DE602005024340D1 - Vorrichtung und Verfahren zur Übertragung eines Musters - Google Patents

Vorrichtung und Verfahren zur Übertragung eines Musters

Info

Publication number
DE602005024340D1
DE602005024340D1 DE602005024340T DE602005024340T DE602005024340D1 DE 602005024340 D1 DE602005024340 D1 DE 602005024340D1 DE 602005024340 T DE602005024340 T DE 602005024340T DE 602005024340 T DE602005024340 T DE 602005024340T DE 602005024340 D1 DE602005024340 D1 DE 602005024340D1
Authority
DE
Germany
Prior art keywords
transferring
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005024340T
Other languages
English (en)
Inventor
Eigo Kawakami
Hirohisa Ota
Takashi Nakamura
Kazuyuki Kasumi
Toshinobu Tokita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE602005024340D1 publication Critical patent/DE602005024340D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
DE602005024340T 2004-06-11 2005-06-07 Vorrichtung und Verfahren zur Übertragung eines Musters Active DE602005024340D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004173317A JP4574240B2 (ja) 2004-06-11 2004-06-11 加工装置、加工方法、デバイス製造方法

Publications (1)

Publication Number Publication Date
DE602005024340D1 true DE602005024340D1 (de) 2010-12-09

Family

ID=34978721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005024340T Active DE602005024340D1 (de) 2004-06-11 2005-06-07 Vorrichtung und Verfahren zur Übertragung eines Musters

Country Status (4)

Country Link
US (1) US7789647B2 (de)
EP (1) EP1605308B1 (de)
JP (1) JP4574240B2 (de)
DE (1) DE602005024340D1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4290177B2 (ja) * 2005-06-08 2009-07-01 キヤノン株式会社 モールド、アライメント方法、パターン形成装置、パターン転写装置、及びチップの製造方法
JP4533358B2 (ja) * 2005-10-18 2010-09-01 キヤノン株式会社 インプリント方法、インプリント装置およびチップの製造方法
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
JP4795300B2 (ja) * 2006-04-18 2011-10-19 キヤノン株式会社 位置合わせ方法、インプリント方法、位置合わせ装置、インプリント装置、及び位置計測方法
KR101261606B1 (ko) * 2006-05-09 2013-05-09 삼성디스플레이 주식회사 표시판의 제조 장치 및 제조 방법
JP4854383B2 (ja) * 2006-05-15 2012-01-18 アピックヤマダ株式会社 インプリント方法およびナノ・インプリント装置
KR100774327B1 (ko) * 2006-06-07 2007-11-08 현대자동차주식회사 트랜스퍼 프레스 장치 및 그 작동방법
JP4506987B2 (ja) * 2006-07-21 2010-07-21 株式会社日立ハイテクノロジーズ エネルギ線硬化型樹脂の転写方法、転写装置及びディスクまたは半導体デバイス
JP5007091B2 (ja) * 2006-09-21 2012-08-22 東芝機械株式会社 転写装置
TWI396617B (zh) * 2006-09-29 2013-05-21 Toray Industries 微細形狀轉印片之製法及製造裝置
JP4989234B2 (ja) * 2007-01-09 2012-08-01 東芝機械株式会社 転写装置
US8945444B2 (en) 2007-12-04 2015-02-03 Canon Nanotechnologies, Inc. High throughput imprint based on contact line motion tracking control
JP5150309B2 (ja) * 2008-03-03 2013-02-20 東芝機械株式会社 転写装置および転写方法
JP5666082B2 (ja) * 2008-05-30 2015-02-12 東芝機械株式会社 転写装置およびプレス装置
TWI342270B (en) * 2008-07-15 2011-05-21 Univ Nat Taiwan Specific-light-cured and pressure-differential embossing apparatus
JP5517423B2 (ja) * 2008-08-26 2014-06-11 キヤノン株式会社 インプリント装置及びインプリント方法
WO2010082686A1 (ja) * 2009-01-19 2010-07-22 新日本製鐵株式会社 真空圧空成形露光装置及び露光方法
WO2010089867A1 (ja) * 2009-02-05 2010-08-12 パイオニア株式会社 転写装置および転写方法
JP5379564B2 (ja) * 2009-06-01 2013-12-25 キヤノン株式会社 インプリント装置、および物品の製造方法
NL2004735A (en) * 2009-07-06 2011-01-10 Asml Netherlands Bv Imprint lithography apparatus and method.
EP2287666B1 (de) * 2009-08-22 2012-06-27 EV Group E. Thallner GmbH Vorrichtung zum Prägen von Substraten
JP2011146447A (ja) * 2010-01-12 2011-07-28 Canon Inc インプリント装置及び物品の製造方法
US8747092B2 (en) 2010-01-22 2014-06-10 Nanonex Corporation Fast nanoimprinting apparatus using deformale mold
JP5351069B2 (ja) 2010-02-08 2013-11-27 株式会社東芝 インプリント方法及びインプリント装置
JP5337114B2 (ja) * 2010-07-30 2013-11-06 株式会社東芝 パタン形成方法
JP2013538447A (ja) 2010-08-05 2013-10-10 エーエスエムエル ネザーランズ ビー．ブイ． インプリントリソグラフィ
JP2012182384A (ja) * 2011-03-02 2012-09-20 Toshiba Corp テンプレート用の基板の処理装置及びテンプレート用の基板の処理方法
JP5769451B2 (ja) * 2011-03-07 2015-08-26 キヤノン株式会社 インプリント装置および物品の製造方法
JP5864929B2 (ja) * 2011-07-15 2016-02-17 キヤノン株式会社 インプリント装置および物品の製造方法
KR20130063233A (ko) * 2011-12-06 2013-06-14 삼성전자주식회사 나노 임프린트 리소그래피 장치 및 방법
US20140205702A1 (en) * 2013-01-24 2014-07-24 Kabushiki Kaisha Toshiba Template, manufacturing method of the template, and position measuring method in the template
US20140209567A1 (en) * 2013-01-29 2014-07-31 Kabushiki Kaisha Toshiba Template, manufacturing method of the template, and strain measuring method in the template
KR101345750B1 (ko) 2013-02-27 2013-12-27 (주)에이피앤 나노 전자소자 제조방법
US10105883B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation Imprint lithography system and method for manufacturing
US10108086B2 (en) 2013-03-15 2018-10-23 Nanonex Corporation System and methods of mold/substrate separation for imprint lithography
DE102013207243B4 (de) * 2013-04-22 2019-10-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur herstellung einer struktur aus aushärtbarem material durch abformung
JP6282069B2 (ja) * 2013-09-13 2018-02-21 キヤノン株式会社 インプリント装置、インプリント方法、検出方法及びデバイス製造方法
JP6674218B2 (ja) * 2014-12-09 2020-04-01 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
US10747106B2 (en) 2014-12-09 2020-08-18 Canon Kabushiki Kaisha Imprint apparatus
WO2017217931A1 (en) * 2016-06-15 2017-12-21 Semiconductor Technologies And Instruments Pte Ltd Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations
JP6768409B2 (ja) * 2016-08-24 2020-10-14 キヤノン株式会社 インプリント装置、及び物品製造方法
US10991582B2 (en) * 2016-12-21 2021-04-27 Canon Kabushiki Kaisha Template for imprint lithography including a recession, an apparatus of using the template, and a method of fabricating an article
JP7410616B2 (ja) * 2019-09-24 2024-01-10 キヤノン株式会社 平坦化装置、物品の製造方法、平坦化方法及びインプリント装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375868A (en) * 1976-12-17 1978-07-05 Nec Corp Exposure device permitting observation of contact state between mask and specimen wafer
US5804017A (en) * 1995-07-27 1998-09-08 Imation Corp. Method and apparatus for making an optical information record
US6482742B1 (en) * 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
EP1072954A3 (de) * 1999-07-28 2002-05-22 Lucent Technologies Inc. Lithographisches Verfahren
US6873087B1 (en) * 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
SE515607C2 (sv) * 1999-12-10 2001-09-10 Obducat Ab Anordning och metod vid tillverkning av strukturer
CN100504598C (zh) * 2000-07-16 2009-06-24 得克萨斯州大学系统董事会 用于平版印刷工艺中的高分辨率重叠对齐方法和系统
US7211214B2 (en) * 2000-07-18 2007-05-01 Princeton University Laser assisted direct imprint lithography
EP2306242A3 (de) * 2000-10-12 2011-11-02 Board of Regents, The University of Texas System Verfahren zur Erzeugung eines Motifs auf einem Substrat
ATE549743T1 (de) * 2002-11-13 2012-03-15 Molecular Imprints Inc Ein lithographiesystem mit einem halterungssystem
US6871558B2 (en) * 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
TW568349U (en) * 2003-05-02 2003-12-21 Ind Tech Res Inst Parallelism adjusting device for nano-transferring
US6805054B1 (en) * 2003-05-14 2004-10-19 Molecular Imprints, Inc. Method, system and holder for transferring templates during imprint lithography processes
JP4455092B2 (ja) * 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法
KR100558754B1 (ko) * 2004-02-24 2006-03-10 한국기계연구원 Ｕｖ 나노임프린트 리소그래피 공정 및 이 공정을수행하는 장치
US7168939B2 (en) * 2004-02-26 2007-01-30 Hitachi Global Storage Technologies Netherlands Bv System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
US20050270516A1 (en) * 2004-06-03 2005-12-08 Molecular Imprints, Inc. System for magnification and distortion correction during nano-scale manufacturing

Also Published As

Publication number Publication date
US20050275125A1 (en) 2005-12-15
EP1605308A2 (de) 2005-12-14
JP4574240B2 (ja) 2010-11-04
EP1605308A3 (de) 2007-08-29
US7789647B2 (en) 2010-09-07
EP1605308A8 (de) 2006-03-01
JP2005353858A (ja) 2005-12-22
EP1605308B1 (de) 2010-10-27

Similar Documents

Publication Publication Date Title
DE602005024340D1 (de) Vorrichtung und Verfahren zur Übertragung eines Musters
DE602005012917D1 (de) Verfahren und Vorrichtung zum Umformen
DE602006014341D1 (de) Vorrichtung und Verfahren zur Immersionslithographie
DE602005009452D1 (de) Verfahren zum Erstellung eines "Data-processing-Objects" zur Geräteüberwachung
DE502005000295D1 (de) Vorrichtung und Verfahren zur Bereitstellung eines feinen Ölnebels
DE502007006284D1 (de) Vorrichtung und Verfahren zur Umrüstung eines Druckers
DE602004029662D1 (de) Radargerät und Verfahren zur Steuerung eines Radargeräts
DE602006001507D1 (de) Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
DE602006008698D1 (de) Verfahren und Vorrichtung zur Behandlung eines Teiles
DE502005001655D1 (de) Vorrichtung und Verfahren zum Montieren eines Reifens
DE602005023925D1 (de) Verfahren zur Herstellung eines Musters und eines leitfähigen Musters
DE112006001803A5 (de) Verfahren und Vorrichtung zur Positionierung eines Bauelementes
DE112006001567A5 (de) Verfahren und Vorrichtung zur Positionierung eines Bauelementes
DE602007012633D1 (de) Lithographische Vorrichtung und Verfahren
DE502005004527D1 (de) Verfahren und vorrichtung zur anbringung eines befein blechteil
DE602006000922D1 (de) Vorrichtung und Verfahren zur Prüfung einer RAM
DE602005018866D1 (de) Vorrichtung und Verfahren zur Steuerung eines Anzeigesystems
DE602005026600D1 (de) Verfahren und Vorrichtung zur Bilderzeugung
DE602004032505D1 (de) Vorrichtung und Verfahren zur Erfassung einer Drehbewegung
DE602006013558D1 (de) Vorrichtung und Verfahren zur Bilderzeugung
DE112005002211A5 (de) Vorrichtung und Verfahren zum Ablegen eines Spinnkabels
DE602005020277D1 (de) Verfahren und vorrichtung zum formen einer wulst
DE602005024030D1 (de) Verfahren und vorrichtung zum aufwickeln eines bandes
DE602006009118D1 (de) Verfahren und vorrichtung zum charakterisieren eines analog/digital-umsetzers
DE602006001064D1 (de) Verfahren und Vorrichtung zur Bilderzeugung mit effektiver Positionierung eines Stützelements