Inc. | Two-stage sealing system for thermally conductive chuck |
US6073576A (en) | 1997-11-25 | 2000-06-13 | Cvc Products, Inc. | Substrate edge seal and clamp for low-pressure processing equipment |
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US6545580B2 (en) | 1998-09-09 | 2003-04-08 | Veeco Instruments, Inc. | Electromagnetic field generator and method of operation |
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US6957690B1 (en) | 1998-09-10 | 2005-10-25 | Asm America, Inc. | Apparatus for thermal treatment of substrates |
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US6110288A (en) * | 1998-12-17 | 2000-08-29 | Eaton Corporation | Temperature probe and measurement method for low pressure process |
DE19907210A1 (de) * | 1999-02-23 | 2000-08-31 | Krauss Maffei Kunststofftech | Vorrichtung zum Transportieren und gleichzeitigen Kühlen von Substraten für Informationsträgerscheiben wie CD, DVD oder dergleichen |
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US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
KR20210048408A (ko) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 증착 반응기 매니폴드 |
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JPS57206046A (en) * | 1981-06-15 | 1982-12-17 | Hitachi Ltd | Wafer conveying device |
US4508161A (en) * | 1982-05-25 | 1985-04-02 | Varian Associates, Inc. | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
US4457359A (en) * | 1982-05-25 | 1984-07-03 | Varian Associates, Inc. | Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
JPS5913327A (ja) * | 1982-07-15 | 1984-01-24 | Toshiba Corp | ドライエツチング装置 |
JPS5994435A (ja) * | 1982-11-20 | 1984-05-31 | Tokuda Seisakusho Ltd | 真空処理装置 |
JPS59154386A (ja) * | 1983-02-23 | 1984-09-03 | 株式会社東芝 | 核融合装置のバンパリミタ |
US4542298A (en) * | 1983-06-09 | 1985-09-17 | Varian Associates, Inc. | Methods and apparatus for gas-assisted thermal transfer with a semiconductor wafer |
JPH0622213B2 (ja) * | 1983-11-28 | 1994-03-23 | 株式会社日立製作所 | 試料の温度制御方法及び装置 |
US4603466A (en) * | 1984-02-17 | 1986-08-05 | Gca Corporation | Wafer chuck |
US4567938A (en) * | 1984-05-02 | 1986-02-04 | Varian Associates, Inc. | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system |
JPS6130237U (ja) * | 1984-07-26 | 1986-02-24 | 日立電子エンジニアリング株式会社 | ウエハ処理装置のウエハロ−ド機構 |
JPS61159570A (ja) * | 1984-12-31 | 1986-07-19 | Tokyo Erekutoron Kk | イオン注入装置 |
JPS6261334A (ja) * | 1985-09-11 | 1987-03-18 | Hitachi Ltd | パタ−ンの形成方法 |
DE3650057T2 (de) * | 1985-10-24 | 1995-02-16 | Texas Instruments Inc | System für Vakuumbehandlung. |
-
1988
- 1988-05-18 US US07/195,707 patent/US4949783A/en not_active Expired - Lifetime
-
1989
- 1989-05-17 EP EP89304958A patent/EP0342940B1/de not_active Expired - Lifetime
- 1989-05-17 DE DE0342940T patent/DE342940T1/de active Pending
- 1989-05-17 DE DE68928468T patent/DE68928468T2/de not_active Expired - Lifetime
- 1989-05-18 JP JP12546789A patent/JP2717308B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2717308B2 (ja) | 1998-02-18 |
EP0342940A3 (de) | 1991-05-08 |
DE68928468D1 (de) | 1998-01-15 |
EP0342940B1 (de) | 1997-12-03 |
DE342940T1 (de) | 1995-06-08 |
US4949783A (en) | 1990-08-21 |
EP0342940A2 (de) | 1989-11-23 |
JPH0230128A (ja) | 1990-01-31 |
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