DE60335120D1 - Zusammensetzung fur antireflexbeschichtungen und verfahren zur bildung einer struktur - Google Patents

Zusammensetzung fur antireflexbeschichtungen und verfahren zur bildung einer struktur

Info

Publication number
DE60335120D1
DE60335120D1 DE60335120T DE60335120T DE60335120D1 DE 60335120 D1 DE60335120 D1 DE 60335120D1 DE 60335120 T DE60335120 T DE 60335120T DE 60335120 T DE60335120 T DE 60335120T DE 60335120 D1 DE60335120 D1 DE 60335120D1
Authority
DE
Germany
Prior art keywords
reflective coating
photoresist film
composition
forming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60335120T
Other languages
English (en)
Inventor
Yasushi Akiyama
Yusuke Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Performance Materials Corp
Original Assignee
AZ Electronic Materials Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials Japan Co Ltd filed Critical AZ Electronic Materials Japan Co Ltd
Application granted granted Critical
Publication of DE60335120D1 publication Critical patent/DE60335120D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0276—Photolithographic processes using an anti-reflective coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE60335120T 2002-07-04 2003-06-26 Zusammensetzung fur antireflexbeschichtungen und verfahren zur bildung einer struktur Expired - Lifetime DE60335120D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002195582A JP3851594B2 (ja) 2002-07-04 2002-07-04 反射防止コーティング用組成物およびパターン形成方法
PCT/JP2003/008087 WO2004006023A1 (ja) 2002-07-04 2003-06-26 反射防止コーティング用組成物およびパターン形成方法

Publications (1)

Publication Number Publication Date
DE60335120D1 true DE60335120D1 (de) 2011-01-05

Family

ID=30112343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60335120T Expired - Lifetime DE60335120D1 (de) 2002-07-04 2003-06-26 Zusammensetzung fur antireflexbeschichtungen und verfahren zur bildung einer struktur

Country Status (10)

Country Link
US (1) US7365115B2 (de)
EP (1) EP1542078B1 (de)
JP (1) JP3851594B2 (de)
KR (1) KR100932086B1 (de)
CN (1) CN100476598C (de)
AT (1) ATE489658T1 (de)
DE (1) DE60335120D1 (de)
MY (1) MY138228A (de)
TW (1) TWI326013B (de)
WO (1) WO2004006023A1 (de)

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US7508132B2 (en) * 2003-10-20 2009-03-24 Hewlett-Packard Development Company, L.P. Device having a getter structure and a photomask
KR100852840B1 (ko) * 2003-11-19 2008-08-18 다이킨 고교 가부시키가이샤 레지스트 적층체의 형성 방법
JP4355944B2 (ja) * 2004-04-16 2009-11-04 信越化学工業株式会社 パターン形成方法及びこれに用いるレジスト上層膜材料
JP2006039129A (ja) * 2004-07-26 2006-02-09 Sony Corp 液浸露光用積層構造、液浸露光方法、電子装置の製造方法及び電子装置
JP4322205B2 (ja) 2004-12-27 2009-08-26 東京応化工業株式会社 レジスト保護膜形成用材料およびこれを用いたレジストパターン形成方法
US7288362B2 (en) 2005-02-23 2007-10-30 International Business Machines Corporation Immersion topcoat materials with improved performance
JP4482760B2 (ja) * 2005-04-26 2010-06-16 信越化学工業株式会社 レジスト保護膜材料及びパターン形成方法
US7544750B2 (en) * 2005-10-13 2009-06-09 International Business Machines Corporation Top antireflective coating composition with low refractive index at 193nm radiation wavelength
WO2007058355A1 (ja) * 2005-11-21 2007-05-24 Fujifilm Corporation 感光性転写材料、隔壁及びその形成方法、光学素子及びその製造方法、並びに表示装置
JP2008112779A (ja) * 2006-10-30 2008-05-15 Az Electronic Materials Kk 反射防止膜形成用組成物およびそれを用いたパターン形成方法
JP4727567B2 (ja) * 2006-12-27 2011-07-20 Ａｚエレクトロニックマテリアルズ株式会社 反射防止膜形成用組成物およびそれを用いたパターン形成方法
EP2113811B1 (de) * 2007-02-22 2012-01-25 Asahi Glass Company, Limited Zusammensetzung für eine antireflexive beschichtung
KR100886314B1 (ko) * 2007-06-25 2009-03-04 금호석유화학 주식회사 유기반사방지막용 공중합체 및 이를 포함하는유기반사방지막 조성물
JP4723557B2 (ja) * 2007-12-14 2011-07-13 Ａｚエレクトロニックマテリアルズ株式会社 表面反射防止膜形成用組成物及びそれを用いたパターン形成方法
JP5697523B2 (ja) * 2011-04-12 2015-04-08 メルクパフォーマンスマテリアルズＩｐ合同会社 上面反射防止膜形成用組成物およびそれを用いたパターン形成方法
CN103137441A (zh) * 2011-11-22 2013-06-05 上海华虹Nec电子有限公司 半导体工艺中制作细长型孤立线条图形的方法
WO2014134594A1 (en) * 2013-03-01 2014-09-04 Board Of Trustees Of The University Of Arkansas Antireflective coating for glass applications and method of forming same
JP6848547B2 (ja) * 2016-04-22 2021-03-24 Ａｇｃ株式会社 コーティング用組成物およびフォトレジスト積層体の製造方法
CN110128904A (zh) * 2019-05-10 2019-08-16 甘肃华隆芯材料科技有限公司 一种用于光刻的上表面抗反射涂层组合物
CN110045443A (zh) * 2019-05-10 2019-07-23 甘肃华隆芯材料科技有限公司 一种用于上表面抗反射膜的组合物
CN113913060B (zh) * 2021-10-19 2022-05-03 苏州润邦半导体材料科技有限公司 一种顶部抗反射涂层组合物
CN114035405B (zh) 2022-01-07 2022-04-22 甘肃华隆芯材料科技有限公司 制备顶部抗反射膜的组合物、顶部抗反射膜和含氟组合物
CN116875159B (zh) * 2023-09-05 2023-11-21 甘肃华隆芯材料科技有限公司 顶部抗反射涂层材料及其制备方法和应用

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Also Published As

Publication number Publication date
EP1542078B1 (de) 2010-11-24
TWI326013B (en) 2010-06-11
US7365115B2 (en) 2008-04-29
TW200403315A (en) 2004-03-01
EP1542078A4 (de) 2009-11-11
CN100476598C (zh) 2009-04-08
EP1542078A1 (de) 2005-06-15
KR20050075328A (ko) 2005-07-20
KR100932086B1 (ko) 2009-12-16
US20050239932A1 (en) 2005-10-27
MY138228A (en) 2009-05-29
WO2004006023A1 (ja) 2004-01-15
ATE489658T1 (de) 2010-12-15
JP3851594B2 (ja) 2006-11-29
JP2004037887A (ja) 2004-02-05
CN1666154A (zh) 2005-09-07

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Legal Events

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8327 Change in the person/name/address of the patent owner

Owner name: AZ ELECTRONIC MATERIALS USA CORP., SOMERVILLE,, US