DE60320744D1 - Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte - Google Patents
Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte LeiterplatteInfo
- Publication number
- DE60320744D1 DE60320744D1 DE60320744T DE60320744T DE60320744D1 DE 60320744 D1 DE60320744 D1 DE 60320744D1 DE 60320744 T DE60320744 T DE 60320744T DE 60320744 T DE60320744 T DE 60320744T DE 60320744 D1 DE60320744 D1 DE 60320744D1
- Authority
- DE
- Germany
- Prior art keywords
- optical
- hole
- circuit board
- printed circuit
- transmitting signals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/365,127 US7263248B2 (en) | 2003-02-11 | 2003-02-11 | Optical via to pass signals through a printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60320744D1 true DE60320744D1 (de) | 2008-06-19 |
Family
ID=32681703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60320744T Expired - Lifetime DE60320744D1 (de) | 2003-02-11 | 2003-09-29 | Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte |
Country Status (3)
Country | Link |
---|---|
US (2) | US7263248B2 (de) |
EP (1) | EP1447694B1 (de) |
DE (1) | DE60320744D1 (de) |
Families Citing this family (70)
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EP1557075A4 (de) | 2002-10-22 | 2010-01-13 | Sullivan Jason | Nicht-peripheres verarbeitungssteuermodul mit verbesserten wärmeableiteigenschaften |
CN1729734B (zh) | 2002-10-22 | 2011-01-05 | 贾森·A·沙利文 | 用于提供动态模块处理单元的系统及方法 |
BR0315624A (pt) | 2002-10-22 | 2005-08-23 | Jason A Sullivan | Sistema de processamento em computador personalizável robusto |
US7263248B2 (en) * | 2003-02-11 | 2007-08-28 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical via to pass signals through a printed circuit board |
FI20041233A (fi) * | 2004-09-23 | 2006-03-24 | Aspocomp Technology Oy | Menetelmä optoelektronisen moduulin kokoamiseksi ja optoelektronisen moduulin rakenne |
US7391937B2 (en) * | 2004-10-22 | 2008-06-24 | Lockheed Martin Corporation | Compact transition in layered optical fiber |
US7500792B2 (en) * | 2004-11-26 | 2009-03-10 | Finisar Corporation | Optoelectronic transmitting and/or receiving arrangement |
US7551811B2 (en) * | 2005-01-19 | 2009-06-23 | Bridgestone Corporation | Optical device and method for producing the same |
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US8498504B2 (en) * | 2008-03-27 | 2013-07-30 | Kyocera Corporation | Integrated optical transmission board and optical module |
US7486847B1 (en) | 2008-03-31 | 2009-02-03 | International Business Machines Corporation | Chip carrier package with optical vias |
US7672560B2 (en) * | 2008-05-13 | 2010-03-02 | International Business Machines Corporation | Coupling device for use in optical waveguides |
KR100969435B1 (ko) * | 2008-05-23 | 2010-07-14 | 삼성전기주식회사 | 광도파로를 갖는 인쇄회로기판 및 그 제조방법 |
JP4971248B2 (ja) * | 2008-05-27 | 2012-07-11 | 日東電工株式会社 | 光電気混載モジュールの製造方法 |
US7802927B2 (en) * | 2008-05-30 | 2010-09-28 | Corning Cable Systems Llc | Bent optical fiber couplers and opto-electrical assemblies formed therefrom |
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KR101246137B1 (ko) * | 2008-12-19 | 2013-03-25 | 한국전자통신연구원 | 발광 소자 및 광결합 모듈 |
US8604603B2 (en) * | 2009-02-20 | 2013-12-10 | The Hong Kong University Of Science And Technology | Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers |
US9057853B2 (en) * | 2009-02-20 | 2015-06-16 | The Hong Kong University Of Science And Technology | Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects |
WO2011019435A2 (en) * | 2009-05-27 | 2011-02-17 | University Of Delaware | Formation of reflective surfaces in printed circuit board waveguides |
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KR20110039017A (ko) * | 2009-10-09 | 2011-04-15 | 엘지이노텍 주식회사 | 광인쇄회로기판 및 그 제조방법 |
CN102648428B (zh) * | 2009-10-08 | 2015-09-09 | Lg伊诺特有限公司 | 光学印刷电路板及其制造方法 |
JP5493744B2 (ja) * | 2009-11-12 | 2014-05-14 | 富士通株式会社 | 光電気混載基板、および、光電気混載基板の製造方法 |
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US8632261B2 (en) * | 2010-04-20 | 2014-01-21 | Hon Hai Precision Industry Co., Ltd. | Integrated and sealed opto-electronic device assembly |
US8399292B2 (en) | 2010-06-30 | 2013-03-19 | International Business Machines Corporation | Fabricating a semiconductor chip with backside optical vias |
JP5505140B2 (ja) * | 2010-07-05 | 2014-05-28 | 富士通株式会社 | 光モジュールおよび製造方法 |
WO2012029880A1 (ja) * | 2010-08-31 | 2012-03-08 | 京セラ株式会社 | 光伝送基板および光伝送モジュールならびに光伝送基板の製造方法 |
JP4969711B2 (ja) * | 2010-08-31 | 2012-07-04 | 京セラ株式会社 | 光伝送体およびその製造方法、ならびに光伝送モジュール |
US8680458B2 (en) | 2010-10-07 | 2014-03-25 | Empire Technology Development, Llc | Data transmission through optical vias |
EP2643725A1 (de) * | 2010-11-25 | 2013-10-02 | Fci | Optische leiterplatte |
WO2012096651A1 (en) * | 2011-01-11 | 2012-07-19 | Hewlett-Packard Development Company, L.P. | Passive optical alignment |
US8708576B2 (en) * | 2011-01-20 | 2014-04-29 | Harris Corporation | Electro-optical device having an elastomeric body and related methods |
WO2012109393A1 (en) | 2011-02-08 | 2012-08-16 | Henry Cooper | High gain frequency step horn antenna |
US9478868B2 (en) | 2011-02-09 | 2016-10-25 | Xi3 | Corrugated horn antenna with enhanced frequency range |
JP2012194401A (ja) * | 2011-03-16 | 2012-10-11 | Nitto Denko Corp | 光電気混載基板およびその製法 |
US8818145B2 (en) * | 2011-08-03 | 2014-08-26 | Tyco Electronics Corporation | Optical interposer with transparent substrate |
US9570420B2 (en) * | 2011-09-29 | 2017-02-14 | Broadcom Corporation | Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
US9318785B2 (en) | 2011-09-29 | 2016-04-19 | Broadcom Corporation | Apparatus for reconfiguring an integrated waveguide |
US8855452B2 (en) | 2012-01-18 | 2014-10-07 | International Business Machines Corporation | Silicon photonic chip optical coupling structures |
US9917647B2 (en) | 2012-01-31 | 2018-03-13 | Hewlett Packard Enterprise Development Lp | Combination underfill-dam and electrical-interconnect structure for an opto-electronic engine |
CN104246564B (zh) | 2012-04-25 | 2016-03-02 | 惠普发展公司,有限责任合伙企业 | 电学/光学连接器 |
TWI561881B (en) * | 2012-04-27 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Fiber optical transceiver |
JP6001327B2 (ja) * | 2012-05-23 | 2016-10-05 | 京セラ株式会社 | 光配線部品、光配線モジュールおよび光配線装置 |
US9323014B2 (en) * | 2012-05-28 | 2016-04-26 | Mellanox Technologies Ltd. | High-speed optical module with flexible printed circuit board |
JP6081086B2 (ja) * | 2012-06-14 | 2017-02-15 | Tdk株式会社 | 光電素子用実装装置及び実装方法 |
US9195007B2 (en) | 2012-06-28 | 2015-11-24 | Intel Corporation | Inverted 45 degree mirror for photonic integrated circuits |
US9172462B2 (en) * | 2012-12-31 | 2015-10-27 | Zephyr Photonics Inc. | Optical bench apparatus having integrated monitor photodetectors and method for monitoring optical power using same |
CN106062970B (zh) | 2013-03-11 | 2018-05-08 | 英特尔公司 | 用于硅基光子集成电路的具有凹角镜的低电压雪崩光电二极管 |
US9450309B2 (en) | 2013-05-30 | 2016-09-20 | Xi3 | Lobe antenna |
US9804348B2 (en) | 2013-07-04 | 2017-10-31 | Mellanox Technologies, Ltd. | Silicon photonics connector |
US9454177B2 (en) * | 2014-02-14 | 2016-09-27 | Apple Inc. | Electronic devices with housing-based interconnects and coupling structures |
WO2016007958A2 (en) * | 2014-07-11 | 2016-01-14 | Xi3, Inc. | Systems and methods for providing a high power pc board air dielectric splitter |
US10209464B2 (en) * | 2014-10-17 | 2019-02-19 | Cisco Technology, Inc. | Direct printed circuit routing to stacked opto-electrical IC packages |
US9543463B2 (en) | 2014-10-27 | 2017-01-10 | International Business Machines Corporation | Signal distribution in integrated circuit using optical through silicon via |
KR102429868B1 (ko) | 2014-12-04 | 2022-08-05 | 삼성전자주식회사 | 플라즈몬 비아를 이용한 광 인터커넥션 소자 |
KR102349774B1 (ko) * | 2015-03-11 | 2022-01-10 | 삼성전자주식회사 | 광전 회로 |
WO2017039508A1 (en) * | 2015-09-03 | 2017-03-09 | Telefonaktiebolaget Lm Ericsson (Publ) | System, method, and apparatus for optical broadcast transmission in a circuit board |
US9709748B2 (en) * | 2015-09-03 | 2017-07-18 | International Business Machines Corporation | Frontside coupled waveguide with backside optical connection using a curved spacer |
US9759634B2 (en) | 2015-09-14 | 2017-09-12 | Seagate Technology Llc | Coupling loss evaluation |
US10996401B2 (en) * | 2016-06-30 | 2021-05-04 | Mellanox Technologies, Ltd. | Method and apparatus for optical coupling of optical signals for a photonic integrated circuit |
US10025044B1 (en) * | 2017-01-17 | 2018-07-17 | International Business Machines Corporation | Optical structure |
US10168495B1 (en) * | 2017-06-28 | 2019-01-01 | Kyocera Corporation | Optical waveguide and optical circuit board |
US10681832B1 (en) * | 2019-06-06 | 2020-06-09 | Hewlett Packard Enterprise Development Lp | High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs) |
WO2022149051A1 (en) * | 2021-01-07 | 2022-07-14 | Rockley Photonics Limited | Optical assemblies comprising a prism |
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US4732446A (en) * | 1985-10-02 | 1988-03-22 | Lamar Gipson | Electrical circuit and optical data buss |
US4897711A (en) * | 1988-03-03 | 1990-01-30 | American Telephone And Telegraph Company | Subassembly for optoelectronic devices |
JP2921877B2 (ja) * | 1989-09-19 | 1999-07-19 | 富士通株式会社 | 導波路分波モジュール及びその製造方法 |
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JP3715425B2 (ja) * | 1998-03-06 | 2005-11-09 | ブラザー工業株式会社 | 光導波路付基板の製造方法 |
JP2000081524A (ja) * | 1998-09-07 | 2000-03-21 | Sony Corp | 光送受信システム |
US6785447B2 (en) * | 1998-10-09 | 2004-08-31 | Fujitsu Limited | Single and multilayer waveguides and fabrication process |
TW451084B (en) * | 1999-06-25 | 2001-08-21 | Toppan Printing Co Ltd | Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board |
JP3728147B2 (ja) * | 1999-07-16 | 2005-12-21 | キヤノン株式会社 | 光電気混載配線基板 |
DE10032796A1 (de) * | 2000-06-28 | 2002-01-17 | Infineon Technologies Ag | Optomodul |
US6819836B2 (en) | 2000-12-19 | 2004-11-16 | Intel Corporation | Photonic and electronic components on a shared substrate with through substrate communication |
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JP2002258081A (ja) * | 2001-02-28 | 2002-09-11 | Fujitsu Ltd | 光配線基板、光配線基板の製造方法及び多層光配線 |
US6512861B2 (en) * | 2001-06-26 | 2003-01-28 | Intel Corporation | Packaging and assembly method for optical coupling |
US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
US6944377B2 (en) * | 2002-03-15 | 2005-09-13 | Hitachi Maxell, Ltd. | Optical communication device and laminated optical communication module |
US20040042705A1 (en) * | 2002-08-27 | 2004-03-04 | Uchida Toshi K. | Embedded optical coupling in circuit boards |
US7263248B2 (en) * | 2003-02-11 | 2007-08-28 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical via to pass signals through a printed circuit board |
KR20050040589A (ko) * | 2003-10-29 | 2005-05-03 | 삼성전기주식회사 | 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법 |
-
2003
- 2003-02-11 US US10/365,127 patent/US7263248B2/en not_active Expired - Lifetime
- 2003-09-29 DE DE60320744T patent/DE60320744D1/de not_active Expired - Lifetime
- 2003-09-29 EP EP03021693A patent/EP1447694B1/de not_active Expired - Fee Related
-
2007
- 2007-07-17 US US11/779,116 patent/US7466880B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7466880B2 (en) | 2008-12-16 |
US20040156576A1 (en) | 2004-08-12 |
US7263248B2 (en) | 2007-08-28 |
US20070258676A1 (en) | 2007-11-08 |
EP1447694A1 (de) | 2004-08-18 |
EP1447694B1 (de) | 2008-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |