DE60316624D1 - Anlage zum Behandeln von Substraten - Google Patents

Anlage zum Behandeln von Substraten

Info

Publication number
DE60316624D1
DE60316624D1 DE60316624T DE60316624T DE60316624D1 DE 60316624 D1 DE60316624 D1 DE 60316624D1 DE 60316624 T DE60316624 T DE 60316624T DE 60316624 T DE60316624 T DE 60316624T DE 60316624 D1 DE60316624 D1 DE 60316624D1
Authority
DE
Germany
Prior art keywords
vacuum
process chamber
plant
substrates
permitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316624T
Other languages
English (en)
Other versions
DE60316624T2 (de
Inventor
Marinus Franciscus Johan Evers
Peter Brier
Leonardus Peterus Mari Clijsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OTB Solar BV
Original Assignee
OTB Group BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OTB Group BV filed Critical OTB Group BV
Publication of DE60316624D1 publication Critical patent/DE60316624D1/de
Application granted granted Critical
Publication of DE60316624T2 publication Critical patent/DE60316624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60316624T 2002-05-21 2003-05-20 Anlage zum Behandeln von Substraten Expired - Lifetime DE60316624T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1020633 2002-05-21
NL1020633A NL1020633C2 (nl) 2002-05-21 2002-05-21 Samenstel voor het behandelen van substraten.

Publications (2)

Publication Number Publication Date
DE60316624D1 true DE60316624D1 (de) 2007-11-15
DE60316624T2 DE60316624T2 (de) 2008-07-24

Family

ID=29398574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316624T Expired - Lifetime DE60316624T2 (de) 2002-05-21 2003-05-20 Anlage zum Behandeln von Substraten

Country Status (9)

Country Link
US (1) US7351292B2 (de)
EP (1) EP1365040B1 (de)
JP (1) JP4578784B2 (de)
KR (1) KR20030091719A (de)
AT (1) ATE374847T1 (de)
DE (1) DE60316624T2 (de)
ES (1) ES2292901T3 (de)
NL (1) NL1020633C2 (de)
TW (1) TWI248980B (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP4712379B2 (ja) 2002-07-22 2011-06-29 ブルックス オートメーション インコーポレイテッド 基板処理装置
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US8960099B2 (en) 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7354845B2 (en) * 2004-08-24 2008-04-08 Otb Group B.V. In-line process for making thin film electronic devices
KR101032438B1 (ko) * 2004-05-31 2011-05-03 엘지디스플레이 주식회사 액정표시패널의 제조장치
US7297397B2 (en) * 2004-07-26 2007-11-20 Npa Coatings, Inc. Method for applying a decorative metal layer
US7611322B2 (en) * 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
US20060102078A1 (en) * 2004-11-18 2006-05-18 Intevac Inc. Wafer fab
WO2007067030A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating substrates and obtained products
WO2007067031A1 (en) * 2005-12-07 2007-06-14 Otb Group B.V. System and method for coating products, and a product obtained with such a system and method
WO2009060540A1 (ja) * 2007-11-09 2009-05-14 Canon Anelva Corporation インライン型ウェハ搬送装置
CN101441278A (zh) * 2007-11-20 2009-05-27 鸿富锦精密工业（深圳）有限公司 固持装置及固持方法
US20090324368A1 (en) * 2008-06-27 2009-12-31 Applied Materials, Inc. Processing system and method of operating a processing system
NL2001910C (en) * 2008-08-22 2010-03-10 Otb Solar Bv Conveyor assembly and method for conveying a substrate.
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
US8367565B2 (en) * 2008-12-31 2013-02-05 Archers Inc. Methods and systems of transferring, docking and processing substrates
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
US8101054B2 (en) * 2009-05-28 2012-01-24 Wd Media, Inc. Magnetic particle trapper for a disk sputtering system
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
NL2003514C2 (en) 2009-09-18 2011-03-21 Otb Solar Bv Thin film deposition apparatus and method for the same.
US8865259B2 (en) * 2010-04-26 2014-10-21 Singulus Mocvd Gmbh I.Gr. Method and system for inline chemical vapor deposition
NL2006113C2 (en) 2011-02-01 2012-08-02 Otb Solar Bv Water inspection system.
CN103205725A (zh) * 2012-01-17 2013-07-17 上海北玻镀膜技术工业有限公司 单元式溅射抽气模块
JP6243898B2 (ja) 2012-04-19 2017-12-06 インテヴァック インコーポレイテッド 太陽電池製造のための２重マスク装置
SG11201406893XA (en) 2012-04-26 2014-11-27 Intevac Inc System architecture for vacuum processing
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
EP2746201B1 (de) 2012-12-21 2015-09-30 Robert Bosch Gmbh Vorrichtung und Verfahren zur Förderung von Trägern in einer Maschine
EP2746882B1 (de) 2012-12-21 2018-09-05 Robert Bosch Gmbh Fördersystem einer Maschine
EP2746880B1 (de) * 2012-12-21 2018-04-25 Robert Bosch Gmbh Ladungsträgersynchronisierung eines Fördersystems einer Maschine
EP2746200B2 (de) 2012-12-21 2018-09-12 Robert Bosch Gmbh Vorrichtung und Verfahren zur Steuerung von Trägern in einer Maschine
TWI468543B (zh) * 2013-08-30 2015-01-11 Substrate transfer and processing system and substrate transfer and processing methods
TWI468544B (zh) * 2013-08-30 2015-01-11 Substrate transfer and processing system and its equipment
CN106688088B (zh) 2014-08-05 2020-01-10 因特瓦克公司 注入掩膜及对齐
DE102015113962A1 (de) * 2015-08-24 2017-03-02 Meyer Burger (Germany) Ag Substratbehandlungsvorrichtung
US9862006B2 (en) 2015-12-29 2018-01-09 Solarcity Corporation Systems for levitating a metallic tray
KR102531483B1 (ko) 2018-10-04 2023-05-10 어플라이드 머티어리얼스, 인코포레이티드 이송 시스템
US11521870B2 (en) * 2020-07-08 2022-12-06 Applied Materials, Inc. Annealing chamber

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3521765A (en) * 1967-10-31 1970-07-28 Western Electric Co Closed-end machine for processing articles in a controlled atmosphere
US4042128A (en) * 1975-11-26 1977-08-16 Airco, Inc. Substrate transfer apparatus for a vacuum coating system
US4624617A (en) * 1984-10-09 1986-11-25 David Belna Linear induction semiconductor wafer transportation apparatus
JPH0312057Y2 (de) * 1985-06-25 1991-03-22
JPH07115315B2 (ja) * 1987-01-09 1995-12-13 日本真空技術株式会社 磁気浮上式搬送マニピユレ−タ
JPH0676661B2 (ja) * 1988-04-21 1994-09-28 日電アネルバ株式会社 縦トイレ搬送式スパッタ装置
JP2620704B2 (ja) * 1988-04-26 1997-06-18 セイコー精機株式会社 磁気浮上搬送装置
EP0346815A3 (de) * 1988-06-13 1990-12-19 Asahi Glass Company Ltd. Vakuumbehandlungsvorrichtung und deren Transportsystem
JPH0762252B2 (ja) * 1988-06-13 1995-07-05 旭硝子株式会社 真空処理装置
JPH07435Y2 (ja) * 1988-10-11 1995-01-11 旭硝子株式会社 真空処理炉の搬送装置
JP2948842B2 (ja) * 1989-11-24 1999-09-13 日本真空技術株式会社 インライン型ｃｖｄ装置
JPH0446781A (ja) * 1990-06-11 1992-02-17 Seiko Instr Inc 真空内磁気浮上搬送ロボット
JP2858275B2 (ja) * 1990-12-28 1999-02-17 セイコー精機株式会社 搬送装置
JPH0623687A (ja) * 1992-02-21 1994-02-01 Ebara Corp ロボット
US5474611A (en) * 1992-05-20 1995-12-12 Yoichi Murayama, Shincron Co., Ltd. Plasma vapor deposition apparatus
EP0648698B1 (de) * 1992-07-07 1998-01-07 Ebara Corporation Durch magnetische wirkung schwebende transportvorrichtung
JPH06179524A (ja) * 1992-07-18 1994-06-28 Ebara Corp 磁気浮上真空搬送装置
US5881649A (en) * 1996-08-13 1999-03-16 Anelva Corporation Magnetic transfer system, power transmission mechanism of the magnetic transfer system, and rotational driving member used for the system
JPH11293459A (ja) * 1998-04-07 1999-10-26 Murata Mfg Co Ltd 多層成膜装置
JPH11310887A (ja) * 1998-04-27 1999-11-09 Kyocera Corp 反応性イオンエッチング装置
WO2001006030A1 (en) * 1999-07-19 2001-01-25 Young Park High throughput thin film deposition for optical disk processing
US6336999B1 (en) * 2000-10-11 2002-01-08 Centre Luxembourgeois De Recherches Pour Le Verre Et Al Ceramique S.A. (C.R.V.C.) Apparatus for sputter-coating glass and corresponding method
DE20100639U1 (de) * 2001-01-12 2001-04-19 Zimmer Guenther Stephan Schienengeführte Fertigungs- und Positioniereinrichtung zur Verbindung von mehreren Bearbeitungsstationen über eine Transportvorrichtung

Also Published As

Publication number Publication date
ATE374847T1 (de) 2007-10-15
DE60316624T2 (de) 2008-07-24
NL1020633C2 (nl) 2003-11-24
JP4578784B2 (ja) 2010-11-10
TWI248980B (en) 2006-02-11
EP1365040B1 (de) 2007-10-03
US7351292B2 (en) 2008-04-01
TW200401046A (en) 2004-01-16
JP2004040089A (ja) 2004-02-05
KR20030091719A (ko) 2003-12-03
US20040049308A1 (en) 2004-03-11
ES2292901T3 (es) 2008-03-16
EP1365040A1 (de) 2003-11-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: OTB SOLAR B.V., EINDHOVEN, NL