DE60220687D1 - Ungesintertes niedertemperaturglaskeramikband für elektronische mikrobauteile, verfahren zur herstellung und verwendung - Google Patents
Ungesintertes niedertemperaturglaskeramikband für elektronische mikrobauteile, verfahren zur herstellung und verwendungInfo
- Publication number
- DE60220687D1 DE60220687D1 DE60220687T DE60220687T DE60220687D1 DE 60220687 D1 DE60220687 D1 DE 60220687D1 DE 60220687 T DE60220687 T DE 60220687T DE 60220687 T DE60220687 T DE 60220687T DE 60220687 D1 DE60220687 D1 DE 60220687D1
- Authority
- DE
- Germany
- Prior art keywords
- low temperature
- ceramic
- self
- tape
- microbuilts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
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Applications Claiming Priority (5)
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PCT/US2002/031141 WO2003029166A2 (en) | 2001-10-01 | 2002-10-01 | Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same |
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DE60220687D1 true DE60220687D1 (de) | 2007-07-26 |
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DE10104574A1 (de) * | 2001-02-01 | 2002-08-08 | Epcos Ag | Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung |
JP2002368422A (ja) * | 2001-04-04 | 2002-12-20 | Murata Mfg Co Ltd | 多層セラミック基板及びその製造方法 |
DE60220687T2 (de) * | 2001-10-01 | 2007-12-27 | Heraeus, Inc. | Ungesintertes niedertemperaturglaskeramikband für elektronische mikrobauteile, verfahren zur herstellung und verwendung |
US6827800B2 (en) * | 2003-01-30 | 2004-12-07 | E. I. Du Pont De Nemours And Company | Process for the constrained sintering of asymmetrically configured dielectric layers |
JP4426805B2 (ja) | 2002-11-11 | 2010-03-03 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
EP1531041A1 (de) * | 2003-11-12 | 2005-05-18 | Universita degli Studi di Trento | Keramisches Vielschicht-Laminate mit hoher Zuverlässigkeit, dessen Herstellungs- und Designverfahren |
US7360991B2 (en) * | 2004-06-09 | 2008-04-22 | General Electric Company | Methods and apparatus for fabricating gas turbine engines |
JP4574369B2 (ja) * | 2004-08-26 | 2010-11-04 | 京セラ株式会社 | 配線基板およびその製造方法 |
US7687137B2 (en) * | 2005-02-28 | 2010-03-30 | Kyocera Corporation | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor |
US7575709B2 (en) * | 2005-04-19 | 2009-08-18 | Los Alamos National Security, Llc | Tape-cast sensors and method of making |
US20060231420A1 (en) * | 2005-04-19 | 2006-10-19 | The Regents Of The University Of California | Explosives detection sensor |
DE102005021131A1 (de) * | 2005-05-06 | 2006-11-09 | Robert Bosch Gmbh | Sensorelement für Gassensoren |
WO2007004415A1 (ja) * | 2005-07-01 | 2007-01-11 | Murata Manufacturing Co., Ltd. | 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート |
JP4557002B2 (ja) * | 2005-07-01 | 2010-10-06 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法ならびに多層セラミック基板作製用複合グリーンシート |
US20070060970A1 (en) | 2005-09-15 | 2007-03-15 | Burdon Jeremy W | Miniaturized co-fired electrical interconnects for implantable medical devices |
KR100710459B1 (ko) * | 2006-02-24 | 2007-04-24 | 요업기술원 | 희생글래스층을 포함하는 무수축 저온동시소성세라믹쉬트의 제조 방법 및, 이것을 이용한 전자세라믹스 모듈 |
JP4994052B2 (ja) * | 2006-03-28 | 2012-08-08 | 京セラ株式会社 | 基板およびこれを用いた回路基板 |
ATE528269T1 (de) * | 2006-08-18 | 2011-10-15 | Murata Manufacturing Co | Verfahren zur herstellung von keramikformkörpern |
US20080079779A1 (en) * | 2006-09-28 | 2008-04-03 | Robert Lee Cornell | Method for Improving Thermal Conductivity in Micro-Fluid Ejection Heads |
WO2008050757A1 (fr) * | 2006-10-24 | 2008-05-02 | Murata Manufacturing Co., Ltd. | Composition de bouillie pour feuille de céramique crue et son procédé de fabrication, et composant électronique céramique multicouches et son procédé de fabrication |
WO2009002355A1 (en) * | 2007-06-25 | 2008-12-31 | Second Sight Medical Products, Inc. | Method for providing hermetic electrical feedthrough |
KR20090051634A (ko) * | 2007-11-19 | 2009-05-22 | 삼성전자주식회사 | 캐패시터 및 그 제조 방법 |
US8020314B2 (en) * | 2008-10-31 | 2011-09-20 | Corning Incorporated | Methods and apparatus for drying ceramic green bodies with microwaves |
JP5994575B2 (ja) * | 2012-10-31 | 2016-09-21 | 日本電気硝子株式会社 | 波長変換部材の製造方法及び波長変換部材 |
CN103456646B (zh) * | 2013-09-05 | 2016-06-15 | 中国电子科技集团公司第十研究所 | 多层低温共烧陶瓷基板集成液冷循环通道的制备方法 |
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2002
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- 2002-10-01 JP JP2003532422A patent/JP4160901B2/ja not_active Expired - Fee Related
- 2002-10-01 EP EP02763813A patent/EP1432664B1/de not_active Expired - Lifetime
- 2002-10-01 WO PCT/US2002/031141 patent/WO2003029166A2/en active IP Right Grant
- 2002-10-01 US US10/262,362 patent/US6743534B2/en not_active Expired - Lifetime
- 2002-10-01 AT AT02763813T patent/ATE364584T1/de active
- 2002-10-01 AU AU2002327799A patent/AU2002327799A1/en not_active Abandoned
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2004
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WO2003029166A2 (en) | 2003-04-10 |
US20030087136A1 (en) | 2003-05-08 |
DE60220687T2 (de) | 2007-12-27 |
AU2002327799A1 (en) | 2003-04-14 |
WO2003029166A3 (en) | 2003-11-06 |
US6949156B2 (en) | 2005-09-27 |
ATE364584T1 (de) | 2007-07-15 |
US20040159390A1 (en) | 2004-08-19 |
US6743534B2 (en) | 2004-06-01 |
JP4160901B2 (ja) | 2008-10-08 |
JP2005504656A (ja) | 2005-02-17 |
EP1432664B1 (de) | 2007-06-13 |
EP1432664A2 (de) | 2004-06-30 |
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