FI20022140A0 - Joustava painettu piirilevy - Google Patents

Joustava painettu piirilevy

Info

Publication number
FI20022140A0
FI20022140A0 FI20022140A FI20022140A FI20022140A0 FI 20022140 A0 FI20022140 A0 FI 20022140A0 FI 20022140 A FI20022140 A FI 20022140A FI 20022140 A FI20022140 A FI 20022140A FI 20022140 A0 FI20022140 A0 FI 20022140A0
Authority
FI
Finland
Prior art keywords
circuit board
printed circuit
flexible printed
flexible
board
Prior art date
Application number
FI20022140A
Other languages
English (en)
Swedish (sv)
Other versions
FI120997B (fi
FI20022140A (fi
Inventor
Takao Adachi
Kazuyoshi Inoue
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Publication of FI20022140A0 publication Critical patent/FI20022140A0/fi
Publication of FI20022140A publication Critical patent/FI20022140A/fi
Application granted granted Critical
Publication of FI120997B publication Critical patent/FI120997B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FI20022140A 2001-12-10 2002-12-04 Taipuisa piirilevy FI120997B (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001376322A JP4063533B2 (ja) 2001-12-10 2001-12-10 フレキシブル配線板
JP2001376322 2001-12-10

Publications (3)

Publication Number Publication Date
FI20022140A0 true FI20022140A0 (fi) 2002-12-04
FI20022140A FI20022140A (fi) 2003-06-11
FI120997B FI120997B (fi) 2010-05-31

Family

ID=19184539

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20022140A FI120997B (fi) 2001-12-10 2002-12-04 Taipuisa piirilevy

Country Status (5)

Country Link
US (1) US6737589B2 (fi)
JP (1) JP4063533B2 (fi)
KR (1) KR100496485B1 (fi)
CN (1) CN1269388C (fi)
FI (1) FI120997B (fi)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6885549B2 (en) * 2002-04-11 2005-04-26 Dell Products L.P. System and method for flexible circuits
US7116522B2 (en) * 2003-05-19 2006-10-03 Hewlett-Packard Development Company, L.P. System and method related to a flexible circuit
WO2004110114A1 (en) * 2003-06-02 2004-12-16 Showa Denko K.K. Flexible wiring board and flex-rigid wiring board
EP1551037A1 (de) * 2004-01-05 2005-07-06 Alcan Technology & Management Ltd. Flexibler Träger mit elektrisch leitfähiger Struktur
JP2005340382A (ja) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法
US7331010B2 (en) 2004-10-29 2008-02-12 International Business Machines Corporation System, method and storage medium for providing fault detection and correction in a memory subsystem
US7354794B2 (en) * 2005-02-18 2008-04-08 Lexmark International, Inc. Printed conductive connectors
JP2007005782A (ja) * 2005-05-27 2007-01-11 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
KR100640659B1 (ko) * 2005-08-01 2006-11-01 삼성전자주식회사 가요성 인쇄회로 및 이의 제조방법
US7518831B2 (en) * 2005-10-04 2009-04-14 Certance Llc Low impedance flexible circuit for tape head
US7685392B2 (en) 2005-11-28 2010-03-23 International Business Machines Corporation Providing indeterminate read data latency in a memory system
KR100666224B1 (ko) * 2006-02-27 2007-01-09 삼성전자주식회사 개구를 가지는 리지드 플렉시블 인쇄회로기판
JP4912960B2 (ja) * 2007-06-06 2012-04-11 日本メクトロン株式会社 プリント配線板
JP5000451B2 (ja) * 2007-10-15 2012-08-15 日東電工株式会社 配線回路基板
KR100956238B1 (ko) * 2007-12-18 2010-05-04 삼성전기주식회사 굴곡성 인쇄회로기판 및 그 제조방법
JP2009188379A (ja) * 2008-01-07 2009-08-20 Nitto Denko Corp 配線回路基板
JP2009177030A (ja) * 2008-01-25 2009-08-06 Opnext Japan Inc 光送信モジュール及び光伝送装置
KR100987191B1 (ko) * 2008-04-18 2010-10-11 (주)기가레인 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판
US7812258B2 (en) * 2008-04-23 2010-10-12 Hitachi Global Storage Technologies Netherlands, B.V. Flex cable with biased neutral axis
JP2009302342A (ja) * 2008-06-13 2009-12-24 Denso Corp 多層基板及びその設計方法
WO2010058622A1 (ja) * 2008-11-19 2010-05-27 シャープ株式会社 フレキシブル基板およびそれを備えた表示装置
JP5407404B2 (ja) * 2009-02-19 2014-02-05 ソニー株式会社 配線基板とその製造方法、チューナモジュール、及び電子機器
CN102474978B (zh) * 2009-07-13 2015-08-19 株式会社村田制作所 信号线路及其制造方法
WO2011018979A1 (ja) * 2009-08-11 2011-02-17 株式会社村田製作所 多層基板
KR101130697B1 (ko) * 2010-05-07 2012-04-02 삼성전자주식회사 복수 층의 신축성 배선
WO2013005549A1 (ja) * 2011-07-05 2013-01-10 株式会社村田製作所 フレキシブル多層基板
JP5703525B2 (ja) * 2011-08-23 2015-04-22 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及び該フレキシブルプリント配線板の製造方法
US9131602B2 (en) * 2012-02-24 2015-09-08 Mediatek Inc. Printed circuit board for mobile platforms
WO2014065172A1 (ja) * 2012-10-26 2014-05-01 株式会社村田製作所 フレキシブル基板
US9560748B2 (en) 2013-01-04 2017-01-31 Bose Corporation Flexible printed circuit
KR101473312B1 (ko) * 2013-05-31 2014-12-16 삼성디스플레이 주식회사 플렉시블 터치스크린패널과 그것을 구비한 플렉시블 디스플레이 장치
KR102062108B1 (ko) * 2013-06-10 2020-01-03 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
CN104349575B (zh) * 2013-07-31 2017-12-26 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制作方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
TWI552039B (zh) * 2014-06-27 2016-10-01 群創光電股份有限公司 觸控顯示裝置
KR102320382B1 (ko) * 2015-01-28 2021-11-02 삼성디스플레이 주식회사 전자 장치
JP6426067B2 (ja) * 2015-08-06 2018-11-21 日本メクトロン株式会社 多層フレキシブルプリント配線板およびその製造方法
US10111329B2 (en) * 2015-12-18 2018-10-23 Portwell Inc. Flexible flat cable structure capable of improving crosstalk interference
CN105407632B (zh) * 2015-12-29 2018-06-29 广东欧珀移动通信有限公司 柔性电路板走线结构及移动终端
KR20210026209A (ko) * 2019-08-29 2021-03-10 삼성전자주식회사 인쇄회로 기판 및 그를 포함하는 전자 장치
CN113766725B (zh) * 2020-06-03 2023-06-20 鹏鼎控股(深圳)股份有限公司 高频电路板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498122A (en) * 1982-12-29 1985-02-05 At&T Bell Laboratories High-speed, high pin-out LSI chip package
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US4864722A (en) * 1988-03-16 1989-09-12 International Business Machines Corporation Low dielectric printed circuit boards
FR2640457B1 (fr) * 1988-12-09 1991-01-25 Thomson Csf Dispositif de raccordement de composants et module fonctionnel l'utilisant
US5285018A (en) * 1992-10-02 1994-02-08 International Business Machines Corporation Power and signal distribution in electronic packaging
ATE172837T1 (de) * 1993-02-02 1998-11-15 Ast Research Inc Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
JPH0837351A (ja) * 1994-07-21 1996-02-06 Amp Japan Ltd フレキシブル回路板ハーネス装置及びそれに使用されるフレキシブル回路板
JP3113153B2 (ja) * 1994-07-26 2000-11-27 株式会社東芝 多層配線構造の半導体装置
JP3263705B2 (ja) * 1995-09-21 2002-03-11 三菱電機株式会社 プリント配線板およびフラットパネル・ディスプレイ駆動回路用プリント配線板およびフラットパネル・ディスプレイ装置
JP3062435B2 (ja) * 1995-11-10 2000-07-10 日本碍子株式会社 フレキシブル基板並びにそれに用いるＢｅ−Ｃｕ合金箔およびその製造方法
JPH10303521A (ja) * 1997-04-23 1998-11-13 Hitachi Ltd 伝送線路基板
US6495770B2 (en) * 2000-12-04 2002-12-17 Intel Corporation Electronic assembly providing shunting of electrical current
US20020189854A1 (en) * 2001-04-10 2002-12-19 Crumly William R. Design for long fatigue life in flexible circuits

Also Published As

Publication number Publication date
FI120997B (fi) 2010-05-31
CN1427662A (zh) 2003-07-02
US6737589B2 (en) 2004-05-18
FI20022140A (fi) 2003-06-11
JP4063533B2 (ja) 2008-03-19
KR100496485B1 (ko) 2005-06-22
KR20030047829A (ko) 2003-06-18
JP2003179317A (ja) 2003-06-27
CN1269388C (zh) 2006-08-09
US20030116343A1 (en) 2003-06-26

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