DE60229760D1 - Verbesserte methode zur abdichtung für oleds - Google Patents

Verbesserte methode zur abdichtung für oleds

Info

Publication number
DE60229760D1
DE60229760D1 DE60229760T DE60229760T DE60229760D1 DE 60229760 D1 DE60229760 D1 DE 60229760D1 DE 60229760 T DE60229760 T DE 60229760T DE 60229760 T DE60229760 T DE 60229760T DE 60229760 D1 DE60229760 D1 DE 60229760D1
Authority
DE
Germany
Prior art keywords
improved method
oleds
sealing
sealing oleds
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60229760T
Other languages
English (en)
Inventor
Hong Yee Low
Ewald Karl Guenther
Soo Jin Chua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Institute of Materials Research and Engineering
Original Assignee
Osram Opto Semiconductors GmbH
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH, Institute of Materials Research and Engineering filed Critical Osram Opto Semiconductors GmbH
Application granted granted Critical
Publication of DE60229760D1 publication Critical patent/DE60229760D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
DE60229760T 2001-09-28 2002-09-24 Verbesserte methode zur abdichtung für oleds Expired - Lifetime DE60229760D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/968,164 US6933537B2 (en) 2001-09-28 2001-09-28 Sealing for OLED devices
PCT/EP2002/010698 WO2003030275A1 (en) 2001-09-28 2002-09-24 Improved sealing for oled devices

Publications (1)

Publication Number Publication Date
DE60229760D1 true DE60229760D1 (de) 2008-12-18

Family

ID=25513841

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60229760T Expired - Lifetime DE60229760D1 (de) 2001-09-28 2002-09-24 Verbesserte methode zur abdichtung für oleds

Country Status (7)

Country Link
US (1) US6933537B2 (de)
EP (1) EP1430551B1 (de)
JP (1) JP2005505141A (de)
CN (1) CN100407475C (de)
DE (1) DE60229760D1 (de)
TW (1) TW560220B (de)
WO (1) WO2003030275A1 (de)

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US11198270B2 (en) 2008-12-30 2021-12-14 Nanosys, Inc. Quantum dot films, lighting devices, and lighting methods
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JP5227834B2 (ja) * 2009-02-23 2013-07-03 トレックス・セミコンダクター株式会社 機能素子パッケージの製造方法
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US8362609B1 (en) 2009-10-27 2013-01-29 Xilinx, Inc. Integrated circuit package and method of forming an integrated circuit package
KR101135542B1 (ko) * 2009-11-30 2012-04-17 삼성모바일디스플레이주식회사 유기전계 발광표시장치
JP5409315B2 (ja) * 2009-12-11 2014-02-05 キヤノン株式会社 表示装置
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8810028B1 (en) 2010-06-30 2014-08-19 Xilinx, Inc. Integrated circuit packaging devices and methods
US9188323B2 (en) * 2010-10-20 2015-11-17 Semiconductor Energy Laboratory Co., Ltd. Lighting device
KR20200039806A (ko) 2010-11-10 2020-04-16 나노시스, 인크. 양자 도트 필름들, 조명 디바이스들, 및 조명 방법들
CN102709479B (zh) * 2011-05-06 2015-08-19 京东方科技集团股份有限公司 Oled器件的封装结构及封装方法
US9768414B2 (en) 2013-02-18 2017-09-19 Innolux Corporation Display device
TWI505460B (zh) * 2013-02-18 2015-10-21 Innolux Corp 有機發光二極體顯示裝置及其製造方法
US9368748B2 (en) * 2013-05-09 2016-06-14 Shenzhen China Star Optoelectronics Technology Co., Ltd. Display device and manufacturing method thereof
CN103325958A (zh) * 2013-06-19 2013-09-25 京东方科技集团股份有限公司 有机电致发光器件封装盖板、有机电致发光器件及显示器
CN103474561B (zh) * 2013-09-10 2016-08-10 京东方科技集团股份有限公司 一种oled器件的封装结构
US9330999B2 (en) * 2014-06-05 2016-05-03 Intel Corporation Multi-component integrated heat spreader for multi-chip packages
US9570712B2 (en) 2014-07-31 2017-02-14 Industrial Technology Research Institute Organic light-emitting module
CN104393187B (zh) * 2014-11-17 2018-09-11 合肥鑫晟光电科技有限公司 一种封装基板及其制备方法、oled显示装置
KR102334393B1 (ko) * 2014-11-26 2021-12-01 삼성디스플레이 주식회사 표시 장치
CN106784351A (zh) * 2016-12-27 2017-05-31 固安翌光科技有限公司 一种封装板、封装结构及有机光电器件
CN107359275B (zh) * 2017-07-27 2019-06-07 京东方科技集团股份有限公司 一种柔性显示器件
CN108321173A (zh) * 2018-01-30 2018-07-24 上海瀚莅电子科技有限公司 微型oled显示装置及其制作方法
CN109585679A (zh) * 2018-11-30 2019-04-05 云谷（固安）科技有限公司 显示面板及其制备方法
CN111245385A (zh) * 2019-12-04 2020-06-05 天津大学 芯片封装模块及封装方法及具有该模块的电子装置
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Also Published As

Publication number Publication date
EP1430551B1 (de) 2008-11-05
EP1430551A1 (de) 2004-06-23
US20030062533A1 (en) 2003-04-03
WO2003030275A1 (en) 2003-04-10
TW560220B (en) 2003-11-01
US6933537B2 (en) 2005-08-23
CN1561551A (zh) 2005-01-05
JP2005505141A (ja) 2005-02-17
CN100407475C (zh) 2008-07-30

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