DE60219229D1 - Herstellungsverfahren für Verbindungshalbleiterlaser - Google Patents

Herstellungsverfahren für Verbindungshalbleiterlaser

Info

Publication number
DE60219229D1
DE60219229D1 DE60219229T DE60219229T DE60219229D1 DE 60219229 D1 DE60219229 D1 DE 60219229D1 DE 60219229 T DE60219229 T DE 60219229T DE 60219229 T DE60219229 T DE 60219229T DE 60219229 D1 DE60219229 D1 DE 60219229D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor laser
compound semiconductor
compound
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60219229T
Other languages
English (en)
Inventor
Katsumi Sugiura
Chikashi Anayama
Akira Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Device Innovations Inc
Original Assignee
Sumitomo Electric Device Innovations Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Device Innovations Inc filed Critical Sumitomo Electric Device Innovations Inc
Application granted granted Critical
Publication of DE60219229D1 publication Critical patent/DE60219229D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2258Diffusion into or out of AIIIBV compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • H01S5/162Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions made by diffusion or disordening of the active layer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Recrystallisation Techniques (AREA)
DE60219229T 2001-01-19 2002-01-16 Herstellungsverfahren für Verbindungshalbleiterlaser Expired - Lifetime DE60219229D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001011885A JP3719705B2 (ja) 2001-01-19 2001-01-19 化合物半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE60219229D1 true DE60219229D1 (de) 2007-05-16

Family

ID=18878969

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60219229T Expired - Lifetime DE60219229D1 (de) 2001-01-19 2002-01-16 Herstellungsverfahren für Verbindungshalbleiterlaser

Country Status (4)

Country Link
US (1) US6686217B2 (de)
EP (1) EP1233492B1 (de)
JP (1) JP3719705B2 (de)
DE (1) DE60219229D1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4309636B2 (ja) * 2002-10-17 2009-08-05 三菱電機株式会社 半導体レーザおよび光通信用素子
JP2010199520A (ja) * 2009-02-27 2010-09-09 Renesas Electronics Corp 半導体レーザ及び半導体レーザの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2752423B2 (ja) * 1989-03-31 1998-05-18 三菱電機株式会社 化合物半導体へのZn拡散方法
JPH03126283A (ja) * 1989-10-11 1991-05-29 Toshiba Corp 窓構造半導体レーザ素子の製造方法
JPH0582463A (ja) * 1991-03-25 1993-04-02 Mitsubishi Electric Corp P形不純物の拡散方法及び半導体レーザ
JPH0629621A (ja) * 1992-07-09 1994-02-04 Mitsubishi Electric Corp 半導体レーザ装置
JP2956869B2 (ja) * 1993-08-30 1999-10-04 富士通株式会社 半導体レーザおよびその製造方法
JP3718952B2 (ja) * 1997-04-15 2005-11-24 三菱電機株式会社 半導体レーザ
US6503421B1 (en) 2000-11-01 2003-01-07 Corning Incorporated All polymer process compatible optical polymer material
US6801703B2 (en) 2001-08-08 2004-10-05 Photon-X, Llc Freestanding athermal polymer optical waveguide

Also Published As

Publication number Publication date
JP2002217490A (ja) 2002-08-02
EP1233492B1 (de) 2007-04-04
EP1233492A3 (de) 2005-02-16
JP3719705B2 (ja) 2005-11-24
US6686217B2 (en) 2004-02-03
US20020098666A1 (en) 2002-07-25
EP1233492A2 (de) 2002-08-21

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Legal Events

Date Code Title Description
8332 No legal effect for de