DE60302700D1 - Amino-Gruppen enthaltende Phenolderivate - Google Patents

Amino-Gruppen enthaltende Phenolderivate

Info

Publication number
DE60302700D1
DE60302700D1 DE60302700T DE60302700T DE60302700D1 DE 60302700 D1 DE60302700 D1 DE 60302700D1 DE 60302700 T DE60302700 T DE 60302700T DE 60302700 T DE60302700 T DE 60302700T DE 60302700 D1 DE60302700 D1 DE 60302700D1
Authority
DE
Germany
Prior art keywords
amino group
containing phenol
phenol derivatives
derivatives
amino
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60302700T
Other languages
English (en)
Other versions
DE60302700T2 (de
Inventor
Takeshi Tsuihiji
Michiyasu Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gun Ei Chemical Industry Co Ltd
Original Assignee
Gun Ei Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gun Ei Chemical Industry Co Ltd filed Critical Gun Ei Chemical Industry Co Ltd
Publication of DE60302700D1 publication Critical patent/DE60302700D1/de
Application granted granted Critical
Publication of DE60302700T2 publication Critical patent/DE60302700T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/78—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C217/80—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings
    • C07C217/82—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings of the same non-condensed six-membered aromatic ring
    • C07C217/90—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings of the same non-condensed six-membered aromatic ring the oxygen atom of at least one of the etherified hydroxy groups being further bound to a carbon atom of a six-membered aromatic ring, e.g. amino-diphenylethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C215/00—Compounds containing amino and hydroxy groups bound to the same carbon skeleton
    • C07C215/74—Compounds containing amino and hydroxy groups bound to the same carbon skeleton having hydroxy groups and amino groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/78—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C217/80—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton having amino groups and etherified hydroxy groups bound to carbon atoms of non-condensed six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C229/00—Compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C229/52—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
DE60302700T 2002-05-07 2003-01-06 Amino-Gruppen enthaltende Phenolderivate Expired - Lifetime DE60302700T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002131686 2002-05-07
JP2002131686A JP4084597B2 (ja) 2002-05-07 2002-05-07 アミノ基含有フェノール誘導体

Publications (2)

Publication Number Publication Date
DE60302700D1 true DE60302700D1 (de) 2006-01-19
DE60302700T2 DE60302700T2 (de) 2006-07-06

Family

ID=29244026

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60302700T Expired - Lifetime DE60302700T2 (de) 2002-05-07 2003-01-06 Amino-Gruppen enthaltende Phenolderivate

Country Status (6)

Country Link
US (2) US7087799B2 (de)
EP (1) EP1361208B1 (de)
JP (1) JP4084597B2 (de)
KR (1) KR100872778B1 (de)
DE (1) DE60302700T2 (de)
TW (1) TWI272265B (de)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
US20060128939A1 (en) * 2004-12-03 2006-06-15 Vijayendra Kumar One pot process for making polymeric antioxidants
WO2006064867A1 (ja) * 2004-12-16 2006-06-22 Nippon Kayaku Kabushiki Kaisha 不飽和基含有ポリイミド樹脂、それを含有する感光性樹脂組成物及びその硬化物
WO2006123150A1 (en) * 2005-05-20 2006-11-23 Bp Chemicals Limited Process for the conversion of synthesis gas to oxygenates
GB0510356D0 (en) * 2005-05-20 2005-06-29 Bp Chem Int Ltd Process for the conversion of synthesis gas to oxygenate
WO2006123158A2 (en) * 2005-05-20 2006-11-23 Bp Chemicals Limited Process for the conversion of synthesis gas to oxygenates
US20080200084A1 (en) * 2007-02-16 2008-08-21 Angus Richard O Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP5462559B2 (ja) * 2009-09-08 2014-04-02 新日鉄住金化学株式会社 多価ヒドロキシ化合物、それらの製造方法及びエポキシ樹脂組成物並びにその硬化物
US8465902B2 (en) * 2011-02-08 2013-06-18 Az Electronic Materials Usa Corp. Underlayer coating composition and processes thereof
FR2994971B1 (fr) * 2012-08-28 2016-01-08 Univ Paris Sud Xi Procede de preparation a hauts rendements de p-(r)calixarenes geants
FR2994970B1 (fr) 2012-08-28 2015-12-18 Univ Paris Sud Xi Procede de preparation a hauts rendements de p-(r-oxy)calix[9-20] arenes
WO2015077635A2 (en) 2013-11-22 2015-05-28 Polnox Corporation Macromolecular antioxidants based on dual type moiety per molecule: structures methods of making and using the same
JP6220695B2 (ja) 2014-02-18 2017-10-25 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、感活性光線性又は感放射線性膜を備えたマスクブランクス、パターン形成方法及び電子デバイスの製造方法
KR102254650B1 (ko) * 2015-01-28 2021-05-24 삼성디스플레이 주식회사 표시장치
JP6195018B2 (ja) * 2015-03-27 2017-09-13 東レ株式会社 ジアミン化合物に由来する構造を有する耐熱性樹脂または耐熱性樹脂前駆体
CN105820338A (zh) * 2016-04-25 2016-08-03 全球能源互联网研究院 一种聚酰亚胺及其制备方法
JP6950686B2 (ja) * 2016-06-03 2021-10-13 Dic株式会社 多環芳香族アミノフェノール化合物および樹脂組成物の製造方法、並びに前記多環芳香族アミノフェノール化合物、樹脂組成物、および硬化物
US20180251695A1 (en) 2017-03-01 2018-09-06 Polnox Corporation Macromolecular Corrosion (McIn) Inhibitors: Structures, Methods Of Making And Using The Same
JP7271461B2 (ja) * 2020-02-19 2023-05-11 信越化学工業株式会社 有機膜形成用材料およびパターン形成方法
WO2023032648A1 (ja) * 2021-08-30 2023-03-09 三井化学株式会社 ポリアミド酸ワニスおよびポリアミド酸ワニスの製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2819176B2 (ja) * 1990-01-25 1998-10-30 チッソ株式会社 ジアミノ化合物及びその中間体
JPH05255480A (ja) * 1992-03-16 1993-10-05 Toshiba Chem Corp エポキシ変性ポリイミド樹脂及び耐熱性積層板
JPH06345866A (ja) * 1993-06-14 1994-12-20 Nippon Steel Corp シロキサン変性ポリイミド樹脂
JP3207352B2 (ja) 1996-05-13 2001-09-10 住友ベークライト株式会社 ポジ型感光性樹脂組成物
TW502135B (en) * 1996-05-13 2002-09-11 Sumitomo Bakelite Co Positive type photosensitive resin composition and process for preparing polybenzoxazole resin film by using the same
JP3662341B2 (ja) * 1996-05-20 2005-06-22 富士写真フイルム株式会社 ポジ型感光性組成物
JPH10316636A (ja) 1997-05-15 1998-12-02 Mitsui Chem Inc ジアミン化合物およびその製造方法
JPH1195448A (ja) 1997-09-24 1999-04-09 Asahi Chem Ind Co Ltd 感光性樹脂組成物の現像方法
JP2002167367A (ja) * 2000-12-01 2002-06-11 Gun Ei Chem Ind Co Ltd アミノ基含有フェノール誘導体
JP4174248B2 (ja) * 2002-07-01 2008-10-29 群栄化学工業株式会社 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP4174274B2 (ja) * 2002-09-03 2008-10-29 群栄化学工業株式会社 ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP4178011B2 (ja) * 2002-09-03 2008-11-12 群栄化学工業株式会社 ポジ型感光性樹脂組成物
US7094844B2 (en) * 2002-09-13 2006-08-22 Shin-Etsu Chemical Co., Ltd. Liquid epoxy resin composition and semiconductor device
JP4221585B2 (ja) * 2002-09-13 2009-02-12 信越化学工業株式会社 液状エポキシ樹脂組成物及び半導体装置
EP1408067B1 (de) * 2002-10-10 2005-12-21 Shin-Etsu Chemical Company, Ltd. Farbloses und transparentes Polyimidsiloxanharz mit wärmehärtenden funktionellen Gruppen
JP4219660B2 (ja) * 2002-11-18 2009-02-04 信越化学工業株式会社 ウエハダイシング・ダイボンドシート

Also Published As

Publication number Publication date
US20050197482A1 (en) 2005-09-08
US7087799B2 (en) 2006-08-08
KR100872778B1 (ko) 2008-12-09
KR20030087519A (ko) 2003-11-14
JP2003327646A (ja) 2003-11-19
EP1361208B1 (de) 2005-12-14
TW200306295A (en) 2003-11-16
TWI272265B (en) 2007-02-01
DE60302700T2 (de) 2006-07-06
JP4084597B2 (ja) 2008-04-30
US7019045B2 (en) 2006-03-28
EP1361208A1 (de) 2003-11-12
US20030215734A1 (en) 2003-11-20

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