DE602006014341D1 - Vorrichtung und Verfahren zur Immersionslithographie - Google Patents

Vorrichtung und Verfahren zur Immersionslithographie

Info

Publication number
DE602006014341D1
DE602006014341D1 DE602006014341T DE602006014341T DE602006014341D1 DE 602006014341 D1 DE602006014341 D1 DE 602006014341D1 DE 602006014341 T DE602006014341 T DE 602006014341T DE 602006014341 T DE602006014341 T DE 602006014341T DE 602006014341 D1 DE602006014341 D1 DE 602006014341D1
Authority
DE
Germany
Prior art keywords
immersion lithography
lithography
immersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006014341T
Other languages
English (en)
Inventor
Ching-Yu Chang
Chin-Hsiang Lin
Burn Jeng Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical Taiwan Semiconductor Manufacturing Co TSMC Ltd
Publication of DE602006014341D1 publication Critical patent/DE602006014341D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE602006014341T 2005-10-24 2006-10-23 Vorrichtung und Verfahren zur Immersionslithographie Active DE602006014341D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72956505P 2005-10-24 2005-10-24
US11/427,421 US7986395B2 (en) 2005-10-24 2006-06-29 Immersion lithography apparatus and methods

Publications (1)

Publication Number Publication Date
DE602006014341D1 true DE602006014341D1 (de) 2010-07-01

Family

ID=37726774

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006014341T Active DE602006014341D1 (de) 2005-10-24 2006-10-23 Vorrichtung und Verfahren zur Immersionslithographie

Country Status (7)

Country Link
US (1) US7986395B2 (de)
EP (1) EP1777589B1 (de)
JP (1) JP4532455B2 (de)
KR (1) KR100823664B1 (de)
DE (1) DE602006014341D1 (de)
SG (2) SG131829A1 (de)
TW (1) TWI342987B (de)

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JP5151981B2 (ja) * 2006-08-30 2013-02-27 株式会社ニコン 露光装置及びデバイス製造方法
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KR20140097574A (ko) 2007-11-06 2014-08-06 칼 짜이스 에스엠티 게엠베하 광학면으로부터 오염층을 제거하는 방법, 세정 가스를 생성하는 방법 및 대응하는 세정 및 세정 가스 생성 장치들
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Also Published As

Publication number Publication date
SG174047A1 (en) 2011-09-29
US7986395B2 (en) 2011-07-26
KR20070044377A (ko) 2007-04-27
SG131829A1 (en) 2007-05-28
TWI342987B (en) 2011-06-01
JP2007123882A (ja) 2007-05-17
EP1777589A2 (de) 2007-04-25
EP1777589B1 (de) 2010-05-19
KR100823664B1 (ko) 2008-04-18
JP4532455B2 (ja) 2010-08-25
EP1777589A3 (de) 2007-11-21
US20070091287A1 (en) 2007-04-26
TW200717196A (en) 2007-05-01

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