DE68909273T2 - Schleiffolie mit individuell angebrachten Schleifkörnchen. - Google Patents
Schleiffolie mit individuell angebrachten Schleifkörnchen.Info
- Publication number
- DE68909273T2 DE68909273T2 DE89301732T DE68909273T DE68909273T2 DE 68909273 T2 DE68909273 T2 DE 68909273T2 DE 89301732 T DE89301732 T DE 89301732T DE 68909273 T DE68909273 T DE 68909273T DE 68909273 T2 DE68909273 T2 DE 68909273T2
- Authority
- DE
- Germany
- Prior art keywords
- abrasive
- grains
- abrasive grains
- binder layer
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 100
- 239000011230 binding agent Substances 0.000 claims abstract description 59
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 abstract description 8
- 239000008187 granular material Substances 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 30
- 238000000227 grinding Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 229920002379 silicone rubber Polymers 0.000 description 10
- 239000004945 silicone rubber Substances 0.000 description 9
- 230000005499 meniscus Effects 0.000 description 7
- -1 polyethylene Polymers 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000004716 Ethylene/acrylic acid copolymer Substances 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009503 electrostatic coating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- 241000723353 Chrysanthemum Species 0.000 description 1
- 235000005633 Chrysanthemum balsamita Nutrition 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910020491 K2TiF6 Inorganic materials 0.000 description 1
- 229910020261 KBF4 Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920003182 Surlyn® Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000010961 commercial manufacture process Methods 0.000 description 1
- 229910001610 cryolite Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16077688A | 1988-02-26 | 1988-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE68909273D1 DE68909273D1 (de) | 1993-10-28 |
| DE68909273T2 true DE68909273T2 (de) | 1994-03-24 |
Family
ID=22578393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE89301732T Expired - Fee Related DE68909273T2 (de) | 1988-02-26 | 1989-02-22 | Schleiffolie mit individuell angebrachten Schleifkörnchen. |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0331344B1 (fr) |
| JP (1) | JPH01289672A (fr) |
| KR (1) | KR890012753A (fr) |
| AT (1) | ATE94796T1 (fr) |
| CA (1) | CA1298980C (fr) |
| DE (1) | DE68909273T2 (fr) |
| MX (1) | MX170478B (fr) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01274966A (ja) * | 1988-04-28 | 1989-11-02 | Tokyo Jiki Insatsu Kk | 研磨具 |
| US5107626A (en) * | 1991-02-06 | 1992-04-28 | Minnesota Mining And Manufacturing Company | Method of providing a patterned surface on a substrate |
| TW367551B (en) * | 1993-06-17 | 1999-08-21 | Freescale Semiconductor Inc | Polishing pad and a process for polishing |
| US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
| US7124753B2 (en) | 1997-04-04 | 2006-10-24 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6679243B2 (en) | 1997-04-04 | 2004-01-20 | Chien-Min Sung | Brazed diamond tools and methods for making |
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US7323049B2 (en) | 1997-04-04 | 2008-01-29 | Chien-Min Sung | High pressure superabrasive particle synthesis |
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US7201645B2 (en) | 1999-11-22 | 2007-04-10 | Chien-Min Sung | Contoured CMP pad dresser and associated methods |
| US6669745B2 (en) * | 2001-02-21 | 2003-12-30 | 3M Innovative Properties Company | Abrasive article with optimally oriented abrasive particles and method of making the same |
| JP2003071730A (ja) * | 2001-09-03 | 2003-03-12 | Cci Corp | 研磨シート |
| US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| JP4925342B2 (ja) * | 2007-12-28 | 2012-04-25 | 信越ポリマー株式会社 | 被粘着物離脱用ローラ及び被粘着物離脱装置 |
| US8252263B2 (en) | 2008-04-14 | 2012-08-28 | Chien-Min Sung | Device and method for growing diamond in a liquid phase |
| EP2307518A4 (fr) | 2008-07-03 | 2014-03-19 | 3M Innovative Properties Co | Particules abrasives fixées et articles fabriqués à partir de celles-ci |
| TWI464839B (zh) | 2010-09-21 | 2014-12-11 | Ritedia Corp | 單層鑽石顆粒散熱器及其相關方法 |
| CN109890568B (zh) * | 2016-10-25 | 2022-07-29 | 3M创新有限公司 | 包括取向磨料颗粒的粘结磨料制品及其制备方法 |
| US20220258203A1 (en) * | 2019-07-17 | 2022-08-18 | 3M Innovative Properties Company | Coating method and system to create patterned coating layers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2914571A (en) * | 1970-05-25 | 1972-11-23 | Rodi Birkeland | Improved abrasive product and method for preparing thesame |
| EP0004454A3 (fr) * | 1978-03-23 | 1979-10-31 | Robert Michael Barron | Outils abrasifs revêtus |
| DE2918103C2 (de) * | 1979-05-04 | 1985-12-05 | Sia Schweizer Schmirgel- & Schleifindustrie Ag, Frauenfeld | Verfahren zum Auftragen eines Grundbindemittels und Vorrichtung zur Durchführung desselben |
| DE2951067A1 (de) * | 1979-12-19 | 1981-08-20 | Norddeutsche Schleifmittel-Industrie Christiansen & Co, GmbH & Co, 2000 Hamburg | Schleifwerkzeug, in welchem keramikgebundene schleifkornkonglomerate durch ein organisches bindemittel miteinander bzw. mit einer unterlage verbunden sind |
| JPS60186377A (ja) * | 1984-03-05 | 1985-09-21 | Tamotsu Idota | 研摩布紙の構造 |
-
1989
- 1989-02-20 CA CA000591524A patent/CA1298980C/fr not_active Expired - Fee Related
- 1989-02-22 DE DE89301732T patent/DE68909273T2/de not_active Expired - Fee Related
- 1989-02-22 EP EP89301732A patent/EP0331344B1/fr not_active Expired - Lifetime
- 1989-02-22 AT AT89301732T patent/ATE94796T1/de not_active IP Right Cessation
- 1989-02-23 JP JP1045008A patent/JPH01289672A/ja active Pending
- 1989-02-24 MX MX015067A patent/MX170478B/es unknown
- 1989-02-25 KR KR1019890002309A patent/KR890012753A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0331344A2 (fr) | 1989-09-06 |
| ATE94796T1 (de) | 1993-10-15 |
| MX170478B (es) | 1993-08-25 |
| JPH01289672A (ja) | 1989-11-21 |
| EP0331344A3 (fr) | 1991-08-07 |
| KR890012753A (ko) | 1989-09-19 |
| EP0331344B1 (fr) | 1993-09-22 |
| DE68909273D1 (de) | 1993-10-28 |
| CA1298980C (fr) | 1992-04-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |