DE60320744D1 - Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte - Google Patents

Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte

Info

Publication number
DE60320744D1
DE60320744D1 DE60320744T DE60320744T DE60320744D1 DE 60320744 D1 DE60320744 D1 DE 60320744D1 DE 60320744 T DE60320744 T DE 60320744T DE 60320744 T DE60320744 T DE 60320744T DE 60320744 D1 DE60320744 D1 DE 60320744D1
Authority
DE
Germany
Prior art keywords
optical
hole
circuit board
printed circuit
transmitting signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60320744T
Other languages
English (en)
Inventor
Lisa A Windover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Application granted granted Critical
Publication of DE60320744D1 publication Critical patent/DE60320744D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
DE60320744T 2003-02-11 2003-09-29 Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte Expired - Lifetime DE60320744D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/365,127 US7263248B2 (en) 2003-02-11 2003-02-11 Optical via to pass signals through a printed circuit board

Publications (1)

Publication Number Publication Date
DE60320744D1 true DE60320744D1 (de) 2008-06-19

Family

ID=32681703

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60320744T Expired - Lifetime DE60320744D1 (de) 2003-02-11 2003-09-29 Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte

Country Status (3)

Country Link
US (2) US7263248B2 (de)
EP (1) EP1447694B1 (de)
DE (1) DE60320744D1 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1557075A4 (de) 2002-10-22 2010-01-13 Sullivan Jason Nicht-peripheres verarbeitungssteuermodul mit verbesserten wärmeableiteigenschaften
US7242574B2 (en) 2002-10-22 2007-07-10 Sullivan Jason A Robust customizable computer processing system
WO2004038527A2 (en) 2002-10-22 2004-05-06 Isys Technologies Systems and methods for providing a dynamically modular processing unit
US7263248B2 (en) * 2003-02-11 2007-08-28 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical via to pass signals through a printed circuit board
FI20041233A (fi) * 2004-09-23 2006-03-24 Aspocomp Technology Oy Menetelmä optoelektronisen moduulin kokoamiseksi ja optoelektronisen moduulin rakenne
US7391937B2 (en) * 2004-10-22 2008-06-24 Lockheed Martin Corporation Compact transition in layered optical fiber
US7500792B2 (en) * 2004-11-26 2009-03-10 Finisar Corporation Optoelectronic transmitting and/or receiving arrangement
US7551811B2 (en) * 2005-01-19 2009-06-23 Bridgestone Corporation Optical device and method for producing the same
US7350934B2 (en) 2005-05-03 2008-04-01 Delphi Technologies, Inc. Illuminated display system
JP4277840B2 (ja) * 2005-09-30 2009-06-10 ミツミ電機株式会社 光導波路デバイスの製造方法
CN101501543B (zh) * 2006-06-30 2013-04-17 应用材料公司 晶片等级的光学组件对准
KR100871252B1 (ko) * 2007-01-19 2008-11-28 삼성전자주식회사 광섬유를 이용한 광/전기 배선을 갖는 연성 인쇄회로기판
US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
US8498504B2 (en) * 2008-03-27 2013-07-30 Kyocera Corporation Integrated optical transmission board and optical module
US7486847B1 (en) 2008-03-31 2009-02-03 International Business Machines Corporation Chip carrier package with optical vias
US7672560B2 (en) * 2008-05-13 2010-03-02 International Business Machines Corporation Coupling device for use in optical waveguides
KR100969435B1 (ko) * 2008-05-23 2010-07-14 삼성전기주식회사 광도파로를 갖는 인쇄회로기판 및 그 제조방법
JP4971248B2 (ja) * 2008-05-27 2012-07-11 日東電工株式会社 光電気混載モジュールの製造方法
US7802927B2 (en) * 2008-05-30 2010-09-28 Corning Cable Systems Llc Bent optical fiber couplers and opto-electrical assemblies formed therefrom
US8171625B1 (en) * 2008-06-02 2012-05-08 Wavefront Research, Inc. Method of providing low footprint optical interconnect
KR101246137B1 (ko) * 2008-12-19 2013-03-25 한국전자통신연구원 발광 소자 및 광결합 모듈
US8604603B2 (en) * 2009-02-20 2013-12-10 The Hong Kong University Of Science And Technology Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers
US9057853B2 (en) * 2009-02-20 2015-06-16 The Hong Kong University Of Science And Technology Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects
WO2011019435A2 (en) * 2009-05-27 2011-02-17 University Of Delaware Formation of reflective surfaces in printed circuit board waveguides
US8593826B2 (en) * 2009-09-18 2013-11-26 Samsung Electronics Co., Ltd. Memory module, memory system having the memory module, and method for manufacturing the memory module
JP5632479B2 (ja) 2009-10-08 2014-11-26 エルジー イノテック カンパニー リミテッド 光印刷回路基板及びその製造方法
KR20110039017A (ko) * 2009-10-09 2011-04-15 엘지이노텍 주식회사 광인쇄회로기판 및 그 제조방법
JP5493744B2 (ja) * 2009-11-12 2014-05-14 富士通株式会社 光電気混載基板、および、光電気混載基板の製造方法
US20110243509A1 (en) * 2010-04-05 2011-10-06 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Opto-electronic transceiver module system
US8632261B2 (en) * 2010-04-20 2014-01-21 Hon Hai Precision Industry Co., Ltd. Integrated and sealed opto-electronic device assembly
US8399292B2 (en) 2010-06-30 2013-03-19 International Business Machines Corporation Fabricating a semiconductor chip with backside optical vias
JP5505140B2 (ja) * 2010-07-05 2014-05-28 富士通株式会社 光モジュールおよび製造方法
JP4969711B2 (ja) * 2010-08-31 2012-07-04 京セラ株式会社 光伝送体およびその製造方法、ならびに光伝送モジュール
EP2613188B1 (de) * 2010-08-31 2019-01-23 Kyocera Corporation Substrat für optische übertragung und modul für optische übertragung
WO2012047220A1 (en) * 2010-10-07 2012-04-12 Empire Technology Development Llc Data transmission through optical vias
US9285555B2 (en) * 2010-11-25 2016-03-15 Gnitabouré YABRE Optical circuit board
WO2012096651A1 (en) * 2011-01-11 2012-07-19 Hewlett-Packard Development Company, L.P. Passive optical alignment
US8708576B2 (en) * 2011-01-20 2014-04-29 Harris Corporation Electro-optical device having an elastomeric body and related methods
WO2012109393A1 (en) 2011-02-08 2012-08-16 Henry Cooper High gain frequency step horn antenna
WO2012109498A1 (en) 2011-02-09 2012-08-16 Henry Cooper Corrugated horn antenna with enhanced frequency range
JP2012194401A (ja) * 2011-03-16 2012-10-11 Nitto Denko Corp 光電気混載基板およびその製法
US8818145B2 (en) * 2011-08-03 2014-08-26 Tyco Electronics Corporation Optical interposer with transparent substrate
US9570420B2 (en) * 2011-09-29 2017-02-14 Broadcom Corporation Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package
US9318785B2 (en) 2011-09-29 2016-04-19 Broadcom Corporation Apparatus for reconfiguring an integrated waveguide
US8855452B2 (en) 2012-01-18 2014-10-07 International Business Machines Corporation Silicon photonic chip optical coupling structures
US9917647B2 (en) 2012-01-31 2018-03-13 Hewlett Packard Enterprise Development Lp Combination underfill-dam and electrical-interconnect structure for an opto-electronic engine
WO2013162550A1 (en) 2012-04-25 2013-10-31 Hewlett-Packard Development Company, L. P. Electrical/optical connector
TWI561881B (en) * 2012-04-27 2016-12-11 Hon Hai Prec Ind Co Ltd Fiber optical transceiver
JP6001327B2 (ja) * 2012-05-23 2016-10-05 京セラ株式会社 光配線部品、光配線モジュールおよび光配線装置
US9323014B2 (en) * 2012-05-28 2016-04-26 Mellanox Technologies Ltd. High-speed optical module with flexible printed circuit board
JP6081086B2 (ja) * 2012-06-14 2017-02-15 Tdk株式会社 光電素子用実装装置及び実装方法
US9195007B2 (en) * 2012-06-28 2015-11-24 Intel Corporation Inverted 45 degree mirror for photonic integrated circuits
US9172462B2 (en) * 2012-12-31 2015-10-27 Zephyr Photonics Inc. Optical bench apparatus having integrated monitor photodetectors and method for monitoring optical power using same
KR101691851B1 (ko) 2013-03-11 2017-01-02 인텔 코포레이션 실리콘 기반 광 집적 회로를 위한 오목 미러를 갖는 저전압 아발란치 광 다이오드
US9450309B2 (en) 2013-05-30 2016-09-20 Xi3 Lobe antenna
US9804348B2 (en) 2013-07-04 2017-10-31 Mellanox Technologies, Ltd. Silicon photonics connector
US9454177B2 (en) * 2014-02-14 2016-09-27 Apple Inc. Electronic devices with housing-based interconnects and coupling structures
WO2016007958A2 (en) * 2014-07-11 2016-01-14 Xi3, Inc. Systems and methods for providing a high power pc board air dielectric splitter
US10209464B2 (en) * 2014-10-17 2019-02-19 Cisco Technology, Inc. Direct printed circuit routing to stacked opto-electrical IC packages
US9543463B2 (en) 2014-10-27 2017-01-10 International Business Machines Corporation Signal distribution in integrated circuit using optical through silicon via
KR102429868B1 (ko) 2014-12-04 2022-08-05 삼성전자주식회사 플라즈몬 비아를 이용한 광 인터커넥션 소자
KR102349774B1 (ko) * 2015-03-11 2022-01-10 삼성전자주식회사 광전 회로
WO2017039508A1 (en) * 2015-09-03 2017-03-09 Telefonaktiebolaget Lm Ericsson (Publ) System, method, and apparatus for optical broadcast transmission in a circuit board
US9709748B2 (en) * 2015-09-03 2017-07-18 International Business Machines Corporation Frontside coupled waveguide with backside optical connection using a curved spacer
US9759634B2 (en) 2015-09-14 2017-09-12 Seagate Technology Llc Coupling loss evaluation
US10996401B2 (en) * 2016-06-30 2021-05-04 Mellanox Technologies, Ltd. Method and apparatus for optical coupling of optical signals for a photonic integrated circuit
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
US10168495B1 (en) * 2017-06-28 2019-01-01 Kyocera Corporation Optical waveguide and optical circuit board
US10681832B1 (en) * 2019-06-06 2020-06-09 Hewlett Packard Enterprise Development Lp High-density universally-configurable system board architecture with dual-use modular mid-board optics (MBOs)
WO2022149051A1 (en) * 2021-01-07 2022-07-14 Rockley Photonics Limited Optical assemblies comprising a prism
US12085769B2 (en) * 2021-04-23 2024-09-10 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit device and method
US20220404551A1 (en) * 2021-06-16 2022-12-22 Intel Corporation Through-substrate optical vias
US20230314738A1 (en) * 2022-04-01 2023-10-05 Unimicron Technology Corp. Electronic device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4732446A (en) * 1985-10-02 1988-03-22 Lamar Gipson Electrical circuit and optical data buss
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
JP2921877B2 (ja) * 1989-09-19 1999-07-19 富士通株式会社 導波路分波モジュール及びその製造方法
JPH11183749A (ja) * 1997-12-22 1999-07-09 Hitachi Chem Co Ltd 光回路基板とその製造法
JP3715425B2 (ja) * 1998-03-06 2005-11-09 ブラザー工業株式会社 光導波路付基板の製造方法
JP2000081524A (ja) 1998-09-07 2000-03-21 Sony Corp 光送受信システム
US6785447B2 (en) * 1998-10-09 2004-08-31 Fujitsu Limited Single and multilayer waveguides and fabrication process
TW451084B (en) * 1999-06-25 2001-08-21 Toppan Printing Co Ltd Optical-electro wiring board, mounted board, and manufacturing method of optical-electro wiring board
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
DE10032796A1 (de) * 2000-06-28 2002-01-17 Infineon Technologies Ag Optomodul
US6819836B2 (en) 2000-12-19 2004-11-16 Intel Corporation Photonic and electronic components on a shared substrate with through substrate communication
US6424761B1 (en) 2001-01-22 2002-07-23 Tycom (Us) Inc. Cable repeater connecting joint
JP2002258081A (ja) * 2001-02-28 2002-09-11 Fujitsu Ltd 光配線基板、光配線基板の製造方法及び多層光配線
US6512861B2 (en) * 2001-06-26 2003-01-28 Intel Corporation Packaging and assembly method for optical coupling
US6754407B2 (en) * 2001-06-26 2004-06-22 Intel Corporation Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board
US6944377B2 (en) * 2002-03-15 2005-09-13 Hitachi Maxell, Ltd. Optical communication device and laminated optical communication module
US20040042705A1 (en) * 2002-08-27 2004-03-04 Uchida Toshi K. Embedded optical coupling in circuit boards
US7263248B2 (en) * 2003-02-11 2007-08-28 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical via to pass signals through a printed circuit board
KR20050040589A (ko) * 2003-10-29 2005-05-03 삼성전기주식회사 광도파로가 형성된 인쇄회로 기판 및 그 제조 방법

Also Published As

Publication number Publication date
US20040156576A1 (en) 2004-08-12
EP1447694B1 (de) 2008-05-07
EP1447694A1 (de) 2004-08-18
US20070258676A1 (en) 2007-11-08
US7263248B2 (en) 2007-08-28
US7466880B2 (en) 2008-12-16

Similar Documents

Publication Publication Date Title
DE60320744D1 (de) Optisches Durchgangsloch zür Übertragung von Signalen durch eine gedruckte Leiterplatte
DE60232473D1 (de) Mehrschichtige Leiterplatte
FI20022140A0 (fi) Joustava painettu piirilevy
DE50212657D1 (de) Elektronische Baugruppe
FR2828587B1 (fr) Connecteur de carte de circuit imprime
DE60045566D1 (de) Mehrschicht-Leiterplatte
DE602004028794D1 (de) Leiterplatte
SG129435A1 (en) Printed circuit board test access point structuresand method for making the same
DE60309777D1 (de) Anschlusskontakt für Leiterplatte
DE60039569D1 (de) Gedruckte Leiterplatte
AU2003286422A8 (en) Photonic circuit board
DE60143235D1 (de) Mehrschichtige Leiterplatte
GB2404089B (en) Printed circuit board assembly
DE60208254D1 (de) Datentrennschaltung
NO20011708L (no) Harpiksstöpt enhet som inneholder en elektronisk kretskomponent
DE60204745D1 (de) Verbindungseinrichtung zwischen Leiterplatten
DE602004015387D1 (de) Leiterplatte
DE69939157D1 (de) Gedruckte Leiterplatte
DE60208482D1 (de) Zwischenanschlussleiterplattenverbinder
DE60231610D1 (de) Mehrschichtige gedruckte Leiterplatte
DE60219262D1 (de) Verbindungsanordnung für eine flexibele Leiterplatte
DE60020193D1 (de) Mehrschichtige Leiterplatte
DE60207144D1 (de) Schaltungsanordnung einer Rückwandleiterplatte
DE50112584D1 (de) Elektronische Baugruppe
DE60311765D1 (de) Leiterplatte für Hochgeschwindigkeitskommunikation

Legal Events

Date Code Title Description
8364 No opposition during term of opposition