DE602004003988T2 - Flüssiges Renigungsmittel für Halbleiter - Google Patents

Flüssiges Renigungsmittel für Halbleiter Download PDF

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Publication number
DE602004003988T2
DE602004003988T2 DE602004003988T DE602004003988T DE602004003988T2 DE 602004003988 T2 DE602004003988 T2 DE 602004003988T2 DE 602004003988 T DE602004003988 T DE 602004003988T DE 602004003988 T DE602004003988 T DE 602004003988T DE 602004003988 T2 DE602004003988 T2 DE 602004003988T2
Authority
DE
Germany
Prior art keywords
group
cleaning
composition
semiconductor substrate
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004003988T
Other languages
German (de)
English (en)
Other versions
DE602004003988D1 (de
Inventor
Yumiko Abe
Norio Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanto Chemical Co Inc
Original Assignee
Kanto Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Chemical Co Inc filed Critical Kanto Chemical Co Inc
Publication of DE602004003988D1 publication Critical patent/DE602004003988D1/de
Application granted granted Critical
Publication of DE602004003988T2 publication Critical patent/DE602004003988T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/58—Cleaning of porous materials
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
DE602004003988T 2003-04-09 2004-04-06 Flüssiges Renigungsmittel für Halbleiter Expired - Lifetime DE602004003988T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003105728 2003-04-09
JP2003105728A JP4375991B2 (ja) 2003-04-09 2003-04-09 半導体基板洗浄液組成物

Publications (2)

Publication Number Publication Date
DE602004003988D1 DE602004003988D1 (de) 2007-02-15
DE602004003988T2 true DE602004003988T2 (de) 2007-06-21

Family

ID=32866753

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004003988T Expired - Lifetime DE602004003988T2 (de) 2003-04-09 2004-04-06 Flüssiges Renigungsmittel für Halbleiter

Country Status (7)

Country Link
US (1) US7503982B2 (https=)
EP (1) EP1466963B1 (https=)
JP (1) JP4375991B2 (https=)
KR (1) KR101005925B1 (https=)
CN (1) CN100513544C (https=)
DE (1) DE602004003988T2 (https=)
TW (1) TWI356095B (https=)

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CN1938885B (zh) 2004-03-30 2010-12-08 小山升 氧化还原活性可逆电极和使用该电极的二次电池
KR101232249B1 (ko) * 2004-08-10 2013-02-12 간또 가가꾸 가부시끼가이샤 반도체 기판 세정액 및 반도체 기판 세정방법
US7208325B2 (en) * 2005-01-18 2007-04-24 Applied Materials, Inc. Refreshing wafers having low-k dielectric materials
JP4876215B2 (ja) * 2005-01-21 2012-02-15 独立行政法人産業技術総合研究所 Ｃｍｐ研磨方法、ｃｍｐ研磨装置、及び半導体デバイスの製造方法
KR100630737B1 (ko) * 2005-02-04 2006-10-02 삼성전자주식회사 금속 ｃｍｐ 후 세정액 및 이를 이용한 반도체 소자의금속 배선 형성 방법
US9058975B2 (en) * 2006-06-09 2015-06-16 Lam Research Corporation Cleaning solution formulations for substrates
US8623236B2 (en) * 2007-07-13 2014-01-07 Tokyo Ohka Kogyo Co., Ltd. Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film
JP5561914B2 (ja) * 2008-05-16 2014-07-30 関東化学株式会社 半導体基板洗浄液組成物
JP5515588B2 (ja) * 2009-10-05 2014-06-11 栗田工業株式会社 ウエハ用洗浄水及びウエハの洗浄方法
US8128755B2 (en) 2010-03-03 2012-03-06 L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Cleaning solvent and cleaning method for metallic compound
JP5630385B2 (ja) * 2010-06-30 2014-11-26 セントラル硝子株式会社 保護膜形成用薬液及びウェハ表面の洗浄方法
JP2012017420A (ja) * 2010-07-08 2012-01-26 Neos Co Ltd 水溶性洗浄剤組成物
JP2012058273A (ja) * 2010-09-03 2012-03-22 Kanto Chem Co Inc フォトレジスト残渣およびポリマー残渣除去液組成物
JP5671962B2 (ja) * 2010-11-15 2015-02-18 栗田工業株式会社 シリコンウェハ洗浄用リンス液調製方法
JP2014210690A (ja) * 2013-04-22 2014-11-13 住友電気工業株式会社 炭化珪素基板の製造方法
CN108611199A (zh) * 2016-12-09 2018-10-02 段钰 一种高效强力清洗剂及其环保清洗工艺
CN110178204B (zh) 2017-01-17 2022-11-04 株式会社大赛璐 半导体基板清洗剂
CN109037025A (zh) * 2017-06-08 2018-12-18 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法

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CH122023A (de) 1926-12-27 1927-08-16 Richter Gutzwiller & Cie Verfahren zur Herstellung einer Parkettreinigungsmasse.
DE2155849C3 (de) * 1971-11-10 1979-07-26 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Verfahren zur Herstellung eines stabilisierenden und/oder isolierenden Überzuges auf Halbleiteroberflächen
JPS5832669A (ja) * 1981-08-22 1983-02-25 Mitsubishi Pencil Co Ltd インク消去液
JPH02310092A (ja) * 1989-05-25 1990-12-25 Toyo Ink Mfg Co Ltd 平版印刷用湿し水組成物
US5503681A (en) * 1990-03-16 1996-04-02 Kabushiki Kaisha Toshiba Method of cleaning an object
US6825156B2 (en) * 2002-06-06 2004-11-30 Ekc Technology, Inc. Semiconductor process residue removal composition and process
US7144848B2 (en) * 1992-07-09 2006-12-05 Ekc Technology, Inc. Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal
US6640816B2 (en) * 1999-01-22 2003-11-04 Micron Technology, Inc. Method for post chemical-mechanical planarization cleaning of semiconductor wafers
US6410494B2 (en) 1996-06-05 2002-06-25 Wako Pure Chemical Industries, Ltd. Cleaning agent
TW416987B (en) 1996-06-05 2001-01-01 Wako Pure Chem Ind Ltd A composition for cleaning the semiconductor substrate surface
JP3219020B2 (ja) 1996-06-05 2001-10-15 和光純薬工業株式会社 洗浄処理剤
EP0839898A1 (en) * 1996-11-04 1998-05-06 The Procter & Gamble Company Self-thickened cleaning compositions
JP3165801B2 (ja) 1997-08-12 2001-05-14 関東化学株式会社 洗浄液
TW387936B (en) 1997-08-12 2000-04-21 Kanto Kagaku Washing solution
EP1080169A1 (en) * 1998-05-22 2001-03-07 The Procter & Gamble Company Acidic cleaning compositions with c10 alkyl sulfate detergent surfactant
US5928435A (en) * 1998-11-11 1999-07-27 Enthone-Omi, Inc. Method for removing organic coatings from substrates using carboxylic acids, organic solvents, and corrosion inhibitors
TW574634B (en) 1998-11-13 2004-02-01 Kao Corp Stripping composition for resist
JP3474127B2 (ja) 1998-11-13 2003-12-08 花王株式会社 剥離剤組成物
JP4516176B2 (ja) * 1999-04-20 2010-08-04 関東化学株式会社 電子材料用基板洗浄液
AU6530000A (en) 1999-08-19 2001-03-19 Ashland Inc. Stripping and cleaning compositions
JP2002041393A (ja) 2000-07-21 2002-02-08 Nippon Telegr & Teleph Corp <Ntt> 通信ネットワークシステムを用いた情報配信方法
DE60124473T2 (de) * 2000-09-08 2007-09-06 Kanto Kagaku K.K. Ätzflüssigkeitszusammensetzung
US6699825B2 (en) * 2001-01-12 2004-03-02 S.C. Johnson & Son, Inc. Acidic hard-surface antimicrobial cleaner
TWI297102B (en) 2001-08-03 2008-05-21 Nec Electronics Corp Removing composition
WO2003065433A1 (fr) 2002-01-28 2003-08-07 Mitsubishi Chemical Corporation Detergent liquide pour substrat de dispositif semi-conducteur et procede de nettoyage
TWI339680B (en) * 2002-02-19 2011-04-01 Kanto Kagaku Washing liquid composition for semiconductor substrate
US7098181B2 (en) 2002-05-22 2006-08-29 Kao Corporation Liquid detergent composition
JP2005535784A (ja) * 2002-08-19 2005-11-24 伊默克化學科技股▲ふん▼有限公司 清浄液
JP4170710B2 (ja) 2002-09-02 2008-10-22 花王株式会社 剥離剤組成物
US6696399B1 (en) * 2002-10-15 2004-02-24 Cleaning Systems, Inc. Cleaning composition

Also Published As

Publication number Publication date
US7503982B2 (en) 2009-03-17
JP4375991B2 (ja) 2009-12-02
US20040204329A1 (en) 2004-10-14
EP1466963B1 (en) 2007-01-03
TWI356095B (en) 2012-01-11
JP2004307725A (ja) 2004-11-04
DE602004003988D1 (de) 2007-02-15
EP1466963A1 (en) 2004-10-13
CN100513544C (zh) 2009-07-15
KR101005925B1 (ko) 2011-01-06
CN1542110A (zh) 2004-11-03
KR20040087893A (ko) 2004-10-15
TW200502381A (en) 2005-01-16

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