DE60123576D1 - Halbleiterlaserherstellungsverfahren - Google Patents
HalbleiterlaserherstellungsverfahrenInfo
- Publication number
- DE60123576D1 DE60123576D1 DE60123576T DE60123576T DE60123576D1 DE 60123576 D1 DE60123576 D1 DE 60123576D1 DE 60123576 T DE60123576 T DE 60123576T DE 60123576 T DE60123576 T DE 60123576T DE 60123576 D1 DE60123576 D1 DE 60123576D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor laser
- laser process
- semiconductor
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000251684 | 2000-08-22 | ||
JP2000251684 | 2000-08-22 | ||
PCT/JP2001/007174 WO2002017450A1 (fr) | 2000-08-22 | 2001-08-22 | Procede de fabrication de dispositif laser a semiconducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60123576D1 true DE60123576D1 (de) | 2006-11-16 |
DE60123576T2 DE60123576T2 (de) | 2007-05-31 |
Family
ID=18741050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60123576T Expired - Lifetime DE60123576T2 (de) | 2000-08-22 | 2001-08-22 | Halbleiterlaserherstellungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (1) | US6703254B2 (de) |
EP (1) | EP1251608B1 (de) |
JP (1) | JP4275405B2 (de) |
CN (1) | CN1206782C (de) |
DE (1) | DE60123576T2 (de) |
WO (1) | WO2002017450A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10061265A1 (de) * | 2000-12-06 | 2002-06-27 | Jenoptik Jena Gmbh | Diodenlaseranordnung |
JP4178022B2 (ja) * | 2002-12-10 | 2008-11-12 | シャープ株式会社 | 半導体レーザ素子およびその製造方法、並びに、その製造方法に用いる治具 |
JP4128898B2 (ja) * | 2003-04-18 | 2008-07-30 | 古河電気工業株式会社 | 半導体素子の製造方法 |
US20090135873A1 (en) * | 2005-03-31 | 2009-05-28 | Sanyo Electric Co., Ltd. | Process for producing gallium nitride-based compound semiconductor laser element and gallium nitride-based compound semiconductor laser element |
DE102005045954A1 (de) * | 2005-09-26 | 2007-04-19 | Gkss-Forschungszentrum Geesthacht Gmbh | Verfahren und Vorrichtung zum Herstellen einer Schweißverbindung zwischen den Oberflächen zweier flächiger Werkstücke |
JP2007287738A (ja) * | 2006-04-12 | 2007-11-01 | Sharp Corp | 半導体レーザ装置およびその製造方法、ならびに該半導体レーザ装置を用いた光伝送モジュールおよび光ディスク装置 |
US8277877B1 (en) * | 2006-05-15 | 2012-10-02 | Finisar Corporation | Method for applying protective laser facet coatings |
JP5463017B2 (ja) * | 2007-09-21 | 2014-04-09 | 株式会社半導体エネルギー研究所 | 基板の作製方法 |
JP2009164499A (ja) * | 2008-01-10 | 2009-07-23 | Mitsubishi Electric Corp | 端面処理用治具およびそれを用いる半導体レーザ装置の製造方法 |
SG160302A1 (en) * | 2008-09-29 | 2010-04-29 | Semiconductor Energy Lab | Method for manufacturing semiconductor substrate |
DE102009023467B4 (de) * | 2009-06-02 | 2011-05-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Beschichtungsanlage und -verfahren |
JP6010279B2 (ja) * | 2011-04-08 | 2016-10-19 | 信越化学工業株式会社 | 非水電解質二次電池用負極活物質の製造方法 |
CN106505408B (zh) * | 2016-11-01 | 2019-02-15 | 北京科技大学 | 脊条形半导体激光器有源区腔体侧壁钝化的优化方法 |
CN112687594B (zh) * | 2021-03-11 | 2021-06-18 | 度亘激光技术(苏州)有限公司 | 半导体器件解理装置及解理方法 |
JP2022150208A (ja) * | 2021-03-26 | 2022-10-07 | 古河電気工業株式会社 | 半導体レーザ素子および半導体レーザ素子の製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5428072B2 (de) | 1972-07-20 | 1979-09-13 | ||
US4331737A (en) * | 1978-04-01 | 1982-05-25 | Zaidan Hojin Handotai Kenkyu Shinkokai | Oxynitride film and its manufacturing method |
JPS56162841A (en) | 1980-05-20 | 1981-12-15 | Nippon Telegr & Teleph Corp <Ntt> | Forming method for insulating film of compound semiconductor |
JPS58125832A (ja) | 1982-01-22 | 1983-07-27 | Hitachi Ltd | 3−5族化合物半導体のパツシベ−シヨン法 |
JP2841535B2 (ja) | 1989-08-31 | 1998-12-24 | 日本電気株式会社 | 半導体レーザおよびその製造方法 |
US5144634A (en) * | 1989-09-07 | 1992-09-01 | International Business Machines Corporation | Method for mirror passivation of semiconductor laser diodes |
CA2138912C (en) | 1993-12-24 | 1999-05-04 | Shoji Ishizaka | Semiconductor laser device |
JPH0964453A (ja) | 1995-08-22 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 半導体レーザの製造方法 |
FR2742926B1 (fr) * | 1995-12-22 | 1998-02-06 | Alsthom Cge Alcatel | Procede et dispositif de preparation de faces de laser |
US5834379A (en) * | 1996-07-16 | 1998-11-10 | Cornell Research Foundation, Inc. | Process for synthesis of cubic GaN on GaAs using NH3 in an RF plasma process |
US5668049A (en) * | 1996-07-31 | 1997-09-16 | Lucent Technologies Inc. | Method of making a GaAs-based laser comprising a facet coating with gas phase sulphur |
JPH10209562A (ja) | 1997-01-24 | 1998-08-07 | Nec Corp | 半導体レーザ素子の製造方法 |
US5851849A (en) * | 1997-05-22 | 1998-12-22 | Lucent Technologies Inc. | Process for passivating semiconductor laser structures with severe steps in surface topography |
US6734111B2 (en) * | 2001-08-09 | 2004-05-11 | Comlase Ab | Method to GaAs based lasers and a GaAs based laser |
-
2001
- 2001-08-22 EP EP01958389A patent/EP1251608B1/de not_active Expired - Lifetime
- 2001-08-22 DE DE60123576T patent/DE60123576T2/de not_active Expired - Lifetime
- 2001-08-22 CN CN01803280.XA patent/CN1206782C/zh not_active Expired - Fee Related
- 2001-08-22 US US10/111,280 patent/US6703254B2/en not_active Expired - Lifetime
- 2001-08-22 WO PCT/JP2001/007174 patent/WO2002017450A1/ja active IP Right Grant
- 2001-08-22 JP JP2002522036A patent/JP4275405B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6703254B2 (en) | 2004-03-09 |
EP1251608A4 (de) | 2005-07-27 |
EP1251608A1 (de) | 2002-10-23 |
DE60123576T2 (de) | 2007-05-31 |
EP1251608B1 (de) | 2006-10-04 |
WO2002017450A1 (fr) | 2002-02-28 |
JP4275405B2 (ja) | 2009-06-10 |
CN1206782C (zh) | 2005-06-15 |
CN1394371A (zh) | 2003-01-29 |
US20020155631A1 (en) | 2002-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |