DE602005018433D1 - Licht emittierendes Bauelement und seine Herstellung - Google Patents

Licht emittierendes Bauelement und seine Herstellung

Info

Publication number
DE602005018433D1
DE602005018433D1 DE602005018433T DE602005018433T DE602005018433D1 DE 602005018433 D1 DE602005018433 D1 DE 602005018433D1 DE 602005018433 T DE602005018433 T DE 602005018433T DE 602005018433 T DE602005018433 T DE 602005018433T DE 602005018433 D1 DE602005018433 D1 DE 602005018433D1
Authority
DE
Germany
Prior art keywords
present
light emitting
emitting device
devices
occurrence rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005018433T
Other languages
English (en)
Inventor
Hyun Jae Lee
Jun Seok Ha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of DE602005018433D1 publication Critical patent/DE602005018433D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Semiconductor Lasers (AREA)
DE602005018433T 2004-11-08 2005-10-26 Licht emittierendes Bauelement und seine Herstellung Active DE602005018433D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040090456A KR100667508B1 (ko) 2004-11-08 2004-11-08 발광 소자 및 그의 제조방법

Publications (1)

Publication Number Publication Date
DE602005018433D1 true DE602005018433D1 (de) 2010-02-04

Family

ID=35871084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005018433T Active DE602005018433D1 (de) 2004-11-08 2005-10-26 Licht emittierendes Bauelement und seine Herstellung

Country Status (7)

Country Link
US (1) US8053795B2 (de)
EP (1) EP1662587B1 (de)
JP (1) JP4565391B2 (de)
KR (1) KR100667508B1 (de)
CN (1) CN1790757A (de)
AT (1) ATE453214T1 (de)
DE (1) DE602005018433D1 (de)

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DE602006008256D1 (de) * 2005-12-15 2009-09-17 Lg Electronics Inc LED mit vertikaler Struktur und deren Herstellungsverfahren
JP5091233B2 (ja) 2006-06-23 2012-12-05 エルジー エレクトロニクス インコーポレイティド 垂直型発光素子及びその製造方法
JP4302720B2 (ja) * 2006-06-28 2009-07-29 株式会社沖データ 半導体装置、ｌｅｄヘッド及び画像形成装置
KR100851403B1 (ko) 2006-07-31 2008-08-08 삼성전자주식회사 발광 소자 및 발광 소자의 제조방법
KR101430587B1 (ko) * 2006-09-20 2014-08-14 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들
KR100867541B1 (ko) * 2006-11-14 2008-11-06 삼성전기주식회사 수직형 발광 소자의 제조 방법
JP4910664B2 (ja) * 2006-11-30 2012-04-04 豊田合成株式会社 Ｉｉｉ−ｖ族半導体素子の製造方法
US7781241B2 (en) 2006-11-30 2010-08-24 Toyoda Gosei Co., Ltd. Group III-V semiconductor device and method for producing the same
JP4290745B2 (ja) 2007-03-16 2009-07-08 豊田合成株式会社 Ｉｉｉ−ｖ族半導体素子の製造方法
KR100856230B1 (ko) * 2007-03-21 2008-09-03 삼성전기주식회사 발광장치, 발광장치의 제조방법 및 모놀리식 발광다이오드어레이
DE102007030129A1 (de) 2007-06-29 2009-01-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement
GB0721957D0 (en) 2007-11-08 2007-12-19 Photonstar Led Ltd Ultra high thermal performance packaging for optoelectronics devices
SG153673A1 (en) 2007-12-10 2009-07-29 Tinggi Tech Private Ltd Fabrication of semiconductor devices
JP2009231595A (ja) 2008-03-24 2009-10-08 Oki Data Corp 半導体素子製造方法
KR100902150B1 (ko) * 2008-09-23 2009-06-10 (주)큐엠씨 발광소자의 제조를 위한 장치 및 방법
KR101064081B1 (ko) * 2008-12-29 2011-09-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100934636B1 (ko) * 2009-02-27 2009-12-31 한빔 주식회사 발광다이오드 소자의 제조방법 및 그의 제조 중간체
CN102054905A (zh) * 2009-10-29 2011-05-11 展晶科技(深圳)有限公司 具有导热层的发光二极管芯片
JP5349260B2 (ja) * 2009-11-19 2013-11-20 株式会社東芝 半導体発光装置及びその製造方法
WO2011069242A1 (en) * 2009-12-09 2011-06-16 Cooledge Lighting Inc. Semiconductor dice transfer-enabling apparatus and method for manufacturing transfer-enabling apparatus
US20110151588A1 (en) * 2009-12-17 2011-06-23 Cooledge Lighting, Inc. Method and magnetic transfer stamp for transferring semiconductor dice using magnetic transfer printing techniques
US8334152B2 (en) 2009-12-18 2012-12-18 Cooledge Lighting, Inc. Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate
KR101028277B1 (ko) * 2010-05-25 2011-04-11 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 라이트 유닛
CN102544251B (zh) * 2010-12-27 2014-05-07 同方光电科技有限公司 一种大功率垂直发光二极管的制造方法
DE102011104515A1 (de) * 2011-06-17 2012-12-20 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Mehrzahl von optoelektronischen Halbleiterchips
TW201318223A (zh) * 2011-10-27 2013-05-01 Ritedia Corp 具有氮化鋁層之發光二極體、包含其之晶片在電路載板上封裝結構、及其製備方法
CN103117334B (zh) * 2011-11-17 2015-05-06 山东浪潮华光光电子股份有限公司 一种垂直结构GaN基发光二极管芯片及其制作方法
WO2013084155A1 (en) * 2011-12-08 2013-06-13 Koninklijke Philips Electronics N.V. Forming thick metal layers on a semiconductor light emitting device
KR101945791B1 (ko) 2012-03-14 2019-02-11 삼성전자주식회사 반도체 발광소자의 제조방법
DE102013105870A1 (de) * 2013-06-06 2014-12-24 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
US9337078B2 (en) 2013-09-11 2016-05-10 Globalfoundries Inc. Heat dissipation through device isolation
US20150279815A1 (en) * 2014-03-28 2015-10-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Substrate Having Conductive Columns
CN106848006A (zh) * 2015-12-03 2017-06-13 映瑞光电科技(上海)有限公司 倒装led芯片及其制备方法
CN108417545B (zh) * 2018-05-14 2020-09-22 上海芯龙半导体技术股份有限公司 一种功率器件及其制备方法
KR20200026709A (ko) * 2019-08-21 2020-03-11 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치 및 이의 제조방법
CN111679454B (zh) * 2020-06-19 2023-07-07 联合微电子中心有限责任公司 半导体器件的制备方法
CN112447863B (zh) * 2020-11-20 2022-06-14 横店集团东磁股份有限公司 一种太阳能电池及其制备方法

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JP3365787B2 (ja) * 1992-06-18 2003-01-14 シャープ株式会社 Ｌｅｄチップ実装部品
KR100660152B1 (ko) * 1997-01-09 2006-12-21 니치아 카가쿠 고교 가부시키가이샤 질화물반도체소자
US20010042866A1 (en) * 1999-02-05 2001-11-22 Carrie Carter Coman Inxalygazn optical emitters fabricated via substrate removal
DE10040448A1 (de) * 2000-08-18 2002-03-07 Osram Opto Semiconductors Gmbh Halbleiterchip und Verfahren zu dessen Herstellung
US6657237B2 (en) * 2000-12-18 2003-12-02 Samsung Electro-Mechanics Co., Ltd. GaN based group III-V nitride semiconductor light-emitting diode and method for fabricating the same
US6555405B2 (en) * 2001-03-22 2003-04-29 Uni Light Technology, Inc. Method for forming a semiconductor device having a metal substrate
US8294172B2 (en) * 2002-04-09 2012-10-23 Lg Electronics Inc. Method of fabricating vertical devices using a metal support film
US20030189215A1 (en) * 2002-04-09 2003-10-09 Jong-Lam Lee Method of fabricating vertical structure leds
KR101030068B1 (ko) * 2002-07-08 2011-04-19 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자
EP1553640A4 (de) * 2002-08-01 2006-09-06 Nichia Corp Halbleiter-lichtemissionsbauelement, verfahren zu seiner herstellung und lichtemissionsvorrichtung damit
TWI228323B (en) * 2002-09-06 2005-02-21 Sony Corp Semiconductor light emitting device and its manufacturing method, integrated semiconductor light emitting device and manufacturing method thereof, image display device and its manufacturing method, illumination device and manufacturing method thereof
DE10245631B4 (de) * 2002-09-30 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement
JP4143732B2 (ja) * 2002-10-16 2008-09-03 スタンレー電気株式会社 車載用波長変換素子
US7244628B2 (en) * 2003-05-22 2007-07-17 Matsushita Electric Industrial Co., Ltd. Method for fabricating semiconductor devices
JP2005268642A (ja) * 2004-03-19 2005-09-29 Uni Light Technology Inc 金属ベースを有する発光ダイオードの形成方法

Also Published As

Publication number Publication date
ATE453214T1 (de) 2010-01-15
EP1662587B1 (de) 2009-12-23
EP1662587A3 (de) 2007-08-29
EP1662587A2 (de) 2006-05-31
US8053795B2 (en) 2011-11-08
KR20060041383A (ko) 2006-05-12
JP2006135321A (ja) 2006-05-25
CN1790757A (zh) 2006-06-21
US20060097274A1 (en) 2006-05-11
KR100667508B1 (ko) 2007-01-10
JP4565391B2 (ja) 2010-10-20

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