DE60140841D1 - Packung für eine halbleiteranordnung von hoher leistung mit konzentrischen zuleitungen - Google Patents

Packung für eine halbleiteranordnung von hoher leistung mit konzentrischen zuleitungen

Info

Publication number
DE60140841D1
DE60140841D1 DE60140841T DE60140841T DE60140841D1 DE 60140841 D1 DE60140841 D1 DE 60140841D1 DE 60140841 T DE60140841 T DE 60140841T DE 60140841 T DE60140841 T DE 60140841T DE 60140841 D1 DE60140841 D1 DE 60140841D1
Authority
DE
Germany
Prior art keywords
concentric
package
supplies
high performance
semiconductor arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140841T
Other languages
English (en)
Inventor
Ban Poh Loh
Douglas P Woolverton
Wayne L Snyder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lumileds LLC
Original Assignee
Lumileds LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumileds LLC filed Critical Lumileds LLC
Application granted granted Critical
Publication of DE60140841D1 publication Critical patent/DE60140841D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
DE60140841T 2000-02-04 2001-01-31 Packung für eine halbleiteranordnung von hoher leistung mit konzentrischen zuleitungen Expired - Lifetime DE60140841D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/498,311 US6492725B1 (en) 2000-02-04 2000-02-04 Concentrically leaded power semiconductor device package
PCT/US2001/003270 WO2001057937A1 (en) 2000-02-04 2001-01-31 Concentrically leaded power semiconductor device package

Publications (1)

Publication Number Publication Date
DE60140841D1 true DE60140841D1 (de) 2010-02-04

Family

ID=23980514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140841T Expired - Lifetime DE60140841D1 (de) 2000-02-04 2001-01-31 Packung für eine halbleiteranordnung von hoher leistung mit konzentrischen zuleitungen

Country Status (7)

Country Link
US (2) US6492725B1 (de)
EP (1) EP1183740B1 (de)
JP (1) JP4833418B2 (de)
KR (1) KR100776060B1 (de)
AU (1) AU2001234722A1 (de)
DE (1) DE60140841D1 (de)
WO (1) WO2001057937A1 (de)

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GB2329756A (en) 1997-09-25 1999-03-31 Univ Bristol Assemblies of light emitting diodes
JP3265301B2 (ja) * 2000-06-05 2002-03-11 株式会社東芝 半導体装置とその製造方法
US7292209B2 (en) * 2000-08-07 2007-11-06 Rastar Corporation System and method of driving an array of optical elements
JP2002223007A (ja) * 2000-11-22 2002-08-09 Matsushita Electric Ind Co Ltd 光源ユニット及びこれを用いた半導体発光照明装置
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
JP4701565B2 (ja) * 2001-09-05 2011-06-15 パナソニック株式会社 光源ユニットの装着構造
KR100991827B1 (ko) * 2001-12-29 2010-11-10 항조우 후양 신잉 띠앤즈 리미티드 Ｌｅｄ 및 ｌｅｄ램프
US6573536B1 (en) * 2002-05-29 2003-06-03 Optolum, Inc. Light emitting diode light source
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
CN1678252B (zh) * 2002-07-25 2011-06-29 乔纳森·S·达姆 传输热能的器械、提供预定方向的光的装置及发光装置
WO2004038759A2 (en) 2002-08-23 2004-05-06 Dahm Jonathan S Method and apparatus for using light emitting diodes
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7775685B2 (en) * 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
DE10251955A1 (de) * 2002-11-08 2004-05-19 Hella Kg Hueck & Co. Einbaumodul mit leistungsstarker LED, insbesondere für ein Kraftfahrzeug
US6897486B2 (en) 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
DE10346855A1 (de) * 2003-08-18 2005-03-17 Robert Bosch Gmbh Einpressdiode mit versilbertem Drahtanschluss
EP1709692A1 (de) * 2004-01-29 2006-10-11 Acol Technologies S.A. Leuchtdiode mit integriertem kühlkörper
EP1596440A1 (de) * 2004-05-11 2005-11-16 Excel Cell Electronic Co., Ltd. Leuchtdiode
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
CA2589570C (en) * 2004-06-15 2010-04-13 Henkel Corporation High power led electro-optic assembly
JP2006080288A (ja) * 2004-09-09 2006-03-23 Stanley Electric Co Ltd Ｌｅｄ搭載用部品及びその製造方法
US20060146533A1 (en) * 2005-01-03 2006-07-06 Wen-Chieh Chen Illuminating device for projector
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
JP4606302B2 (ja) * 2005-01-27 2011-01-05 京セラ株式会社 発光装置
US7598600B2 (en) * 2005-03-30 2009-10-06 Stats Chippac Ltd. Stackable power semiconductor package system
US7557432B2 (en) * 2005-03-30 2009-07-07 Stats Chippac Ltd. Thermally enhanced power semiconductor package system
JP4991173B2 (ja) * 2005-04-27 2012-08-01 京セラ株式会社 発光素子搭載用基体ならびにこれを用いた発光装置
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
TWI287882B (en) * 2005-07-06 2007-10-01 Jiahn-Chang Wu Light emitting device package with single coaxial lead
WO2007018098A1 (ja) * 2005-08-05 2007-02-15 Olympus Medical Systems Corp. 発光ユニット
TWI266428B (en) * 2005-08-30 2006-11-11 Quarton Inc Semiconductor chip package and application device thereof
DE102005045729A1 (de) * 2005-09-23 2007-03-29 Karl Storz Gmbh & Co. Kg Beleuchtungssystem für endoskopische Untersuchungen
US20070096132A1 (en) * 2005-11-01 2007-05-03 Jiahn-Chang Wu Coaxial LED lighting board
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
CN101030611B (zh) * 2006-03-05 2010-05-12 浙江古越龙山电子科技发展有限公司 大功率发光二极管点胶工艺
CN100454536C (zh) * 2006-04-11 2009-01-21 方础光电科技股份有限公司 半导体芯片封装结构及其应用装置
DE102007037821A1 (de) * 2007-08-10 2009-02-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
US8492179B2 (en) * 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
WO2011035490A1 (zh) * 2009-09-27 2011-03-31 东莞市莱硕光电科技有限公司 用于三维照明的led器件
DE102009049683B4 (de) * 2009-10-19 2016-06-09 Richard Wolf Gmbh Endoskopisches Instrument
DE102013201808A1 (de) 2013-02-05 2014-08-07 Richard Wolf Gmbh LED-Beleuchtungsmodul
CN114341545A (zh) * 2019-07-08 2022-04-12 亮锐控股有限公司 用于发光元件和照明设备的支撑件
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

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Also Published As

Publication number Publication date
WO2001057937A1 (en) 2001-08-09
KR20020005640A (ko) 2002-01-17
JP2001257301A (ja) 2001-09-21
KR100776060B1 (ko) 2007-11-16
US6492725B1 (en) 2002-12-10
EP1183740B1 (de) 2009-12-23
US20030006423A1 (en) 2003-01-09
EP1183740A1 (de) 2002-03-06
JP4833418B2 (ja) 2011-12-07
AU2001234722A1 (en) 2001-08-14

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