DE68914005D1 - Leitende Muster für den elektrischen Test von Halbleiterbausteinen. - Google Patents
Leitende Muster für den elektrischen Test von Halbleiterbausteinen.Info
- Publication number
- DE68914005D1 DE68914005D1 DE89100956T DE68914005T DE68914005D1 DE 68914005 D1 DE68914005 D1 DE 68914005D1 DE 89100956 T DE89100956 T DE 89100956T DE 68914005 T DE68914005 T DE 68914005T DE 68914005 D1 DE68914005 D1 DE 68914005D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor devices
- conductive patterns
- electrical test
- test
- electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63010030A JPH01184935A (ja) | 1988-01-20 | 1988-01-20 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68914005D1 true DE68914005D1 (de) | 1994-04-28 |
DE68914005T2 DE68914005T2 (de) | 1994-08-11 |
Family
ID=11738999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68914005T Expired - Fee Related DE68914005T2 (de) | 1988-01-20 | 1989-01-20 | Leitende Muster für den elektrischen Test von Halbleiterbausteinen. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5014003A (de) |
EP (1) | EP0325269B1 (de) |
JP (1) | JPH01184935A (de) |
KR (1) | KR910007510B1 (de) |
DE (1) | DE68914005T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198756A (en) * | 1991-07-29 | 1993-03-30 | Atg-Electronics Inc. | Test fixture wiring integrity verification device |
JP2720688B2 (ja) * | 1992-01-31 | 1998-03-04 | ジェイエスアール株式会社 | 回路基板の検査方法 |
KR100272659B1 (ko) * | 1997-06-28 | 2000-12-01 | 김영환 | 반도체 소자의 금속배선 선폭 측정방법 |
FR2770029B1 (fr) * | 1997-10-22 | 2000-01-07 | Sgs Thomson Microelectronics | Plage de test a positionnement automatique de microsonde et procede de realisation d'une telle plage de test |
US6175245B1 (en) | 1998-06-25 | 2001-01-16 | International Business Machines Corporation | CMOS SOI contact integrity test method |
JP2005091065A (ja) * | 2003-09-16 | 2005-04-07 | Oki Electric Ind Co Ltd | 半導体装置への動作電圧供給装置及び動作電圧供給方法 |
KR100593647B1 (ko) * | 2004-05-18 | 2006-06-28 | 삼성전자주식회사 | 프로브 센싱용 패드, 반도체 소자가 탑재된 기판 및 반도체 소자 검사 방법 |
US7323897B2 (en) * | 2004-12-16 | 2008-01-29 | Verigy (Singapore) Pte. Ltd. | Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment |
US20060158208A1 (en) * | 2005-01-14 | 2006-07-20 | Applied Materials, Inc. | Prober tester |
US6989682B1 (en) * | 2005-03-16 | 2006-01-24 | United Microelectronics Corp. | Test key on a wafer |
JP2007129108A (ja) * | 2005-11-04 | 2007-05-24 | Mitsubishi Electric Corp | 半導体装置の検査方法 |
IT1397222B1 (it) * | 2009-12-30 | 2013-01-04 | St Microelectronics Srl | Metodo per controllare il corretto posizionamento di sonde di test su terminazioni di dispositivi elettronici integrati su semiconduttore e relativo dispositivo elettronico. |
IT1402434B1 (it) | 2010-06-10 | 2013-09-04 | St Microelectronics Srl | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3781683A (en) * | 1971-03-30 | 1973-12-25 | Ibm | Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration |
US3974443A (en) * | 1975-01-02 | 1976-08-10 | International Business Machines Corporation | Conductive line width and resistivity measuring system |
US4266191A (en) * | 1979-04-18 | 1981-05-05 | Spano John D | Test probe alignment apparatus |
US4386459A (en) * | 1980-07-11 | 1983-06-07 | Bell Telephone Laboratories, Incorporated | Electrical measurement of level-to-level misalignment in integrated circuits |
DD226741A3 (de) * | 1983-12-27 | 1985-08-28 | Kontaktbau & Spezmaschbau Veb | Einrichtung zum pruefen der lagerichtigkeit von transportierten bauteilen |
JPS61199623A (ja) * | 1985-03-01 | 1986-09-04 | Nippon Telegr & Teleph Corp <Ntt> | ウエハの位置検出方法およびウエハ |
US4801869A (en) * | 1987-04-27 | 1989-01-31 | International Business Machines Corporation | Semiconductor defect monitor for diagnosing processing-induced defects |
-
1988
- 1988-01-20 JP JP63010030A patent/JPH01184935A/ja active Pending
-
1989
- 1989-01-20 DE DE68914005T patent/DE68914005T2/de not_active Expired - Fee Related
- 1989-01-20 KR KR1019890000575A patent/KR910007510B1/ko not_active IP Right Cessation
- 1989-01-20 EP EP89100956A patent/EP0325269B1/de not_active Expired - Lifetime
- 1989-01-23 US US07/299,336 patent/US5014003A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR890012370A (ko) | 1989-08-26 |
EP0325269A1 (de) | 1989-07-26 |
EP0325269B1 (de) | 1994-03-23 |
JPH01184935A (ja) | 1989-07-24 |
KR910007510B1 (ko) | 1991-09-26 |
US5014003A (en) | 1991-05-07 |
DE68914005T2 (de) | 1994-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3884040T2 (de) | Halbleiterfehlertester. | |
DE69033229T2 (de) | Anschlussfläche für Halbleiteranordnung | |
DE3789938T2 (de) | Elektrische Anordnung. | |
DE69010399T2 (de) | Elektrischer Sockel für Tab IC's. | |
DE69023541D1 (de) | Kontaktstruktur für integrierte Halbleiterschaltung. | |
DE68925156T2 (de) | Integrierte Halbleiterschaltung für neurales Netzwerk | |
DE69024773D1 (de) | Halbleiterspeicherschaltungsanordnung | |
NO169629C (no) | Elektrisk koblingsstykke | |
DE3581138D1 (de) | Steckverbindervorrichtung zum anschliessen von elektrischen kabeln. | |
DE3885268D1 (de) | Verdrahtungsleiter für Halbleiteranordnung. | |
KR860005446A (ko) | 메모리 테스트 패턴 발생회로를 포함한 반도체 장치 | |
DE68914005D1 (de) | Leitende Muster für den elektrischen Test von Halbleiterbausteinen. | |
DE3751351D1 (de) | Zusammenbau von elektrischen Verbindern. | |
DE3680265D1 (de) | Halbleiterschaltungsanordnung. | |
DE3677165D1 (de) | Integrierte halbleiterschaltungsanordnung. | |
DE3578987D1 (de) | Elektrische durchgangspruefung. | |
DK513987D0 (da) | Bistabilt elektrisk forbindelsesorgan | |
DE68916969T2 (de) | Prüfung von elektrischen kreisen. | |
DE68909735T2 (de) | Elektrische Testanordnung. | |
DE59009234D1 (de) | Stromschiene zum elektrischen Kontaktieren von Geräten. | |
DE3675666D1 (de) | Integrierte halbleiterschaltungsanordnung. | |
DE68919953D1 (de) | Elektrische Komponente. | |
NO882810D0 (no) | Integrert elektrisk flerfase-effektmaaler. | |
DE58908708D1 (de) | Anschlusseinheit zum Anschliessen und Verbinden von elektrischen Leitungen. | |
DE69015466T2 (de) | Einrichtung zur Fertigung von elektrischen Leitern. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |