DE602006020520D1 - Behälter für einzelne dünne Platten und darin verwendete stoßabsorbierende Stützglieder - Google Patents
Behälter für einzelne dünne Platten und darin verwendete stoßabsorbierende StützgliederInfo
- Publication number
- DE602006020520D1 DE602006020520D1 DE602006020520T DE602006020520T DE602006020520D1 DE 602006020520 D1 DE602006020520 D1 DE 602006020520D1 DE 602006020520 T DE602006020520 T DE 602006020520T DE 602006020520 T DE602006020520 T DE 602006020520T DE 602006020520 D1 DE602006020520 D1 DE 602006020520D1
- Authority
- DE
- Germany
- Prior art keywords
- container
- support members
- shock absorbing
- thin plates
- members used
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Stackable Containers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005152828A JP4644035B2 (ja) | 2005-05-25 | 2005-05-25 | 枚葉収納容器 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006020520D1 true DE602006020520D1 (de) | 2011-04-21 |
Family
ID=36954756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006020520T Active DE602006020520D1 (de) | 2005-05-25 | 2006-05-17 | Behälter für einzelne dünne Platten und darin verwendete stoßabsorbierende Stützglieder |
Country Status (7)
Country | Link |
---|---|
US (1) | US7624870B2 (de) |
EP (1) | EP1727193B1 (de) |
JP (1) | JP4644035B2 (de) |
KR (1) | KR101258419B1 (de) |
CN (1) | CN1868830B (de) |
DE (1) | DE602006020520D1 (de) |
TW (1) | TWI393208B (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4789566B2 (ja) * | 2005-09-30 | 2011-10-12 | ミライアル株式会社 | 薄板保持容器及び薄板保持容器用処理装置 |
JP5642377B2 (ja) * | 2009-11-30 | 2014-12-17 | 株式会社住化分析センター | 基板収納容器および当該容器を搬送するための搬送容器 |
JP5470460B2 (ja) * | 2010-07-27 | 2014-04-16 | 株式会社アルバック | 基板搬送方法および基板搬送システム |
US9966293B2 (en) * | 2014-09-19 | 2018-05-08 | Infineon Technologies Ag | Wafer arrangement and method for processing a wafer |
US10153187B2 (en) * | 2014-11-11 | 2018-12-11 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate |
JP6990873B2 (ja) * | 2017-03-31 | 2022-02-03 | アキレス株式会社 | 半導体ウェハ容器 |
US10818530B1 (en) * | 2017-08-30 | 2020-10-27 | Murata Machinery, Ltd. | Substrate carriers with isolation membrane |
CN108039336B (zh) * | 2017-11-23 | 2024-02-20 | 中国电子科技集团公司第五十五研究所 | 一种石墨舟对中装置 |
TWI781800B (zh) * | 2021-10-22 | 2022-10-21 | 銓發科技股份有限公司 | 束帶儲存裝置及其儲存盤 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3615006A (en) * | 1969-06-26 | 1971-10-26 | Ibm | Storage container |
US4194822A (en) * | 1978-08-04 | 1980-03-25 | Eastman Kodak Company | Photographic film cartridge assembly and camera |
US4208117A (en) * | 1978-10-04 | 1980-06-17 | Eastman Kodak Company | Film packet |
JPS5817383U (ja) * | 1981-07-24 | 1983-02-02 | 昭和電工株式会社 | ウエハ−容器 |
US4748530A (en) * | 1983-01-24 | 1988-05-31 | Magnetic Peripherals, Inc. | Disk cover collar |
US4511038A (en) | 1984-01-30 | 1985-04-16 | Ekc Technology, Inc. | Container for masks and pellicles |
JPH02150046A (ja) * | 1988-12-01 | 1990-06-08 | Sumitomo Electric Ind Ltd | 半導体矩形ウエハの収納容器 |
JP2978192B2 (ja) * | 1990-02-19 | 1999-11-15 | 株式会社ピュアレックス | 半導体ウエハー試料作成法 |
JPH0494736U (de) * | 1991-01-09 | 1992-08-17 | ||
US5184723A (en) | 1991-05-14 | 1993-02-09 | Fluoroware, Inc. | Single wafer robotic package |
JP3089590B2 (ja) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | 板状物収納容器およびその蓋開口装置 |
JPH05109879A (ja) * | 1991-10-21 | 1993-04-30 | Seiko Epson Corp | 導電性収納容器及び搬送容器 |
JP3200776B2 (ja) * | 1992-08-06 | 2001-08-20 | 大日本印刷株式会社 | 基板保持用ケース |
JPH06204328A (ja) * | 1992-12-25 | 1994-07-22 | Mitsubishi Materials Corp | ウェーハケース |
JPH07201948A (ja) * | 1993-12-29 | 1995-08-04 | Dainippon Screen Mfg Co Ltd | 基板搬送治具 |
JP3193567B2 (ja) * | 1994-04-27 | 2001-07-30 | キヤノン株式会社 | 基板収容容器 |
JPH07302834A (ja) * | 1994-05-09 | 1995-11-14 | Hitachi Cable Ltd | ウエハトレイ |
GB2291640B (en) * | 1994-11-03 | 1996-07-24 | Dubois Plc | Apparatus for holding a compact disk |
JPH08191101A (ja) * | 1995-01-06 | 1996-07-23 | Hitachi Cable Ltd | 半導体基板収納容器 |
JP2910684B2 (ja) | 1996-07-31 | 1999-06-23 | 日本電気株式会社 | ウエハー容器 |
JPH11255332A (ja) * | 1998-03-10 | 1999-09-21 | Sigma Meltec Kk | 基板収納ケース |
US6193068B1 (en) * | 1998-05-07 | 2001-02-27 | Texas Instruments Incorporated | Containment device for retaining semiconductor wafers |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
JP4357048B2 (ja) * | 1999-10-04 | 2009-11-04 | 信越ポリマー株式会社 | 精密基板収納容器 |
US6837374B2 (en) * | 2001-07-15 | 2005-01-04 | Entegris, Inc. | 300MM single stackable film frame carrier |
JP2004311779A (ja) * | 2003-04-08 | 2004-11-04 | Shin Etsu Polymer Co Ltd | 半導体ウェーハ収納容器及び半導体ウェーハの搬送方法 |
US7578392B2 (en) | 2003-06-06 | 2009-08-25 | Convey Incorporated | Integrated circuit wafer packaging system and method |
DE602005027053D1 (de) * | 2004-01-14 | 2011-05-05 | Spyder Navigations Llc | Tragebehälter für kompakt-medien |
US20060000747A1 (en) * | 2004-06-30 | 2006-01-05 | 3M Innovative Properties Company | Shipping container for integrated circuit wafers |
-
2005
- 2005-05-25 JP JP2005152828A patent/JP4644035B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-09 KR KR1020060041316A patent/KR101258419B1/ko not_active IP Right Cessation
- 2006-05-11 US US11/431,578 patent/US7624870B2/en not_active Expired - Fee Related
- 2006-05-17 EP EP06010190A patent/EP1727193B1/de not_active Expired - Fee Related
- 2006-05-17 DE DE602006020520T patent/DE602006020520D1/de active Active
- 2006-05-19 TW TW095117825A patent/TWI393208B/zh not_active IP Right Cessation
- 2006-05-22 CN CN2006100782907A patent/CN1868830B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1868830B (zh) | 2012-02-15 |
KR101258419B1 (ko) | 2013-04-26 |
JP2006332278A (ja) | 2006-12-07 |
EP1727193A3 (de) | 2008-12-10 |
EP1727193B1 (de) | 2011-03-09 |
TW200709328A (en) | 2007-03-01 |
CN1868830A (zh) | 2006-11-29 |
TWI393208B (zh) | 2013-04-11 |
EP1727193A2 (de) | 2006-11-29 |
JP4644035B2 (ja) | 2011-03-02 |
KR20060121680A (ko) | 2006-11-29 |
US7624870B2 (en) | 2009-12-01 |
US20060283772A1 (en) | 2006-12-21 |
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