DE60327379D1 - Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren Herstellungsverfahren - Google Patents
Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren HerstellungsverfahrenInfo
- Publication number
- DE60327379D1 DE60327379D1 DE60327379T DE60327379T DE60327379D1 DE 60327379 D1 DE60327379 D1 DE 60327379D1 DE 60327379 T DE60327379 T DE 60327379T DE 60327379 T DE60327379 T DE 60327379T DE 60327379 D1 DE60327379 D1 DE 60327379D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- jet head
- liquid jet
- piezoelectric device
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
- H10N30/8554—Lead-zirconium titanate [PZT] based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Special Spraying Apparatus (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002012714 | 2002-01-22 | ||
JP2002019807 | 2002-01-29 | ||
JP2002208641 | 2002-07-17 | ||
JP2003005116A JP4530615B2 (ja) | 2002-01-22 | 2003-01-10 | 圧電体素子および液体吐出ヘッド |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60327379D1 true DE60327379D1 (de) | 2009-06-04 |
Family
ID=27482770
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60327379T Expired - Fee Related DE60327379D1 (de) | 2002-01-22 | 2003-01-22 | Piezoelektrisches Bauelement, Flüssigkeitsstrahlkopf und deren Herstellungsverfahren |
DE2003616857 Expired - Lifetime DE60316857T2 (de) | 2002-01-22 | 2003-01-22 | Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003616857 Expired - Lifetime DE60316857T2 (de) | 2002-01-22 | 2003-01-22 | Herstellungsverfahren eines piezoelektrischen Bauelements und eines Flüssigkeitsstrahlkopfes |
Country Status (5)
Country | Link |
---|---|
US (2) | US6883901B2 (de) |
EP (2) | EP1329964B1 (de) |
JP (1) | JP4530615B2 (de) |
CN (1) | CN1438117A (de) |
DE (2) | DE60327379D1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60222969T2 (de) * | 2001-08-10 | 2008-07-24 | Canon K.K. | Verfahren zur Herstellung eines Flüssigkeitsausstosskopfes, Substrat für einen Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren |
TWI220130B (en) * | 2003-12-17 | 2004-08-11 | Ind Tech Res Inst | Inkjet printhead and manufacturing method thereof |
CN100533798C (zh) * | 2004-02-27 | 2009-08-26 | 佳能株式会社 | 压电薄膜制造方法 |
US7470375B2 (en) * | 2004-10-22 | 2008-12-30 | Canon Kabushiki Kaisha | Method for manufacturing liquid ejection head, substrate for liquid ejection head, and liquid ejection head |
JP2006278489A (ja) | 2005-03-28 | 2006-10-12 | Seiko Epson Corp | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JP5297576B2 (ja) | 2005-03-28 | 2013-09-25 | セイコーエプソン株式会社 | 圧電素子及びアクチュエータ装置並びに液体噴射ヘッド及び液体噴射装置 |
JP5188076B2 (ja) * | 2006-04-03 | 2013-04-24 | キヤノン株式会社 | 圧電素子及びその製造方法、電子デバイス、インクジェット装置 |
JP2007287918A (ja) * | 2006-04-17 | 2007-11-01 | Seiko Epson Corp | 圧電体積層体、表面弾性波素子、薄膜圧電共振子および圧電アクチュエータ、ならびに圧電体積層体の製造方法 |
JP5023563B2 (ja) * | 2006-06-12 | 2012-09-12 | セイコーエプソン株式会社 | 圧電素子の製造方法 |
AU2007335239A1 (en) * | 2006-12-18 | 2008-06-26 | Commonwealth Scientific And Industrial Research Organisation | Method of coating |
JP5196104B2 (ja) * | 2007-01-23 | 2013-05-15 | セイコーエプソン株式会社 | 圧電素子の製造方法、インクジェット式記録ヘッドの製造方法、およびインクジェットプリンターの製造方法 |
US8020974B2 (en) * | 2007-01-31 | 2011-09-20 | Panasonic Corporation | Piezoelectric thin film device and piezoelectric thin film device manufacturing method, and inkjet head and inkjet recording apparatus |
US8830282B2 (en) * | 2007-06-28 | 2014-09-09 | Hewlett-Packard Development Company, L.P. | Charge spreading structure for charge-emission apparatus |
JP5187489B2 (ja) * | 2007-09-20 | 2013-04-24 | セイコーエプソン株式会社 | アクチュエータ装置の製造方法及び液体噴射ヘッドの製造方法 |
JP2009076819A (ja) * | 2007-09-25 | 2009-04-09 | Seiko Epson Corp | アクチュエータ装置及び液体噴射ヘッド並びに液体噴射装置 |
JP5854183B2 (ja) * | 2010-03-02 | 2016-02-09 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外センサー |
CN101814575B (zh) * | 2010-04-27 | 2012-01-04 | 上海交通大学 | 微机电系统压电双晶片的制备方法 |
JP5741799B2 (ja) * | 2010-12-06 | 2015-07-01 | セイコーエプソン株式会社 | 液体噴射ヘッド、液体噴射装置及び圧電素子 |
JP5892406B2 (ja) | 2011-06-30 | 2016-03-23 | 株式会社リコー | 電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置 |
US9761785B2 (en) | 2011-10-17 | 2017-09-12 | The United States Of America As Represented By The Secretary Of The Army | Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing |
US8866367B2 (en) | 2011-10-17 | 2014-10-21 | The United States Of America As Represented By The Secretary Of The Army | Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making |
JP2015023053A (ja) | 2013-07-16 | 2015-02-02 | 株式会社リコー | 電気機械変換素子、液滴吐出ヘッド、液滴吐出装置、画像形成装置、及び、電気機械変換素子の製造方法 |
JP6175956B2 (ja) * | 2013-07-25 | 2017-08-09 | 株式会社リコー | 電気−機械変換素子、電気−機械変換素子を配置した液滴吐出ヘッド、及び液滴吐出ヘッドを備えた液滴吐出装置 |
KR101531114B1 (ko) * | 2013-12-26 | 2015-06-23 | 삼성전기주식회사 | 압전 액추에이터 모듈, 압전 액추에이터 모듈의 제조방법 및 압전 액추에이터 모듈을 포함하는 mems 센서 |
JP6948772B2 (ja) | 2016-08-31 | 2021-10-13 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、圧電モーター、ロボット、電子部品搬送装置およびプリンター |
JP2018079589A (ja) * | 2016-11-14 | 2018-05-24 | セイコーエプソン株式会社 | 液体検出装置及び液体容器 |
CN109572214B (zh) * | 2017-09-27 | 2020-08-04 | 精工爱普生株式会社 | 液体喷出装置以及打印头 |
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US4236829A (en) * | 1978-01-31 | 1980-12-02 | Matsushita Electric Industrial Co., Ltd. | Solid-state image sensor |
JPH02177578A (ja) | 1988-12-28 | 1990-07-10 | Toyota Motor Corp | 圧電セラミックスの製造方法 |
JP3021930B2 (ja) | 1991-02-13 | 2000-03-15 | 三菱マテリアル株式会社 | 強誘電体薄膜の結晶配向性制御方法 |
US5620739A (en) * | 1991-02-25 | 1997-04-15 | Symetrix Corporation | Thin film capacitors on gallium arsenide substrate and process for making the same |
US6110531A (en) * | 1991-02-25 | 2000-08-29 | Symetrix Corporation | Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition |
US6174564B1 (en) * | 1991-12-13 | 2001-01-16 | Symetrix Corporation | Method of making metal polyoxyalkylated precursor solutions |
WO1993022140A1 (en) * | 1992-04-23 | 1993-11-11 | Seiko Epson Corporation | Liquid jet head and production thereof |
JP3105081B2 (ja) * | 1992-06-22 | 2000-10-30 | ローム株式会社 | 強誘電体薄膜の製造方法 |
EP0736915A1 (de) * | 1995-04-03 | 1996-10-09 | Seiko Epson Corporation | Piezoelektrische Dünnschicht, Verfahren zum Herstellen und Tintenstrahldruckkopf mit Verwendung dieser Dünnschicht |
JPH08335676A (ja) | 1995-06-09 | 1996-12-17 | Rohm Co Ltd | 複合酸化物の結晶性薄膜の製造方法 |
JPH0969614A (ja) | 1995-09-01 | 1997-03-11 | Sharp Corp | 強誘電体薄膜、誘電体薄膜及び強誘電体薄膜を含む集積回路の製造方法 |
JP3890634B2 (ja) | 1995-09-19 | 2007-03-07 | セイコーエプソン株式会社 | 圧電体薄膜素子及びインクジェット式記録ヘッド |
JP3209082B2 (ja) * | 1996-03-06 | 2001-09-17 | セイコーエプソン株式会社 | 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド |
JPH1050960A (ja) | 1996-07-26 | 1998-02-20 | Texas Instr Japan Ltd | 強誘電体キャパシタ及び強誘電体メモリ装置と、これらの製造方法 |
JPH1086365A (ja) | 1996-09-17 | 1998-04-07 | Citizen Watch Co Ltd | 強誘電体薄膜素子 |
EP0867952B8 (de) * | 1997-03-27 | 2003-05-28 | Seiko Epson Corporation | Verfahren zur Herstellung eines piezoelektrischen Elements |
JP3520403B2 (ja) | 1998-01-23 | 2004-04-19 | セイコーエプソン株式会社 | 圧電体薄膜素子、アクチュエータ、インクジェット式記録ヘッド、及びインクジェット式記録装置 |
JPH11307834A (ja) | 1998-04-24 | 1999-11-05 | Seiko Epson Corp | 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法 |
JP2000022232A (ja) | 1998-07-01 | 2000-01-21 | Seiko Epson Corp | 圧電体素子、インクジェット式記録ヘッド、圧電体素子の制御方法および製造方法 |
JP3517876B2 (ja) | 1998-10-14 | 2004-04-12 | セイコーエプソン株式会社 | 強誘電体薄膜素子の製造方法、インクジェット式記録ヘッド及びインクジェットプリンタ |
US6399521B1 (en) | 1999-05-21 | 2002-06-04 | Sharp Laboratories Of America, Inc. | Composite iridium barrier structure with oxidized refractory metal companion barrier and method for same |
JP2001196652A (ja) | 1999-11-01 | 2001-07-19 | Kansai Research Institute | 圧電体素子およびその製造方法ならびにそれを用いたインクジェット式プリンタヘッド |
JP3685318B2 (ja) | 1999-11-09 | 2005-08-17 | セイコーエプソン株式会社 | 強誘電体薄膜素子の製造方法及び加熱処理装置 |
US6494567B2 (en) * | 2000-03-24 | 2002-12-17 | Seiko Epson Corporation | Piezoelectric element and manufacturing method and manufacturing device thereof |
-
2003
- 2003-01-10 JP JP2003005116A patent/JP4530615B2/ja not_active Expired - Lifetime
- 2003-01-22 DE DE60327379T patent/DE60327379D1/de not_active Expired - Fee Related
- 2003-01-22 EP EP20030001304 patent/EP1329964B1/de not_active Expired - Fee Related
- 2003-01-22 US US10/348,340 patent/US6883901B2/en not_active Expired - Lifetime
- 2003-01-22 CN CN03103312A patent/CN1438117A/zh active Pending
- 2003-01-22 DE DE2003616857 patent/DE60316857T2/de not_active Expired - Lifetime
- 2003-01-22 EP EP20060024943 patent/EP1763093B1/de not_active Expired - Fee Related
-
2004
- 2004-08-05 US US10/911,709 patent/US7328490B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1438117A (zh) | 2003-08-27 |
DE60316857D1 (de) | 2007-11-29 |
EP1329964B1 (de) | 2007-10-17 |
US20030227518A1 (en) | 2003-12-11 |
EP1763093B1 (de) | 2009-04-22 |
EP1329964A3 (de) | 2006-03-15 |
US6883901B2 (en) | 2005-04-26 |
JP2004104066A (ja) | 2004-04-02 |
US7328490B2 (en) | 2008-02-12 |
US20050078153A1 (en) | 2005-04-14 |
EP1763093A1 (de) | 2007-03-14 |
DE60316857T2 (de) | 2008-02-07 |
JP4530615B2 (ja) | 2010-08-25 |
EP1329964A2 (de) | 2003-07-23 |
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