DE68913321D1 - Feuchtigkeitsundurchlässige Überzugszusammensetzung. - Google Patents

Feuchtigkeitsundurchlässige Überzugszusammensetzung.

Info

Publication number
DE68913321D1
DE68913321D1 DE89105888T DE68913321T DE68913321D1 DE 68913321 D1 DE68913321 D1 DE 68913321D1 DE 89105888 T DE89105888 T DE 89105888T DE 68913321 T DE68913321 T DE 68913321T DE 68913321 D1 DE68913321 D1 DE 68913321D1
Authority
DE
Germany
Prior art keywords
moisture
coating composition
proof coating
proof
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE89105888T
Other languages
English (en)
Other versions
DE68913321T2 (de
Inventor
Hiroshi Inukai
Takahiro Kitahara
Akihiko Ueda
Shinji Tamaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Publication of DE68913321D1 publication Critical patent/DE68913321D1/de
Application granted granted Critical
Publication of DE68913321T2 publication Critical patent/DE68913321T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/22—Esters containing halogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09D133/16—Homopolymers or copolymers of esters containing halogen atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
DE68913321T 1988-04-08 1989-04-04 Feuchtigkeitsundurchlässige Überzugszusammensetzung. Expired - Lifetime DE68913321T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63087730A JPH01259072A (ja) 1988-04-08 1988-04-08 防湿コーティング剤

Publications (2)

Publication Number Publication Date
DE68913321D1 true DE68913321D1 (de) 1994-04-07
DE68913321T2 DE68913321T2 (de) 1994-09-29

Family

ID=13923032

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68913321T Expired - Lifetime DE68913321T2 (de) 1988-04-08 1989-04-04 Feuchtigkeitsundurchlässige Überzugszusammensetzung.

Country Status (3)

Country Link
EP (1) EP0336372B1 (de)
JP (1) JPH01259072A (de)
DE (1) DE68913321T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2595678B2 (ja) * 1988-04-15 1997-04-02 ダイキン工業株式会社 防汚塗料組成物及び被覆品
JPH05198786A (ja) * 1992-01-22 1993-08-06 Sharp Corp クリアモールドｃｃｄ固体撮像素子
CA2593694A1 (en) 2004-12-30 2006-07-13 3M Innovative Properties Company Articles comprising a fluorochemical surface layer and related methods
KR20070094942A (ko) * 2004-12-30 2007-09-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 내오염성 플루오로화합물 조성물
JP5704188B2 (ja) * 2012-05-11 2015-04-22 ダイキン工業株式会社 防水・防湿用コーティング組成物
JP6776508B2 (ja) * 2015-04-23 2020-10-28 ダイキン工業株式会社 コーティング組成物
TWI765953B (zh) * 2017-01-17 2022-06-01 學校法人 關西大學 新穎的鐵電體材料及聚合物作為有機鐵電體材料的用途
JP2020128560A (ja) * 2020-06-03 2020-08-27 ダイキン工業株式会社 コーティング組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60188410A (ja) * 1984-03-09 1985-09-25 Daikin Ind Ltd 被覆材料
DE3586531T2 (de) * 1984-12-12 1993-03-25 Daikin Ind Ltd Kontaktlinsenmaterial.
JPS61189693A (ja) * 1985-02-19 1986-08-23 旭硝子株式会社 電子部品の防湿コ−テイング方法
JPH0811777B2 (ja) * 1986-02-27 1996-02-07 大日本インキ化学工業株式会社 低屈折率樹脂組成物
JPH0819313B2 (ja) * 1986-04-24 1996-02-28 大日本インキ化学工業株式会社 フツ素系樹脂組成物
JPS6390588A (ja) * 1986-10-06 1988-04-21 Daikin Ind Ltd 撥水撥油剤
JPS6399285A (ja) * 1986-05-28 1988-04-30 Daikin Ind Ltd 撥水撥油剤
JPS63241006A (ja) * 1987-03-30 1988-10-06 Mitsubishi Rayon Co Ltd 硬化性組成物
JPH01197570A (ja) * 1988-02-01 1989-08-09 Daikin Ind Ltd 低屈折率ハードコート剤

Also Published As

Publication number Publication date
EP0336372A2 (de) 1989-10-11
JPH01259072A (ja) 1989-10-16
DE68913321T2 (de) 1994-09-29
EP0336372A3 (en) 1990-02-14
EP0336372B1 (de) 1994-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition